https://www.patsnap.com/resources/blog/rd-blog/epoxy-resin-advanced-materials-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Polymers & Composites · Patent Landscape
Epoxy Resin Advanced Materials Patents: Who Holds the Claim Space
  • Filing has cooled since its 2017 peak. 54 filings that year against 30 at the 2022 midpoint and a partial 6 in the latest year — a market with occupied core claims rather than a growing one.
  • Polymer composition claims dominate the IPC mix. C08L records (926) and C08G condensation-polymer records (713) dwarf adhesive (C09J, 223) and coating (C09D, 99) filings, showing where formulation claims concentrate.
  • China now leads receiving offices. 265 China filings edge out EPO (221) and the US (209), with WIPO PCT filings (116) showing which applicants are still pursuing multi-jurisdiction coverage.
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1,179
Published Records
37%
Top-5 Share of All Records
+48%
Filing Growth 2021→2024
CN
Leading Jurisdiction

Filing growth compares 2021 (21 records) with 2024 (31) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,179 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the epoxy resin advanced materials filing record shows

The dataset covers 1,179 patent families published between 2015 and mid-2026 across high-Tg, toughened and nanocomposite epoxy formulations. Filing activity peaked in 2017 at 54 filings and has since flattened toward a partial 6 in 2026, with the 2022 midpoint sitting at 30 — a pattern consistent with a field where core formulation claims are already staked out rather than one still expanding. Publication lags filing by roughly 18 months, so the most recent one or two years will always look thinner than they eventually turn out to be.

Claim density sits heavily in polymer composition and condensation-polymer chemistry (C08L, C08G), with additive use (C08K), adhesives (C09J) and laminates (B32B) forming a secondary tier. That distribution points to where new entrants will meet the thickest prior art, and where formulation work around additive packages or laminate structures may still find room.

Filing trend and IPC composition, 2015–2026
  1. 1DOW GLOBAL TECHNOLOGIES LLC200
  2. 2HEXCEL CORP90
  3. 3CYTEC TECHNOLOGY CORP55
  4. 4BLUE CUBE IP LLC49
  5. 5DDP SPECIALTY ELECTRONICS MATERIALS US LLC42
  6. 6SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ BV36
  7. 73M CO27
  8. 83M INNOVATIVE PROPERTIES CO27
  9. 9HENKEL KGAA25
  10. 10THE DOW CHEM CO21
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Epoxy Resin Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The data

Filing trend and technology composition

Two views of the same 1,179-family dataset: how filing volume moved year over year, and how those filings split across IPC subclasses.

Filing trend, 2017–2026

Filings ran from 54 in 2017 down to a partial 6 in 2026, with 30 at the 2022 midpoint — a declining-to-flat trajectory rather than sustained growth. The final year or two is always undercounted because publication trails filing by about 18 months.

Filing trend, 2017–20260153045605420172018201920202021202220232024202562026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass composition

Polymer compositions (C08L, 926) and condensation polymers (C08G, 713) lead by a wide margin over additives (C08K, 286), adhesives (C09J, 223), processing (C08J, 192), laminates (B32B, 112), coatings (C09D, 99) and addition polymers (C08F, 95).

IPC subclass compositionC08L · Polymer compositions92678.5%C08G · Condensation polymers71360.5%C08K · Use of additives in polymers28624.3%C09J · Adhesives22318.9%C08J · Polymer processing & solutions19216.3%B32B · Layered products & laminates1129.5%C09D · Coatings, paints & inks998.4%C08F · Addition polymers (vinyl etc.)958.1%Other31827.0%

Shares are the percentage of the 1,179 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Epoxy Resin Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on Epoxy Resin Advanced Materials with Eureka

This page is one run against one query. Ask Eureka your own question about epoxy resin advanced materials and every answer comes back with the patent numbers behind it.

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Key patents

The prior art shaping this field

Representative record
EP3444302B12020-07-08

EP3444302B1 — toughened epoxy resin composition

KANEKA CORPORATION

Filed by Kaneka Corporation and granted in mid-2020, this record sits within the toughened-epoxy branch of the dataset — the same branch that produced several of the most-cited records in this corpus, including rubber-modified and block-copolymer-toughened formulations.Number, assignee and grant date are rendered from the underlying record.

EP3444302B1 — patent drawing 1EP3444302B1 — patent drawing 2
View full record
Most-cited records
#Publication no.Patent titleCitations
1US4778851ARubber-modified epoxy compounds311
2US5405688AEpoxy resin/aminopolysiloxane/aromatic oligomer composite217
3US20060276601A1Toughened epoxy adhesive composition204
4US5486096AErosion resistant surface protection204
5WO2006052727A1Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom202
6US20050209401A1Toughened epoxy adhesive composition183
7US7625977B2Adhesive of epoxy resin, toughener and blocked isocyanate polytetrahydrofuran toughener143
8US6057382AEpoxy/thermoplastic photocurable adhesive composition126
9WO2006052729A1Amphiphilic block copolymer-toughened epoxy resins104
10US5726216AToughened epoxy resin system and a method thereof91

Citation counts are drawn from the same searched corpus and skew toward older filings — read them as markers of influence, not of what is currently strongest.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Epoxy Resin Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Four read-outs from the trend, the IPC mix and the citation table, each pointing to a different practical question.

Filing momentum
54 → 6
2017 vs. 2026 (partial)

The peak has passed

Filings fell from a 2017 peak of 54 to a 2022 midpoint of 30, and sit at a partial 6 so far in 2026. That trajectory says the core chemistry space is well staked out, not that interest has vanished — new filings now have to work around, not into, the densest claim territory.

Trend data, 2017–2026
Claim concentration
926 + 713
C08L + C08G records

Composition and condensation chemistry own the claim space

Polymer-composition (C08L) and condensation-polymer (C08G) subclasses together account for the large majority of filings, meaning any new formulation claim is likely to collide with dense prior art in exactly those two subclasses.

IPC composition breakdown
Jurisdiction shift
265 vs. 209
China vs. US filings

China leads filing volume

China's 265 filings now outpace the US at 209 and EPO at 221, with 116 PCT filings suggesting a smaller pool of applicants still pursuing broad multi-jurisdiction protection rather than filing locally only.

Receiving office counts
Collaboration signal
24 shared families
Dow Global Technologies + University of Minnesota

Co-assignment is rare but concentrated

Only 10 co-assignee pairs appear in the dataset, and the strongest — 24 shared families between Dow Global Technologies and the University of Minnesota — suggests a small number of durable industry-academic filing relationships rather than a broad collaboration trend.

Co-assignee pair analysis
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to epoxy resin advanced materials, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Epoxy Resin Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Who's filing

Assignee concentration and momentum

Filing activity concentrates among a handful of chemical and materials companies, with recent-year momentum mostly flat or negative — a sign that the current leaders are consolidating position rather than pushing new volume.

Momentum leader (flat)
2 filings
latest year, 0% YoY

Henkel AG & Co. KGaA

The only assignee among the tracked group with any filings in the latest year, though volume is flat year over year rather than growing.

Recent-year momentum tracking
Historical scale
0 in latest year
Dow Global Technologies

Dow Global Technologies Inc. (Dow Global Technologies)

Anchors the strongest co-assignee relationship in the dataset, with 24 shared families with the University of Minnesota, but shows no filings in the most recent tracked year.

Co-assignee pair analysis
Composite specialist
-100% YoY
Hexcel

Hexcel Corporation

Paired closely with its own UK entity (Hexcel Composites Ltd, 11 shared families) and shows a sharp year-over-year drop to zero filings in the latest year, consistent with the broader flattening trend.

Recent-year momentum tracking
🔍
Sub-areas with thinner claim coverage
Branches where filing density is lower relative to the core composition and condensation-polymer chemistry — worth a freedom-to-operate check before assuming they're occupied.
addition-polymer (C08F) hybrid epoxy blendscoating and ink formulations (C09D)laminate interlayer structures (B32B)erosion-resistant surface protection layersamphiphilic block-copolymer toughening
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Henkel AG & Co. KGaA20%
Dow Global Technologies Inc.0
Hexcel Corporation0-100%
Cytec Technology Corp.0
Shell International Research Maatschappij B.V.0
3M Company0
3M Innovative Properties Company0
University of Minnesota0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Epoxy Resin Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this analysis

The dataset points to a field with occupied core claims and a few thinner branches. These are the natural next steps for a formulation or IP team.

Map freedom-to-operate around toughened-epoxy claims

The most-cited records in this dataset cluster around rubber-modified and block-copolymer-toughened formulations. A targeted FTO review of that branch before filing avoids the densest prior art rather than working around it after the fact.

Explore toughened-epoxy prior art in Eureka

Watch jurisdiction shift toward China

China now leads receiving-office volume ahead of the US and EPO. Teams filing primarily in Western jurisdictions may be missing where the next wave of enforceable claims will sit.

Track China filing activity in Eureka

Check thinner sub-areas before assuming white space

Lower filing density in coatings, laminate interlayers and hybrid addition-polymer blends does not guarantee an open claim — it means fewer records to search, not zero risk.

Run a white-space search in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Epoxy Resin Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about epoxy resin advanced materials patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Epoxy Resin Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Go past this page: query the whole epoxy resin advanced materials corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.