Epoxy Molding Compound Patents: Leaders, Trends & Gaps 2026
Epoxy Molding Compound Patents for Semiconductor Packages
31.8% concentration at the top. The top 5 assignees hold 132 of 415 records in scope, while a long tail of single- and few-filing entrants fills out the rest of the ranked field. Annual filings rose from 4 in 2017 to a peak of 43 in 2023, with the 2021-to-2024 span alone showing a +122% increase (18 to 40 records). The 2025 and 2026 figures are still filling in given the roughly 18-month lag between filing and publication, so a dip in the most recent one or two years should not be read as a slowdown.
- 1SAMSUNG ELECTRONICS CO LTD42
- 2STATS CHIPPAC LTD30
- 3SAMSUNG ELECTRO MECHANICS CO LTD24
- 4TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD19
- 5STATS CHIPPAC MANAGEMENT PTE LTD17
See the full epoxy molding compound for semiconductor packages analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
Who are the leading patent holders in epoxy molding compound technology?
The ranked field covers 100 companies, with one assignee holding 42 records outright and a clear step down to fifth place at 17 records and tenth place at 11. The top 5 assignees combined account for 132 of the 415 records in scope, or 31.8%, and the top 10 extend that to 194 records, or 46.7%. Beyond the top 10, filing activity spreads across a long tail of companies with far fewer records each, so a full competitive picture requires looking past the leaders alone.
Is patent filing in this space growing or slowing down?
Filing activity grew sharply through the middle of the tracked period, rising from 18 records in 2021 to 40 in 2024, a +122% increase, with a peak of 43 records in 2023. Counts for 2025 and 2026 appear lower, but that reflects the roughly 18-month lag between when a patent is filed and when it publishes, not an actual decline. Any conclusion about a slowdown should wait until those later years have had time to fully publish.
What technology areas do these patents actually cover?
Most records classify under H01L (semiconductor devices, 70.4% of the 415 records) and H10W (47.5%), reflecting that most claims describe the compound as used within a package. Smaller but meaningful shares fall under C08L polymer compositions (22.4%), C08K additive systems (16.1%), C08G condensation polymers (14.2%), H05K circuit assemblies (14.2%), H10P (8.4%) and B29C plastics shaping (6.7%). Because records often carry multiple IPC classes, these percentages add up to more than 100% of the record total and should be read individually rather than summed.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Epoxy Molding Compound for Semiconductor Packages covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.