Epoxy Resin Interface Engineering Patents: Who Is Still Filing
Filing peaked in 2017 at 508 records and has declined through the most recent full year, a pattern more consistent with a settled claim map than a growing one. Filings ran at 508 in 2017, the peak of the series, fell to 293 by the 2022 midpoint, and stood at 93 in the most recent (partial) year. That trajectory — down through the midpoint rather than up — points to a technology where the core claim space was staked out early rather than one still expanding.
- 1SUMITOMO BAKELITE CO LTD7.0%
- 2RESONAC CORP5.7%
- 3NITTO DENKO CORP3.3%
- 4TORAY INDUSTRIES INC3.2%
- 5SHIN ETSU CHEMICAL CO LTD3.0%
See the full epoxy resin interface engineering analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about epoxy resin interface engineering patents
Why did epoxy resin interface engineering patent filings peak in 2017 and then decline?
The filing trend in this dataset shows a peak of 508 records in 2017, dropping to 293 by the 2022 midpoint and 93 in the most recent tracked year. A decline through the midpoint, rather than a rise, usually signals that the core chemistry — coupling agents, interphase formation, adhesion promoters — was claimed early and the field has since settled into incremental filing. Part of the most recent year's low count is also publication lag, since patent applications typically take about eighteen months to publish, so the true 2025-2026 filing rate is understated in any raw count.
Which companies are still actively filing epoxy interface patents?
Momentum data in this corpus is thin at the top: Shin-Etsu Chemical Co., Ltd. (Shin-Etsu Chemical) shows one filing in the latest year at a flat year-over-year rate, while several other historically active assignees — including Sumitomo Bakelite Co., Ltd. (Sumitomo Bakelite) and Resonac Corporation (Resonac) — show zero filings and a -100% year-over-year change. Others such as Toray Industries, Inc. (Toray), Nitto Denko Corporation (Nitto Denko) and Mitsubishi Gas Chemical Company, Inc. (Mitsubishi Gas Chemical) also register zero in the latest year. This pattern is consistent with a mature filing landscape where large legacy portfolio-holders have slowed rather than a field being actively built out by new entrants.
What does US7544727B2 cover, and does it block encapsulant formulations?
US7544727B2, assigned to Hitachi Chemical, claims an encapsulating epoxy resin molding material combining an epoxy resin, a curing agent, and either a secondary-amino silane coupling agent or a phosphate. It is directed at semiconductor packaging use cases — thin, multi-pin, narrow-pad-pitch or organic-substrate-mounted devices — where the stated benefit is defect-free molding without wire sweep or voids. Whether it blocks a specific formulation depends on the exact coupling-agent chemistry and claim scope of the granted patent, which should be checked directly rather than inferred from the abstract alone.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Epoxy Resin Interface Engineering covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.