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Epoxy Resin Curing Systems Patents: Leaders & White Space 2026

Epoxy Resin Curing Systems Patents: Leaders & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/epoxy-resin-curing-systems-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Polymers & Resins
Epoxy Resin Curing Systems Patents: Who Holds the Claim Space
  • 637 to 12 filings per year. Annual filings fell from 637 in 2017 to a 2019 peak of 663, then declined toward 12 in the most recent (partial) year — a mature, contracting filing curve, not a growth market.
  • C08G and C08L dominate. Condensation-polymer chemistry (C08G, 15,578 records) and polymer compositions (C08L, 11,480) outweigh coatings (C09D, 4,644) and adhesives (C09J, 2,538) combined, showing where claim density actually sits.
  • Momentum is negative even for incumbents. Recent-year filings from the most active assignees are flat or falling — one is down 94% year-on-year, another down 100% — suggesting the core hardener chemistry is largely staked out rather than still being contested.
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82.7K
Published Records
13%
Top-5 Share of All Records
-48%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (524 records) with 2024 (273) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 82,669 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

A mature chemistry with a shrinking filing curve

Epoxy resin curing — the reaction chemistry that turns a liquid resin into a cross-linked thermoset via amine hardeners, anhydrides or latent catalysts — is one of the older corners of polymer patenting still under active claim. The dataset spans 82,669 patent families filed between 2015 and 2026 under classifications covering condensation polymers, polymer compositions and coatings, and the filing curve tells a clear story: activity peaked in 2019 and has fallen every year since toward the current data cut-off.

That decline does not mean the chemistry is exhausted. It means the foundational hardener and resin-composition claims are largely occupied, and new filings increasingly sit in adjacent applications — semiconductor encapsulation, adhesives, layered laminates — rather than in the core resin-hardener reaction itself. Publication lags filing by roughly 18 months, so the most recent year understates true filing activity, but even accounting for that lag the multi-year downward trend from the 2019 peak is not an artefact of reporting delay alone.

Filing activity, 2017–2026
  1. 1RESONAC CORP3,164
  2. 2SUMITOMO BAKELITE CO LTD2,682
  3. 3TORAY INDUSTRIES INC1,651
  4. 4DIC CORP1,461
  5. 5SHIN ETSU CHEMICAL CO LTD1,382
  6. 6DOW GLOBAL TECHNOLOGIES LLC1,229
  7. 7NITTO DENKO CORP1,156
  8. 8THE DOW CHEM CO1,129
  9. 9MITSUBISHI GAS CHEM CO INC1,107
  10. 10NIPPON KAYAKU CO LTD1,098
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Epoxy Resin Curing Systems covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The data

Filing trend and technology composition

Two views of the same dataset: the annual filing count, and how those filings split across International Patent Classification subclasses.

A decade past its filing peak

Filings rose to 663 in 2019 then declined steadily; the 2022 midpoint of 500 confirms the trajectory is downward rather than a temporary dip, and the 2026 figure of 12 reflects both a genuine slowdown and the reporting lag on the most recent filings.

A decade past its filing peak0200400600800637201720186632019202020212022202320242025122026Most recent year is partial — publication lag means later filings are not yet visible.

Claim density concentrated in resin and composition chemistry

C08G (condensation polymers) and C08L (polymer compositions) together account for roughly a third of all records, dwarfing coatings (C09D), adhesives (C09J) and the smaller semiconductor (H01L) and laminate (B32B) categories — a strong signal that the core resin-hardener reaction itself, not its downstream applications, is where prior art is thickest.

Claim density concentrated in resin and composition chemistryC08G · Condensation polymers15,57818.8%C08L · Polymer compositions11,48013.9%C08K · Use of additives in polymers4,7035.7%C09D · Coatings, paints & inks4,6445.6%C08J · Polymer processing & solutions3,8674.7%C09J · Adhesives2,5383.1%H01L · Semiconductor devices2,1362.6%B32B · Layered products & laminates1,9602.4%Other11,22213.6%

Shares are the percentage of the 82,669 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Epoxy Resin Curing Systems covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key patents

The records shaping this space

Representative filing
US20170267809A12017-09-21

A curable epoxy resin composition and a curative therefor (US20170267809A1)

DOW GLOBAL TECHNOLOGIES LLC

An amine hardener system useful for curing a curable resin composition including a blend of: (I) a first amine hardener comprising at least one cycloaliphatic amine; and (II) a second amine hardener comprising at least one polyetheramine; and a curable epoxy resin composition including (A) at least one epoxy resin compound; and (B) at least one curing agent; wherein the at least one curing agent includes the above amine hardener system.Filed by Dow Global Technologies LLC, published 2017-09-21.

US20170267809A1 — patent drawing 1US20170267809A1 — patent drawing 2
View full filing
Most-cited records in the corpus
#Publication no.Patent titleCitations
1US6268055B1Photochromic epoxy resin coating composition and articles having such a coating417
2US4051195APolyepoxide-polyacrylate ester compositions410
3US5648407ACurable resin sols and fiber-reinforced composites derived therefrom403
4US20030080341A1Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semicond…395
5US5278257APhenol-terminated polyurethane or polyurea(urethane) with epoxy resin369
6US4552604ABonding method employing film adhesives326
7US4778851ARubber-modified epoxy compounds311
8EP0012463A1Thermosetting resinous binder compositions, their preparation, and use as coating materials297
9US6207786B1Ternary systems of benzoxazine, epoxy, and phenolic resins267
10US7125461B2Activatable material for sealing, baffling or reinforcing and method of forming same264

Citation counts reflect influence within an older, larger corpus and skew toward earlier filings; treat them as a marker of historical importance rather than current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Epoxy Resin Curing Systems covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three patterns stand out once the raw counts are broken down by classification, geography and assignee activity.

Filing trend
663 → 12
peak to latest year

The curve has been falling since 2019

Annual filings dropped from a 2019 peak of 663 toward 12 in the most recent partial year, with the 2022 midpoint of 500 confirming a sustained decline rather than a one-year blip. New entrants filing on core hardener chemistry are filing into a market with a decade of accumulated prior art.

Publication lag means the final 1-2 years will revise upward, but not enough to reverse the trend.
Technology mix
15,578 records
in C08G alone

Condensation-polymer claims dominate the corpus

C08G and C08L together outnumber every downstream application class. Coatings, adhesives, semiconductor packaging and laminates each carry a few thousand records at most, meaning the resin-hardener reaction itself is the most heavily claimed layer of this stack.

Application-specific formulation claims may still have more room than core chemistry claims.
Geography
7,376 filings
at the USPTO

US and EPO carry most of the volume

The United States (7,376) and the European Patent Office (6,409) together account for well over half of tracked receiving-office activity, with WIPO/PCT, Canada, the UK and Australia trailing well behind. Filing strategy in this field is still built around the two largest markets first.

A PCT filing count of 2,343 suggests most applicants pursue direct national/regional routes rather than broad international coverage.
Assignee momentum
-94% YoY
for one leading filer

Even active assignees are pulling back

Recent-year filing counts from the most visible assignees are low in absolute terms and falling: one leading filer dropped 94% year-on-year to a single filing, another to zero. This is consistent with a chemistry where the foundational claims are already staked and incremental filings are the norm.

Co-assignee pairings, capped at 10 identified pairs, suggest joint filing is the exception rather than the rule.
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to epoxy resin curing systems, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Epoxy Resin Curing Systems covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is still filing, and where the gaps sit

The assignee base includes large industrial chemical companies alongside a long tail of single-filing entrants. Recent momentum figures show contraction even among the most historically active filers.

Incumbent chemistry
25 pairings
strongest co-assignee pair

Dow-linked entities anchor the core chemistry

The strongest co-assignee relationship in the dataset links Dow Global Technologies with Rohm and Haas (25 shared records), reflecting decades of joint filing on resin and hardener chemistry. Dow-affiliated entities show zero filings in the latest year, consistent with the broader slowdown.

Legacy portfolios like this typically function as a defensive perimeter around core formulations.
Japanese chemical majors
15 pairings
Resonac + Hitachi pair

Japanese electronics-adjacent filers remain active

A second strong co-assignee pair links Resonac (formerly Showa Denko/Hitachi Chemical lineage) with Hitachi, pointing to continued joint work on epoxy systems for electronics encapsulation rather than general-purpose resin chemistry.

This pairing sits closer to the H01L semiconductor-device overlap than to bulk resin claims.
European specialty filers
-71% YoY
Sika latest-year change

Sika and Shin-Etsu are still filing, but slowing

Sika Technology shows 2 filings in the latest year (down 71% year-on-year) and Shin-Etsu Chemical shows 1 (down 94%), indicating these specialty and electronics-materials filers remain nominally active but at a fraction of historical volume.

Small absolute counts make these figures volatile year to year; treat direction, not magnitude, as the signal.
🔍
Under-claimed branches worth a closer look
These sub-areas sit outside the densest classification clusters and show comparatively thin recent filing.
latent anhydride catalystscycloaliphatic amine blendspolyetheramine co-hardener systemstoughening agent graftinglow-Tg flexibilizer chemistries
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Sika Technology AG2-71%
Shin-Etsu Chemical Co., Ltd.1-94%
Sumitomo Bakelite Co., Ltd.10%
Dow Global Technologies LLC0
Toray Industries, Inc.0-100%
The Dow Chemical Company0
Resonac Corporation0-100%
Mitsubishi Gas Chemical Company, Inc.0-100%
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Epoxy Resin Curing Systems covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this

The dataset points to a chemistry where core claims are settled and the open questions sit at the edges — application-specific formulations, catalyst systems and geographic gaps.

Map freedom-to-operate against the densest classes

Before drafting new hardener or resin-composition claims, check overlap with the C08G and C08L clusters specifically, since that is where citation density and family count are both highest.

Explore claim density in Eureka

Watch application-adjacent filing instead of core chemistry

With core amine hardener and anhydride claims largely staked, filing activity in adhesives, laminates and semiconductor encapsulation is a more realistic place to find open claim territory.

Track adjacent-class filings in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Epoxy Resin Curing Systems covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about epoxy resin curing patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Epoxy Resin Curing Systems covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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