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Run your analysis now →https://www.patsnap.com/resources/blog/rd-blog/epoxy-resin-additive-manufacturing-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Polymers & CompositesEpoxy Resin Additive Manufacturing Patent Landscape 2026
- Only 16 families total. this is a narrow, low-density claim space, not a crowded one — filing here still means occupying open ground.
- Filing peaked in 2021 at four families and the 2022 midpoint of three shows momentum flattening rather than building, ahead of the usual publication lag.
- Three of the most-cited records trace to one lab Lawrence Livermore National Security holds both the top two cited documents and the representative record.
16
Published Records
69%
Top-5 Share of All Records
-50%
Filing Growth 2021→2024
US
Leading Jurisdiction
Filing growth compares 2021 (4 records) with 2024 (2) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 16 records in scope (CR5), not by the ranked leaders only.
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview
A small, IPC-diverse field still forming its centre of gravity
Epoxy resin additive manufacturing sits at the intersection of vat photopolymerization, direct ink writing and fibre-reinforced composite chemistry. The dataset behind this page — 16 patent families published between 2015 and the 2026 cut-off — is small enough that a single well-drafted filing can still stake out meaningful ground. The technology composition is spread across eight IPC subclasses rather than concentrated in one, with B33Y (additive manufacturing) and C08L (polymer compositions) each touching more than half of the records.
That spread signals a field still being defined by chemistry as much as by process: photopolymer curing (G03F), condensation polymer backbones (C08G) and additive packages (C08K) all show up alongside the 3D-printing-specific classifications. No single assignee dominates the family count, and the most-cited documents cluster around one research group's carbon-fibre-reinforced resin work rather than a broad industrial base.
Filing activity and IPC composition, 2015–2026
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Epoxy Resin Additive Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data
Filing trend and technology mix
Sixteen families is a small enough set that year-to-year swings should be read as signal about direction, not as a mature trend line. Publication lag of roughly 18 months means the 2025-2026 tail is understated by definition.
Filings rose to a 2021 peak, then eased
Activity was flat at zero through 2017, built to a peak of four families in 2021, and the 2022 midpoint of three families indicates the growth phase has already passed rather than being mid-climb. The most recent year, 2026, is partial and should not be read as a drop-off.
Eight subclasses, no single centre
B33Y (additive manufacturing) appears in 10 of 16 records and C08L (polymer compositions) in 9, but C08G, C08K, G03F, B29C, C08F and C07C all register meaningfully too — evidence that claims are being written across process, formulation and photochemistry simultaneously rather than settling on one axis.
Shares are the percentage of the 16 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Epoxy Resin Additive Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.
Go deeper on Epoxy Resin Additive Manufacturing with Eureka
This page is one run against one query. Ask Eureka your own question about epoxy resin additive manufacturing and every answer comes back with the patent numbers behind it.
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The most-cited records set the terms of the field
Representative record
US9944016B2 — High performance, rapid thermal/UV curing epoxy resin for additive manufacturing of short and continuous carbon fiber epoxy composites
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
An additive manufacturing resin system including an additive manufacturing print head; a continuous carbon fiber or short carbon fibers operatively connected to the additive manufacturing print head; and a tailored resin operatively connected to the print head, wherein the tailored resin has a resin mass and wherein the tailored resin includes an epoxy component, a filler component, a catalyst component, and a chain extender component; wherein the epoxy component is 70-95% of the resin mass, wherein the filler component is 1-20% of the resin mass, wherein the catalyst component is 0.1-10% of the resin mass, and wherein the chain extender component is 0-50% of the resin mass.Filed by Lawrence Livermore National Security, LLC; granted 2018-04-17. A closely related family member, US20180243988A1, is the single most-cited document in this set.
Most-cited patent families
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20180243988A1 | High performance, rapid thermal/UV curing epoxy resin for additive manufacturing of short and continuous carb… | 22 |
| 2 | US9944016B2 | High performance, rapid thermal/UV curing epoxy resin for additive manufacturing of short and continuous carb… | 19 |
| 3 | US9862140B2 | Additive manufacturing of short and mixed fibre-reinforced polymer | 15 |
| 4 | WO2022226386A1 | Cementitious and water-based epoxy 3D printing mortar and methods for making the same | 5 |
| 5 | JP1988075023A | Photopolymer and its production | 5 |
| 6 | US20240181673A1 | Cementitious and water-based epoxy 3D printing mortar and methods for making the same | 4 |
| 7 | CN114479354A | 一种多孔碳纤维/环氧树脂复合材料的制备方法 | 3 |
| 8 | WO2021245650A1 | A photopolymer epoxy composition and a photoinitiator for curing same | 2 |
Citation counts favour older records in any fixed-date search; treat this table as a map of early influence, not current commercial weight.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Publication numbers are shown where the record carries one (8 of 8 rows); clicking a row searches Eureka by that number.
Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Epoxy Resin Additive Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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What the numbers say about where this field stands
Three patterns stand out once the family counts, IPC spread and citation table are read together.
Field size
16 families
total published records
A field still small enough to move in
With only 16 patent families across more than a decade of publications, the epoxy-AM claim space is not saturated. High density elsewhere would mean occupied claim territory; here it means the opposite — there is still room to file a clean composition or process claim without stepping directly on prior art.
Total records in ranking
Momentum
2021 peak of 4
families in the busiest year
Growth has already crested
Filing built steadily to a 2021 peak of four families, and the 2022 midpoint of three shows the pace easing rather than accelerating. Combined with the 18-month publication lag, the 2025-2026 tail understates true activity but the pre-lag trend was already flattening.
2017 = 0 → 2021 peak = 4 → 2022 = 3
Technology mix
8 IPC subclasses
with meaningful record counts
No single technical axis owns the field
B33Y and C08L each cover more than half the records, but C08G, C08K, G03F, B29C, C08F and C07C are all represented too. Claims are being written simultaneously around 3D-printing process, polymer formulation and photocuring chemistry — a sign the technical approach hasn't converged.
B33Y 10 · C08L 9 · B29C 8 · C08G 7
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Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to epoxy resin additive manufacturing, with the prior art for and against each one.
Co-filing is rare
| Assignee | Co-assignee | Shared families |
|---|---|---|
| Tiangong University | Carbon Technology Group Co., Ltd. | 1 |
Only one co-assignee pair appears with meaningful strength — Tiangong University and Carbon Technology Group Co., Ltd. (Carbon Technology Group) — filing together once. Cross-institution collaboration has not yet become a pattern in this space.
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Epoxy Resin Additive Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players
A fragmented assignee base led by one research lab
No company or institution holds a commanding share of the 16 families. Lawrence Livermore National Security's carbon-fibre epoxy work anchors the citation table, but recent-year momentum across the tracked assignees is flat or negative, and most of the field's history is single-filing entrants rather than repeat filers.
Most-cited assignee
22 + 19 citations
on its top two families
Lawrence Livermore National Security, LLC
Holds both the most-cited document (US20180243988A1, cited 22) and its closely related family member US9944016B2 (cited 19), both on rapid thermal/UV curing epoxy for carbon-fibre composite additive manufacturing. This is the closest thing the field has to a foundational filing.
0 filings in the latest tracked year
Co-filing pair
1 joint filing
strongest co-assignee link
Tiangong University + Carbon Technology Group Co., Ltd.
Tiangong University and Carbon Technology Group Co., Ltd. form the only notable co-assignee pair in the dataset, filing together once. This is the sole visible university-industry link in an otherwise fragmented field.
Strongest pairing recorded
Momentum signal
0 in latest year
across every tracked assignee
Stratasys and peers show no recent filings
Stratasys Ltd. (Stratasys) shows 0 filings in the latest year with a -100% YoY change, and every other tracked assignee — including Siemens (Siemens AG) and Polymer Gvulot — also reports zero in the most recent year. Read alongside the publication lag, this reflects reporting delay as much as an actual pullback.
Recent-year momentum, all assignees flat
Recent-year filing momentum by assignee
| Assignee | Recent year | YoY |
|---|---|---|
| POLYMER GVULOT LTD | 0 | — |
| Lawrence Livermore National Security, LLC | 0 | — |
| PETCHLER MILES | 0 | — |
| LAWRENCE LIVERMORE NAT SECURTY LLC | 0 | — |
| Siemens AG | 0 | — |
| Stratasys Ltd. | 0 | -100% |
| Tiangong University | 0 | — |
| Carbon Technology Group Co., Ltd. | 0 | — |
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Epoxy Resin Additive Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next
Where to take this from here
The family count is small enough that manual review of the full set is realistic before committing a filing strategy.
Check freedom-to-operate against the Livermore family
US9944016B2 and US20180243988A1 cover specific compositional ranges for epoxy, filler, catalyst and chain extender in fibre-reinforced print resins. Any formulation claim near those ranges needs a direct comparison before filing.
Run a claim comparison in Eureka →Watch the photocuring–formulation overlap
G03F and C08G both show meaningful record counts alongside the additive-manufacturing IPCs, suggesting the next wave of claims may combine curing chemistry with print process more tightly than current filings do.
Track this overlap in Eureka →Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Epoxy Resin Additive Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ
Common questions about this landscape
The tracked dataset contains 16 published patent families filed between 2015 and the 2026 cut-off, covering IPC classifications for additive manufacturing (B33Y70, B29C64) and epoxy condensation chemistry (C08G59). That is a small field by patent-landscape standards, meaning claim space is not heavily occupied. Because publication lags filing by roughly 18 months, the true count for 2025-2026 filings is understated in any dataset pulled today.
Lawrence Livermore National Security, LLC holds the two most-cited records in this dataset: US20180243988A1 (cited 22 times) and US9944016B2 (cited 19 times), both covering rapid thermal/UV curing epoxy resin for carbon-fibre-reinforced additive manufacturing. A third Livermore-linked family, US9862140B2, on short and mixed fibre-reinforced polymer printing, is also among the most-cited. No other assignee in the set approaches that citation density, though citation counts favour older filings and should be read as a signal of early influence rather than current market weight.
No — with only 16 total families across more than a decade, this is a comparatively open field. Filing activity peaked in 2021 at four families in a single year, and the 2022 midpoint of three suggests the pace has since leveled rather than accelerated. The technology composition is also spread across eight IPC subclasses rather than concentrated in one, which points to a field still being defined rather than one with settled, dominant claim positions.
Based on the IPC and citation data, dual-cure epoxy/acrylate vat photopolymerization systems, continuous-fibre placement nozzles for direct ink writing, and cementitious-epoxy hybrid print mortars all show thin dedicated coverage relative to the core carbon-fibre-composite cluster. Post-print thermal debind scheduling for filled epoxy systems and recyclable or cleavable epoxy network chemistries also appear underrepresented. Any of these would be a reasonable starting point for a first-claim search given the small overall family count.
The assignee base is fragmented: Lawrence Livermore National Security leads on citation influence, and a Chinese pairing of Tiangong University and Carbon Technology Group (Carbon Technology Group Co., Ltd.) forms the only notable co-filing relationship. Stratasys (Stratasys Ltd.) and Siemens (Siemens AG) both appear in the dataset but show zero filings in the most recent tracked year. Most assignees in this set are single-filing entrants rather than repeat filers, which is consistent with the field's small overall size.
Answers are grounded in the same dataset. Derived from a Patsnap search on Epoxy Resin Additive Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.