Epoxy Resin Curing Systems Patents: Leaders & White Space 2026
- 637 to 12 filings per year. Annual filings fell from 637 in 2017 to a 2019 peak of 663, then declined toward 12 in the most recent (partial) year — a mature, contracting filing curve, not a growth market.
- C08G and C08L dominate. Condensation-polymer chemistry (C08G, 15,578 records) and polymer compositions (C08L, 11,480) outweigh coatings (C09D, 4,644) and adhesives (C09J, 2,538) combined, showing where claim density actually sits.
- Momentum is negative even for incumbents. Recent-year filings from the most active assignees are flat or falling — one is down 94% year-on-year, another down 100% — suggesting the core hardener chemistry is largely staked out rather than still being contested.
Filing growth compares 2021 (524 records) with 2024 (273) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 82,669 records in scope (CR5), not by the ranked leaders only.
A mature chemistry with a shrinking filing curve
Epoxy resin curing — the reaction chemistry that turns a liquid resin into a cross-linked thermoset via amine hardeners, anhydrides or latent catalysts — is one of the older corners of polymer patenting still under active claim. The dataset spans 82,669 patent families filed between 2015 and 2026 under classifications covering condensation polymers, polymer compositions and coatings, and the filing curve tells a clear story: activity peaked in 2019 and has fallen every year since toward the current data cut-off.
That decline does not mean the chemistry is exhausted. It means the foundational hardener and resin-composition claims are largely occupied, and new filings increasingly sit in adjacent applications — semiconductor encapsulation, adhesives, layered laminates — rather than in the core resin-hardener reaction itself. Publication lags filing by roughly 18 months, so the most recent year understates true filing activity, but even accounting for that lag the multi-year downward trend from the 2019 peak is not an artefact of reporting delay alone.
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Filing trend and technology composition
Two views of the same dataset: the annual filing count, and how those filings split across International Patent Classification subclasses.
A decade past its filing peak
Filings rose to 663 in 2019 then declined steadily; the 2022 midpoint of 500 confirms the trajectory is downward rather than a temporary dip, and the 2026 figure of 12 reflects both a genuine slowdown and the reporting lag on the most recent filings.
Claim density concentrated in resin and composition chemistry
C08G (condensation polymers) and C08L (polymer compositions) together account for roughly a third of all records, dwarfing coatings (C09D), adhesives (C09J) and the smaller semiconductor (H01L) and laminate (B32B) categories — a strong signal that the core resin-hardener reaction itself, not its downstream applications, is where prior art is thickest.
Shares are the percentage of the 82,669 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Epoxy Resin Curing Systems with Eureka
This page is one run against one query. Ask Eureka your own question about epoxy resin curing systems and every answer comes back with the patent numbers behind it.
Try EurekaThe records shaping this space
A curable epoxy resin composition and a curative therefor (US20170267809A1)
An amine hardener system useful for curing a curable resin composition including a blend of: (I) a first amine hardener comprising at least one cycloaliphatic amine; and (II) a second amine hardener comprising at least one polyetheramine; and a curable epoxy resin composition including (A) at least one epoxy resin compound; and (B) at least one curing agent; wherein the at least one curing agent includes the above amine hardener system.Filed by Dow Global Technologies LLC, published 2017-09-21.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US6268055B1 | Photochromic epoxy resin coating composition and articles having such a coating | 417 |
| 2 | US4051195A | Polyepoxide-polyacrylate ester compositions | 410 |
| 3 | US5648407A | Curable resin sols and fiber-reinforced composites derived therefrom | 403 |
| 4 | US20030080341A1 | Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semicond… | 395 |
| 5 | US5278257A | Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin | 369 |
| 6 | US4552604A | Bonding method employing film adhesives | 326 |
| 7 | US4778851A | Rubber-modified epoxy compounds | 311 |
| 8 | EP0012463A1 | Thermosetting resinous binder compositions, their preparation, and use as coating materials | 297 |
| 9 | US6207786B1 | Ternary systems of benzoxazine, epoxy, and phenolic resins | 267 |
| 10 | US7125461B2 | Activatable material for sealing, baffling or reinforcing and method of forming same | 264 |
Citation counts reflect influence within an older, larger corpus and skew toward earlier filings; treat them as a marker of historical importance rather than current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers mean for a filing decision
Three patterns stand out once the raw counts are broken down by classification, geography and assignee activity.
The curve has been falling since 2019
Annual filings dropped from a 2019 peak of 663 toward 12 in the most recent partial year, with the 2022 midpoint of 500 confirming a sustained decline rather than a one-year blip. New entrants filing on core hardener chemistry are filing into a market with a decade of accumulated prior art.
Condensation-polymer claims dominate the corpus
C08G and C08L together outnumber every downstream application class. Coatings, adhesives, semiconductor packaging and laminates each carry a few thousand records at most, meaning the resin-hardener reaction itself is the most heavily claimed layer of this stack.
US and EPO carry most of the volume
The United States (7,376) and the European Patent Office (6,409) together account for well over half of tracked receiving-office activity, with WIPO/PCT, Canada, the UK and Australia trailing well behind. Filing strategy in this field is still built around the two largest markets first.
Even active assignees are pulling back
Recent-year filing counts from the most visible assignees are low in absolute terms and falling: one leading filer dropped 94% year-on-year to a single filing, another to zero. This is consistent with a chemistry where the foundational claims are already staked and incremental filings are the norm.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to epoxy resin curing systems, with the prior art for and against each one.
Who is still filing, and where the gaps sit
The assignee base includes large industrial chemical companies alongside a long tail of single-filing entrants. Recent momentum figures show contraction even among the most historically active filers.
Dow-linked entities anchor the core chemistry
The strongest co-assignee relationship in the dataset links Dow Global Technologies with Rohm and Haas (25 shared records), reflecting decades of joint filing on resin and hardener chemistry. Dow-affiliated entities show zero filings in the latest year, consistent with the broader slowdown.
Japanese electronics-adjacent filers remain active
A second strong co-assignee pair links Resonac (formerly Showa Denko/Hitachi Chemical lineage) with Hitachi, pointing to continued joint work on epoxy systems for electronics encapsulation rather than general-purpose resin chemistry.
Sika and Shin-Etsu are still filing, but slowing
Sika Technology shows 2 filings in the latest year (down 71% year-on-year) and Shin-Etsu Chemical shows 1 (down 94%), indicating these specialty and electronics-materials filers remain nominally active but at a fraction of historical volume.
| Assignee | Recent year | YoY |
|---|---|---|
| Sika Technology AG | 2 | -71% |
| Shin-Etsu Chemical Co., Ltd. | 1 | -94% |
| Sumitomo Bakelite Co., Ltd. | 1 | 0% |
| Dow Global Technologies LLC | 0 | — |
| Toray Industries, Inc. | 0 | -100% |
| The Dow Chemical Company | 0 | — |
| Resonac Corporation | 0 | -100% |
| Mitsubishi Gas Chemical Company, Inc. | 0 | -100% |
Where to take this
The dataset points to a chemistry where core claims are settled and the open questions sit at the edges — application-specific formulations, catalyst systems and geographic gaps.
Map freedom-to-operate against the densest classes
Before drafting new hardener or resin-composition claims, check overlap with the C08G and C08L clusters specifically, since that is where citation density and family count are both highest.
Explore claim density in EurekaWatch application-adjacent filing instead of core chemistry
With core amine hardener and anhydride claims largely staked, filing activity in adhesives, laminates and semiconductor encapsulation is a more realistic place to find open claim territory.
Track adjacent-class filings in EurekaCommon questions about epoxy resin curing patents
The filing trend in this dataset shows a peak of 663 filings in 2019 followed by a steady decline toward 12 in the most recent partial year. This pattern is typical of a mature chemistry: the foundational reactions — amine hardener systems, anhydride curing, glass-transition-temperature control — have been claimed extensively since the early 2010s, so new entrants increasingly file on application-specific formulations rather than core resin-hardener chemistry. Some of the most recent decline is also an artefact of publication lag, since patent applications typically publish around 18 months after filing, but the multi-year downward trend from 2019 predates that effect.
Large industrial chemical companies with long-running epoxy resin portfolios, including Dow-affiliated entities and Japanese electronics-materials makers such as Resonac and Hitachi, show the strongest co-assignee relationships in this dataset, reflecting sustained joint filing over many years. However, recent-year momentum figures show even these historically active filers with sharply reduced output — some down over 90% year-on-year — so current filing leadership does not necessarily track historical patent volume. Anyone assessing competitive position should weigh recent-year filing counts alongside cumulative portfolio size.
Both are covered within this dataset's search scope, which includes curing agent, amine hardener and anhydride terminology alongside glass transition temperature and toughening claims. Amine hardener systems, including cycloaliphatic amines and polyetheramines, tend to appear in claims targeting room-temperature or moderate-cure applications, while anhydride systems are more common in high-temperature, high-Tg formulations used in composites and encapsulation. The representative filing in this dataset, from Dow Global Technologies, specifically claims a blended cycloaliphatic-amine and polyetheramine hardener system, illustrating how modern claims often combine hardener classes rather than relying on a single curing agent type.
The classification breakdown shows claim density concentrated heavily in condensation-polymer chemistry (C08G) and general polymer compositions (C08L), while adjacent application areas such as adhesives, layered laminates and specific catalyst or toughening-agent sub-branches carry comparatively fewer records. Sub-areas like latent anhydride catalyst systems, polyetheramine co-hardener blends and low-Tg flexibilizer chemistries show thinner recent filing activity relative to the core resin-hardener claim space. That does not guarantee an open field, but it indicates where prior art is less densely packed and where a well-drafted first claim has more room to stand.
The receiving-office data shows the United States (7,376 filings) and the European Patent Office (6,409) carrying the bulk of tracked activity, with PCT/WIPO filings at 2,343 and Canada, the UK and Australia each below 1,400. This suggests most applicants in epoxy curing chemistry pursue direct national or regional filing in the two largest markets rather than broad PCT coverage, likely reflecting the maturity of the underlying chemistry and a focus on protecting specific commercial formulations rather than staking broad international claims.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.