Epoxy Resin Miniaturization Patents: Leaders & Filing Trends 2026
- Filings have cooled since 2018. The peak year (96 filings) sits early in the window; by the 2022 midpoint annual volume had fallen to 43, and several major assignees show 0 filings and -100% YoY in the latest year.
- Semiconductor packaging, not adhesives, drives the claim space. H01L (1,357 records) and C08L polymer compositions (1,236) dominate the IPC mix, well ahead of adhesives-specific C09J (316), showing the field is claimed primarily as a packaging problem.
- The most-cited prior art predates the current filing wave by a decade or more. The top-cited records date to the late 1990s and early 2000s, so influence rankings here reward foundational chemistry, not the companies filing today.
Filing growth compares 2021 (54 records) with 2024 (46) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,835 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This dataset tracks patent families where epoxy resin or epoxy formulation claims intersect with underfill, thin-film encapsulation, microelectronic encapsulation or fine-pitch molding language, filtered to the semiconductor-packaging IPC classes (H01L23/29, H01L21/56, C08L63). It is a packaging-chemistry landscape more than a general polymers one: the search deliberately excludes broad epoxy chemistry that never touches a die, a mold compound, or a fine-pitch interconnect.
Coverage runs from 2015 through the 2026-07-31 cut-off. Because publication typically lags filing by around eighteen months, the last one to two years in any trend chart will look thinner than the true filing activity turns out to be once those applications publish.
Filing trends and technology composition
Two views of the same 1,835 families: how filing volume has moved year over year, and which IPC subclasses carry the claim density.
A filing wave that crested in 2018
Annual filings rose to a peak of 96 in 2018, then eased toward the 2022 midpoint of 43 and continued lower into the still-publishing recent years. This is a mature filing pattern rather than an emerging one — most of the foundational claim territory was staked out in the first half of the window.
Packaging classes outweigh pure chemistry classes
H01L (semiconductor devices) and C08L (polymer compositions) each appear in the majority of records, with C08G condensation polymers and C08K additive chemistry close behind. Adhesives-specific C09J and circuit-assembly class H05K appear far less often, indicating that most applicants claim epoxy formulations as part of a device or process, not as a standalone adhesive product.
Shares are the percentage of the 1,835 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Epoxy Resin Miniaturization and Integration with Eureka
This page is one run against one query. Ask Eureka your own question about epoxy resin miniaturization and integration and every answer comes back with the patent numbers behind it.
Try EurekaRepresentative and most-cited filings
Liquid epoxy resin composition for use as mold underfill material for TSV
The filing describes a liquid epoxy resin composition for TSV mold underfill combining an aliphatic epoxy resin, a curing agent, a silica-and-alumina inorganic filler with a specified particle size distribution, and carbon black, aimed at high wiring density parts that need improved heat release and reliability.Filed by SK Hynix Inc., published 2025-01-23 — illustrates current-generation claim drafting for TSV-specific underfill rather than general die-attach epoxy.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US5681757A | Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the prod… | 254 |
| 2 | US6632893B2 | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners | 209 |
| 3 | US6180696B1 | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant | 180 |
| 4 | US7163973B2 | Composition of bulk filler and epoxy-clay nanocomposite | 177 |
| 5 | US5863970A | Epoxy resin composition with cycloaliphatic epoxy-functional siloxane | 160 |
| 6 | US6049124A | Semiconductor package | 158 |
| 7 | US5293067A | Integrated circuit chip carrier | 144 |
| 8 | US6190940B1 | Flip chip assembly of semiconductor IC chips | 117 |
| 9 | US20060154078A1 | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste… | 108 |
| 10 | WO2011157671A1 | Use of cyclic carbonates in epoxy resin compositions | 105 |
Citation counts accumulate over time, so records from the late 1990s and early 2000s lead this table regardless of current commercial relevance — read citation rank as a measure of historical influence, not present-day importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Reading the filing trend and IPC mix together points to a field that consolidated early and is now thinning out at the top of the assignee table.
The wave has passed its crest
From a 2018 peak of 96 filings to a 2022 midpoint of 43, the trend line has been declining for most of the window. The latest-year figure of 3 is partial due to publication lag, but the multi-year direction is unambiguous.
This is a semiconductor-packaging landscape
H01L semiconductor-device claims appear in roughly three-quarters of records, ahead of C08L polymer-composition claims at 1,236. Applicants are patenting epoxy as part of a packaging process or device structure far more often than as a standalone formulation.
Several long-standing filers have gone quiet
Multiple assignees with meaningful filing histories in this space show zero filings in the latest year and -100% year-over-year change. That does not mean the underlying claim territory is abandoned — it likely means recent applications from those filers have not yet published.
US and Japan anchor the filing map
The United States and Japan are the two largest receiving offices, with Europe, China, Taiwan and WIPO/PCT filings following at lower but still substantial volumes. That spread suggests applicants are pursuing multi-jurisdiction protection rather than concentrating on a single home market.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to epoxy resin miniaturization and integration, with the prior art for and against each one.
Assignee landscape and collaboration patterns
The assignee table is long-tailed: a handful of semiconductor materials and packaging specialists carry deep filing histories, and cross-assignee filings cluster around adhesive and memory-packaging partnerships.
Collaboration is limited but concentrated
Only ten co-assignee pairs appear across the dataset, and the strongest of them — a pairing tied to adhesives chemistry — recurs 11 times. This points to a small number of durable supplier-partner relationships rather than broad industry-wide co-filing.
Materials suppliers pair with memory manufacturers
A materials specialist and a memory-device manufacturer co-appear on seven filings, consistent with underfill and mold-compound qualification work being done jointly with the device maker rather than sold as an off-the-shelf formulation.
Historical leaders show no latest-year activity
Several assignees with substantial filing histories register zero filings in the most recent year. Given publication lag, this is more likely a reporting gap than a genuine exit, but it means current rankings undercount whoever is filing right now.
| Assignee | Recent year | YoY |
|---|---|---|
| Resonac Corporation | 0 | -100% |
| Shin-Etsu Chemical Co., Ltd. | 0 | -100% |
| Namics Corporation | 0 | -100% |
| National Starch and Chemical Investment Holding Corporation | 0 | — |
| Sumitomo Bakelite Co., Ltd. | 0 | — |
| General Electric Company | 0 | — |
| Dexerials Corporation | 0 | — |
| Intel Corporation | 0 | — |
Where to take this analysis
The landscape data points to specific next steps depending on whether you are scoping freedom-to-operate or looking for a filing angle.
Check the TSV underfill cluster before drafting claims
The representative 2025 SK Hynix filing shows current drafting style for TSV-specific mold underfill. Any new filing in that exact space needs a close read of filler particle-size and curing-agent claim language already staked out there.
Explore this cluster in EurekaRe-verify assignee activity against live filings
Because several top historical filers show 0 filings and -100% YoY, a rankings snapshot from this dataset alone will understate who is actually active. Cross-check against a live search before concluding a filer has exited the space.
Run a live assignee search in EurekaProbe the under-claimed branches directly
Thermal filler systems, epoxy-clay nanocomposites and flux-integrated no-flow chemistries show thinner density than the core encapsulation clusters. Each is a candidate for a freedom-to-operate check followed by a scoping search.
Search white space in EurekaCommon questions on this landscape
The dataset's assignee ranking is led by a mix of semiconductor materials suppliers and device manufacturers with long filing histories in underfill and mold compound chemistry. Several of these leading filers show zero filings in the most recent year, which is more likely a publication-lag artifact than an actual exit from the space. Because family counts equal document counts here (1,835 records across 1,835 families), the ranking reflects genuinely distinct filings rather than continuation inflation.
Filing volume peaked at 96 in 2018, fell to 43 by the 2022 midpoint, and continues lower into the most recent years shown. This pattern is typical of a field where the core claim territory — basic underfill formulations, standard filler systems, common curing chemistries — was staked out early, leaving less open ground for new filings. It does not mean the underlying technology has stopped being used commercially; dense prior art can suppress new filing activity even while products keep shipping.
Underfill patents typically claim the epoxy formulation that fills the gap between a flip-chip die and its substrate, focusing on flow behavior, filler loading and curing speed. Thin-film encapsulation patents instead claim thinner protective epoxy layers over a device surface, often prioritizing moisture barrier properties and low-stress cure profiles. Both fall inside this dataset's search scope, and IPC codes H01L23/29 and H01L21/56 capture claims from either approach depending on how the applicant structured the packaging process.
The United States leads as a receiving office with 523 records, followed by Japan at 335, Europe (EPO) at 215, China at 177, Taiwan at 143, and WIPO/PCT filings at 131. This spread reflects the semiconductor supply chain's geography — materials development concentrated in the US and Japan, with manufacturing-adjacent filings in Taiwan and China, and PCT filings used for later multi-jurisdiction protection.
Based on relative claim density across sub-branches, thinner areas include low-temperature curing systems tuned for TSV underfill, carbon-black-loaded thermal filler formulations, fine-pitch mold compound rheology control, epoxy-clay nanocomposite fillers, and flux-integrated no-flow underfill chemistries. These sit adjacent to the dense core clusters (basic underfill, standard mold compounds) rather than being wholly new territory, so a freedom-to-operate check is still warranted before filing. High density elsewhere in this landscape means claim space is occupied, not that every adjacent branch is equally crowded.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.