Epoxy Resin Curing Process Patents: Who Leads, Trends 2026
- Filings have cooled since 2020. the peak year for new families, with the 2022 midpoint already below it — this is a maturing claim space, not a growing one.
- Condensation chemistry dominates the IPC mix. C08G appears in 452 of 485 records, with adhesive (C09J) and coating (C09D) uses trailing well behind as secondary application classes.
- Co-filing is rare. only six co-assignee pairs exist across 485 families, meaning most claim territory here was staked out by single entities working alone.
Filing growth compares 2021 (9 records) with 2024 (14) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 485 records in scope (CR5), not by the ranked leaders only.
What this patent set covers
This landscape tracks 485 patent families filed between 2015 and 2026 around the epoxy resin curing process: curing kinetics, cure cycle optimization, latent curing agents and snap-cure formulations, indexed against C08G59/68, C08J3/24 and B29C35. The corpus is weighted toward condensation-polymer chemistry (C08G) with secondary claim activity in adhesives, coatings and layered laminates, showing that curing-process innovation here is mostly claimed as chemistry first and application second.
Filing activity peaked in 2020 and has since declined toward the most recent, still-incomplete year — publication lag of roughly 18 months means the last one or two years understate real filing activity, but the mid-decade slowdown from the 2020 peak is a genuine trend, not an artefact of the cut-off.
Filing trends and technology composition
Two views of the same 485 families: how filing volume has moved year over year, and which IPC subclasses carry the claim weight.
Filing trend, 2017–2026
Annual filings rose from 22 in 2017 to a peak of 26 in 2020, then eased back toward the midpoint of 14 in 2022 and lower still into the partial final year — a flat-to-declining pattern rather than sustained growth.
IPC subclass composition
C08G (condensation polymers) anchors the set at 452 of 485 records, with C08L polymer compositions, C09J adhesives and C08J processing/solutions forming a secondary tier; B32B laminates and C07D heterocyclics sit furthest from the core and mark the outer edge of the claim space.
Shares are the percentage of the 485 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
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Try EurekaMost-cited records and a representative filing
US20030004296A1 — Latent curing agent for epoxy resin, and curable epoxy resin composition
Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability, and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The composition cures at lower temperatures for a shorter period than conventional ones. The latent curing agent comprises a radically polymerized polymer bearing a tertiary amino group and a hydroxyl-bearing polymer, forming a solid solution.Filed by AJINOMOTO CO., INC., published 2003-01-02 — one of the earlier latent curing agent filings still active in later citation chains within this set.
View full record| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US3708296A | Photopolymerization of epoxy monomers | 593 |
| 2 | US6180696B1 | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant | 180 |
| 3 | US4734332A | Method for effecting adhesion using laminates from epoxy resins | 148 |
| 4 | US4659779A | Solid solution of amine and polymerized phenol as epoxy resin cure accelerator | 125 |
| 5 | US5982056A | Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for produc… | 82 |
| 6 | US5357008A | Latent curing agent for epoxy resin and its preparation | 62 |
| 7 | WO1998037134A1 | Low-cost high-performance no-flow underfills for FLIP-chip applications | 56 |
| 8 | EP0590975A1 | Low viscosity and solvent-free one-component type epoxy resin adhesive composition | 55 |
| 9 | US5548058A | Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation | 54 |
| 10 | US5362597A | Radiation-sensitive resin composition comprising an epoxy-containing alkali-soluble resin and a naphthoquinon… | 50 |
Citation counts are drawn from a searched corpus and favour older filings; treat them as a measure of influence on later work, not of current commercial relevance.
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Reading the trend, IPC mix and citation table together points to a field that consolidated its core chemistry early and has since slowed rather than expanded.
The growth phase has passed
Filings peaked in 2020 and have declined through the 2022 midpoint into a partial, lower final year. Publication lag inflates how steep the drop looks at the very end, but the multi-year decline from the peak predates that effect.
Claim space is chemistry-first
Nearly all records sit in C08G, with adhesive, coating and laminate uses layered on top as secondary classifications. New entrants are more likely to find room in an application-specific formulation than in the base cure chemistry itself.
This is a solo-filer's field
Co-assignment is rare and the pairs that exist link corporate affiliates rather than independent partners. Most claim territory was built by single entities filing alone, which lowers the odds of finding freedom-to-operate through a joint venture route.
Influence skews old
The most-cited record dates to the earliest wave of photopolymerization claims and still anchors later citation chains. High citation counts here mark foundational chemistry, not current commercial weight.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to epoxy resin curing process, with the prior art for and against each one.
Who holds the claims, and where activity has gone quiet
Filing here is dominated by a small set of established chemical and adhesives companies, most of which show little to no filing activity in the most recent year.
Henkel AG & Co. KGaA (Henkel)
The only assignee in this set with growth in the latest year, doubling its filing count even as most peers went to zero. That makes it the one name to watch for near-term activity in this space.
Legacy photopolymerization claims
The oldest and most-cited record in the corpus set precedent for later photopolymerization and cure-chemistry claims. Its influence shows up across the citation graph even though it predates most active assignees here.
Large filers gone quiet
Several established names — including major specialty chemical and gas-and-chemicals companies — show no filings in the most recent year despite substantial historical presence. That is consistent with a maturing space rather than an exit signal, given the publication lag.
| Assignee | Recent year | YoY |
|---|---|---|
| Henkel AG & Co. KGaA | 2 | +100% |
| Ajinomoto Co., Inc. | 0 | — |
| HEXCEL COMPOSITES LTD (GB) | 0 | — |
| Ciba-Geigy AG | 0 | — |
| Air Products and Chemicals, Inc. | 0 | — |
| Dow Global Technologies LLC | 0 | — |
| Adeka Corporation | 0 | — |
| Toshiba Corporation | 0 | — |
Turning this landscape into a filing or freedom-to-operate decision
The trend and IPC data narrow down where to look; deciding whether to file, design around, or license still needs claim-level reading.
Check claim scope on the most-cited records
Citation weight concentrates in a handful of older filings. Read their claims directly before assuming a formulation is open.
Explore in Patsnap EurekaWatch the one assignee still filing
Most large incumbents show zero filings in the latest year; one shows growth. Track that gap over the next few quarters.
Explore in Patsnap EurekaProbe the thinner IPC branches
Heterocyclic accelerators and laminate-specific cure cycles carry far fewer filings than the core chemistry. That is where new claims have more room.
Explore in Patsnap EurekaCommon questions about epoxy resin curing process patents
This landscape identifies 485 patent families filed between 2015 and 2026 that match curing kinetics, cure cycle optimization, latent curing agent and snap-cure terminology within the C08G59/68, C08J3/24 and B29C35 classification scope. Patent families are the more reliable unit than raw document counts because they collapse continuations and multi-jurisdiction re-filings of the same invention into one entry. The true figure for the most recent one to two years is understated because of an approximately 18-month publication lag between filing and disclosure.
Filing activity peaked in 2020 at 26 families and has declined since, with the 2022 midpoint at 14 already below the peak. That pattern points to a slowing rather than growing field, though the last one or two years in any dataset always look lower than they really are because of publication lag. Read the decline from 2020 onward as directionally real, and treat only the sharpest drop at the very end of the window as an artefact of timing rather than genuine loss of interest.
C08G, covering condensation polymers, dominates this landscape and appears in 452 of the 485 records, making it the core classification to search first. C08L polymer compositions, C09J adhesives and C08J polymer processing form a secondary tier reflecting how curing chemistry gets applied. B32B laminates and C07D heterocyclic compounds sit at the thin edge of the dataset, which also makes them the areas with the least filing density relative to the core chemistry.
US20030004296A1, filed by AJINOMOTO CO., INC. and published in 2003, claims a latent curing agent built from a radically polymerized polymer bearing a tertiary amino group combined with a hydroxyl-bearing polymer, forming a solid solution that improves storage stability and enables lower-temperature, faster curing. It is a representative rather than the single most-cited filing in this set, but it illustrates the two-component solid-solution approach that recurs across later latent curing agent filings. Anyone designing a new latent curing system should check this claim structure specifically before assuming a similar two-polymer solid-solution approach is open to file.
Most of the established assignees tracked in this dataset — including several major specialty chemical and industrial gas companies — show zero filings in the most recent year, which is consistent with the overall post-2020 slowdown. One assignee, Henkel, shows growth in the latest year even as peers went quiet, making it the one name worth watching for near-term activity. Because of publication lag, a zero in the latest year does not necessarily mean a company has exited the space; it may simply mean its most recent filings have not published yet.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.