https://www.patsnap.com/resources/blog/rd-blog/envelope-tracking-and-power-management-for-rf-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
RF Front-End Modules · Patent Landscape
Envelope Tracking and RF Power Management Patents: Who Leads and Where Filing Concentrates
  • 64.3% of all 2,111 records sit with the top five assignees alone, making this one of the more concentrated corners of RF front-end IP.
  • Filings fell 50% from 169 in 2021 to 85 in 2024, the last year the dataset treats as complete.
  • H03F amplifier claims cover 72.7% of records while power conversion (H02M) and semiconductor device claims (H01L) each sit under 4%, marking the narrower branches.
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2,111
Published Records
64%
Top-5 Share of All Records
-50%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (169 records) with 2024 (85) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 2,111 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks patent activity at the intersection of envelope tracking, average power tracking and supply modulator design, filtered to records that also address modulator bandwidth, power-added efficiency, shaping-table control, memory effect correction, thermal dissipation or battery current reduction. The scope spans 2,111 published records filed between 2015 and mid-2026, drawn primarily from US, European, PCT, UK and German filings.

The corpus centres on power amplifier and supply-modulation techniques used to keep RF front ends efficient as signal bandwidths and peak-to-average ratios climb. It is a mature filing area with a long history of contested claims around switching supply topologies and linear-plus-switching hybrids, rather than an emerging one.

Filing activity and technology composition, 2015-2026
  1. 1SKYWORKS SOLUTIONS INC853
  2. 2QORVO US INC235
  3. 3SNAPTRACK INC113
  4. 4MURATA MFG CO LTD79
  5. 5DALI SYST LTD77
  6. 6PSEMI CORP68
  7. 7TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)45
  8. 8SAMSUNG ELECTRONICS CO LTD44
  9. 9APPLE INC40
  10. 10INTEL CORP34
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Envelope Tracking and Power Management for RF covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Data

Filing trend and technology composition

Two views of the same 2,111-record corpus: filings by year, and the IPC subclasses those filings carry.

Filings by year

Filings rose from 112 in 2017 to a peak of 228 in 2022, then declined to 85 by 2024 - a 50% drop across 2021-2024. 2025 and 2026 figures are still incomplete because publication typically lags filing by around 18 months, so the recent-year dip should not be read as the field slowing.

Filings by year06312518825011220172018201920202021228202220232024202562026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass composition

H03F (amplifiers) appears on 72.7% of records and H04B (transmission, general) on 34.7%, confirming that most activity is amplifier- and link-level rather than pure power-conversion work; H02M (power conversion) and H01L (semiconductor devices) each sit near 3.8%, the narrowest bands in the set. Because records can carry multiple IPC codes, these shares sum to well over 100%.

IPC subclass compositionH03F · Amplifiers1,53472.7%H04B · Transmission (general)73334.7%H04W · Wireless communication networks2099.9%H04L · Digital information transmissi…1497.1%H03G · Gain & level control1436.8%H01Q · Antennas894.2%H02M · Power conversion (AC/DC etc.)813.8%H01L · Semiconductor devices803.8%Other47422.5%

Shares are the percentage of the 2,111 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Envelope Tracking and Power Management for RF covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Most-cited and representative filings

Representative filing
US10277177B22019-04-30

US10277177B2 - Variable load power amplifier supporting dual-mode envelope tracking and average power tracking performance

SKYWORKS SOLUTIONS, INC.

A variable load power amplifier that improves the performance of a power amplifier providing both envelope tracking (ET) and average power tracking (APT). The design includes a plurality of amplifiers each selectively connectable into one of several parallel combinations, each combination characterised by a corresponding load line, plus control elements that switch amplifiers between combinations.Assigned to Skyworks Solutions, Inc.; published 2019-04-30.

US10277177B2 — patent drawing 1US10277177B2 — patent drawing 2
View full record
Highest-cited records in scope
#Publication no.Patent titleCitations
1US20090004981A1High efficiency digital transmitter incorporating switching power supply and linear power amplifier433
2US5420536ALinearized power amplifier388
3US20200229206A1Methods and devices for wireless communications334
4US20070249304A1Radio frequency power amplifier and method using a controlled supply300
5US20150270806A1Bias Control for Stacked Transistor Configuration246
6US20140184335A1Amplifiers Operating in Envelope Tracking Mode or Non-Envelope Tracking Mode205
7US8718188B2Apparatus and methods for envelope tracking205
8US20120200354A1Apparatus and methods for envelope tracking calibration196
9US20130207731A1Apparatus and methods for envelope tracking172
10US20120269240A1Apparatus and methods for envelope tracking163

Citation counts favour older filings that have had more time to accumulate citations within the searched corpus; treat them as a measure of influence on subsequent filers, not of present-day relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Envelope Tracking and Power Management for RF covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for strategy

Three patterns stand out once the ranking, the trend and the IPC composition are read together.

Concentration
64.3% of 2,111
held by the top five assignees

Filing sits with a small, established group

The leader alone holds 853 records, and the top five combined account for 64.3% of all 2,111 records in scope. That level of concentration means a new entrant is filing directly against a small set of well-resourced incumbents rather than into open ground.

Top 10 combined reach 75.2% of records.
Momentum
-50%, 2021 to 2024
filings by the leading assignees

Recent-year filing has cooled at the top

Filings dropped from 169 in 2021 to 85 in 2024, and several of the most active assignees show year-on-year declines approaching or at -100% in the latest tracked year. That pattern is consistent across multiple leaders rather than isolated to one company, though the newest years are still filling in.

2024 is the most recent year treated as complete.
Claim geography
72.7% vs 3.8%
H03F amplifier share vs H02M/H01L share

Amplifier claims dominate; power-conversion claims are thin

H03F amplifier claims sit on nearly three-quarters of records, while power conversion (H02M) and semiconductor device (H01L) claims each cover under 4%. That gap suggests supply-modulator hardware and device-level integration are comparatively under-claimed relative to amplifier circuit topology.

Shares sum above 100% because records carry multiple IPC codes.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to envelope tracking and power management for rf, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Envelope Tracking and Power Management for RF covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the ground, and what is still open

The ranked leaders concentrate most of the corpus, but the technology composition points to specific branches with lighter claim density.

Leader
853 records
single largest assignee

One assignee holds roughly 40% of the corpus alone

The leading assignee's 853 records dwarf the fifth-place figure of 77, an order-of-magnitude gap that is unusual even for concentrated RF sub-fields. Anyone filing new envelope-tracking amplifier claims should expect this assignee's portfolio to be the first prior-art wall encountered.

Fifth place: 77 records; tenth place: 34.
Co-filing
10 co-assignee pairs
identified in the dataset

Collaboration is limited and concentrated

Only ten co-assignee pairs appear in the data, with the strongest pairing linked by 21 shared records. Most filers in this space patent independently rather than jointly, which is typical where component suppliers protect standalone IP positions.

Second-strongest pair: 8 shared records.
Geography
1,400 US filings
of the receiving-office totals

Filing is heavily US-centred with a European secondary tier

The United States accounts for 1,400 filings, well ahead of Europe (EPO, 188), WIPO/PCT (162) and the UK (113). Germany and Austria trail further behind, indicating that contested claim space is concentrated in the US market first.

Germany: 56; Austria: 47.
🔍
Under-claimed branches worth watching
Sub-areas where IPC density is comparatively light relative to the core amplifier claims.
Switching supply-modulator power conversionThermal dissipation management for ET amplifiersSemiconductor device-level integration for envelope trackersShaping-table calibration circuitryBattery current reduction control loops
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Skyworks Solutions, Inc.4-88%
Murata Manufacturing Co., Ltd.2-83%
Qorvo US, Inc.0-100%
Nujira Limited0
Dali Systems Co. Ltd.0
Telefonaktiebolaget LM Ericsson (publ)0
Samsung Electronics Co., Ltd.0-100%
Peregrine Semiconductor Corporation0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Envelope Tracking and Power Management for RF covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The landscape points to a mature, concentrated field with narrower openings around power conversion and thermal management.

Map the white space claims directly

Use the under-claimed IPC branches - power conversion, thermal dissipation, device-level integration - as a starting point for freedom-to-operate work rather than filing into the dense H03F amplifier space.

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Track the leading assignee's recent filings

Given the leader's 853-record position, monitoring its newest publications is a more efficient early-warning approach than scanning the full 2,111-record corpus.

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Re-run the trend once 2025-2026 data settles

Because publication lags filing by around 18 months, the apparent decline through 2025-2026 needs revisiting once those years are fully published before drawing conclusions about the field's direction.

Revisit this landscape in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Envelope Tracking and Power Management for RF covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on envelope tracking patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Envelope Tracking and Power Management for RF covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.