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Run your analysis now →Filing growth compares 2021 (21 records) with 2024 (31) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,179 records in scope (CR5), not by the ranked leaders only.
The dataset covers 1,179 patent families published between 2015 and mid-2026 across high-Tg, toughened and nanocomposite epoxy formulations. Filing activity peaked in 2017 at 54 filings and has since flattened toward a partial 6 in 2026, with the 2022 midpoint sitting at 30 — a pattern consistent with a field where core formulation claims are already staked out rather than one still expanding. Publication lags filing by roughly 18 months, so the most recent one or two years will always look thinner than they eventually turn out to be.
Claim density sits heavily in polymer composition and condensation-polymer chemistry (C08L, C08G), with additive use (C08K), adhesives (C09J) and laminates (B32B) forming a secondary tier. That distribution points to where new entrants will meet the thickest prior art, and where formulation work around additive packages or laminate structures may still find room.
Pick a task. Every answer cites the patents behind it.
Two views of the same 1,179-family dataset: how filing volume moved year over year, and how those filings split across IPC subclasses.
Filings ran from 54 in 2017 down to a partial 6 in 2026, with 30 at the 2022 midpoint — a declining-to-flat trajectory rather than sustained growth. The final year or two is always undercounted because publication trails filing by about 18 months.
Polymer compositions (C08L, 926) and condensation polymers (C08G, 713) lead by a wide margin over additives (C08K, 286), adhesives (C09J, 223), processing (C08J, 192), laminates (B32B, 112), coatings (C09D, 99) and addition polymers (C08F, 95).
Shares are the percentage of the 1,179 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about epoxy resin advanced materials and every answer comes back with the patent numbers behind it.
Try EurekaFiled by Kaneka Corporation and granted in mid-2020, this record sits within the toughened-epoxy branch of the dataset — the same branch that produced several of the most-cited records in this corpus, including rubber-modified and block-copolymer-toughened formulations.Number, assignee and grant date are rendered from the underlying record.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US4778851A | Rubber-modified epoxy compounds | 311 |
| 2 | US5405688A | Epoxy resin/aminopolysiloxane/aromatic oligomer composite | 217 |
| 3 | US20060276601A1 | Toughened epoxy adhesive composition | 204 |
| 4 | US5486096A | Erosion resistant surface protection | 204 |
| 5 | WO2006052727A1 | Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom | 202 |
| 6 | US20050209401A1 | Toughened epoxy adhesive composition | 183 |
| 7 | US7625977B2 | Adhesive of epoxy resin, toughener and blocked isocyanate polytetrahydrofuran toughener | 143 |
| 8 | US6057382A | Epoxy/thermoplastic photocurable adhesive composition | 126 |
| 9 | WO2006052729A1 | Amphiphilic block copolymer-toughened epoxy resins | 104 |
| 10 | US5726216A | Toughened epoxy resin system and a method thereof | 91 |
Citation counts are drawn from the same searched corpus and skew toward older filings — read them as markers of influence, not of what is currently strongest.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Four read-outs from the trend, the IPC mix and the citation table, each pointing to a different practical question.
Filings fell from a 2017 peak of 54 to a 2022 midpoint of 30, and sit at a partial 6 so far in 2026. That trajectory says the core chemistry space is well staked out, not that interest has vanished — new filings now have to work around, not into, the densest claim territory.
Polymer-composition (C08L) and condensation-polymer (C08G) subclasses together account for the large majority of filings, meaning any new formulation claim is likely to collide with dense prior art in exactly those two subclasses.
China's 265 filings now outpace the US at 209 and EPO at 221, with 116 PCT filings suggesting a smaller pool of applicants still pursuing broad multi-jurisdiction protection rather than filing locally only.
Only 10 co-assignee pairs appear in the dataset, and the strongest — 24 shared families between Dow Global Technologies and the University of Minnesota — suggests a small number of durable industry-academic filing relationships rather than a broad collaboration trend.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to epoxy resin advanced materials, with the prior art for and against each one.
Filing activity concentrates among a handful of chemical and materials companies, with recent-year momentum mostly flat or negative — a sign that the current leaders are consolidating position rather than pushing new volume.
The only assignee among the tracked group with any filings in the latest year, though volume is flat year over year rather than growing.
Anchors the strongest co-assignee relationship in the dataset, with 24 shared families with the University of Minnesota, but shows no filings in the most recent tracked year.
Paired closely with its own UK entity (Hexcel Composites Ltd, 11 shared families) and shows a sharp year-over-year drop to zero filings in the latest year, consistent with the broader flattening trend.
| Assignee | Recent year | YoY |
|---|---|---|
| Henkel AG & Co. KGaA | 2 | 0% |
| Dow Global Technologies Inc. | 0 | — |
| Hexcel Corporation | 0 | -100% |
| Cytec Technology Corp. | 0 | — |
| Shell International Research Maatschappij B.V. | 0 | — |
| 3M Company | 0 | — |
| 3M Innovative Properties Company | 0 | — |
| University of Minnesota | 0 | — |
The dataset points to a field with occupied core claims and a few thinner branches. These are the natural next steps for a formulation or IP team.
The most-cited records in this dataset cluster around rubber-modified and block-copolymer-toughened formulations. A targeted FTO review of that branch before filing avoids the densest prior art rather than working around it after the fact.
Explore toughened-epoxy prior art in EurekaChina now leads receiving-office volume ahead of the US and EPO. Teams filing primarily in Western jurisdictions may be missing where the next wave of enforceable claims will sit.
Track China filing activity in EurekaLower filing density in coatings, laminate interlayers and hybrid addition-polymer blends does not guarantee an open claim — it means fewer records to search, not zero risk.
Run a white-space search in EurekaFiling activity concentrates among a small group of chemical and materials companies, including Dow Global Technologies, Hexcel, Henkel and 3M-affiliated entities, alongside academic co-filers such as the University of Minnesota. The strongest co-assignee relationship in the dataset — 24 shared families between Dow Global Technologies and the University of Minnesota — shows how a handful of industry-academic pairings account for a disproportionate share of joint filings. Most of these leading assignees show flat or declining filing counts in the most recent tracked year, which suggests consolidation of existing claims rather than an active filing race.
No. Filings peaked at 54 in 2017, fell to 30 by the 2022 midpoint, and sit at a partial 6 so far in 2026. That said, the most recent one to two years in any patent dataset are understated because publication typically trails filing by about 18 months, so the true 2025–2026 figures will end up higher than currently shown. Even accounting for that lag, the multi-year decline from the 2017 peak points to a maturing filing landscape rather than a growth phase.
Polymer composition claims (IPC class C08L, 926 records) and condensation-polymer chemistry (C08G, 713 records) dominate the dataset by a wide margin. Additive use (C08K), adhesives (C09J) and polymer processing (C08J) form a clear second tier, while laminates (B32B), coatings (C09D) and addition polymers (C08F) are smaller but still active categories. Anyone drafting new formulation claims should expect the densest prior art in C08L and C08G specifically, since that is where most granted and pending claims sit.
EP3444302B1, titled for a toughened epoxy resin composition, was granted to Kaneka Corporation in mid-2020 and sits within the toughened-epoxy branch that also produced several of the most-cited records in this field, including rubber-modified and block-copolymer-toughened formulations. It represents the kind of claim that a formulator working on impact-modified or toughened epoxy systems needs to check against directly. Because toughening chemistry is one of the more heavily cited sub-areas in the dataset, working around a granted claim like this typically means differentiating on the specific toughening agent or blend ratio rather than the general toughening approach.
Filing density is comparatively lower in addition-polymer hybrid blends (C08F), coating and ink formulations (C09D), and laminate interlayer structures (B32B) relative to the dominant C08L and C08G composition classes. Erosion-resistant surface protection and amphiphilic block-copolymer toughening also show fewer records than the core toughened-epoxy and nanocomposite branches. Lower density is not a guarantee of an open claim, but it does mean a smaller, more manageable set of prior art to clear before filing in those sub-areas.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.