Epoxy Resin Process Automation Patents: Trends & Leaders 2026
- Flat filing since the 2022 peak. Filings hit 6 in 2022 and have not exceeded that since, with the most recent year still undercounted by publication lag.
- Condensation-chemistry claims dominate the IPC mix. C08G appears in all 169 families, but C08L, C08K and C09J compositions each carry a large share, showing formulation and additive claims are as contested as the base resin chemistry.
- No assignee shows recent-year momentum. Every tracked assignee, including established composite and laminate filers, logged zero filings in the latest year — a sign the field is between filing cycles rather than accelerating.
Filing growth compares 2021 (4 records) with 2024 (3) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 169 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This dataset tracks patent families at the intersection of epoxy resin formulation and the automation used to process it — automated dispensing, resin metering, reactive processing control and related process-control claims — filed between 2015 and mid-2026. The search combines resin-chemistry text terms with automation-specific claim language and IPC codes spanning condensation polymer chemistry (C08G59), continuous or automatic control of shaping processes (B29C31) and general-purpose digital process control (G05B19/418).
169 families is a modest but tightly defined corpus: it captures where resin chemistry claims meet process-automation claims specifically, rather than the much larger universe of epoxy resin patents generally. Reading it alongside the broader IPC composition below shows how much of the filing activity actually lives in formulation and additive claims rather than in the control hardware itself.
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Filing trend and technology composition
Two views of the same 169 families: how filing volume has moved year over year, and which IPC subclasses carry the claims.
A flat curve since the 2022 peak
Filings rose from 2 in 2017 to a peak of 6 in 2022, then have not grown past that mark. Because publication lags filing by roughly 18 months, the last one to two years understate true activity — but the multi-year plateau through the peak itself is a genuine signal, not an artefact of the lag.
Formulation and adhesive claims outweigh control hardware
C08G (condensation polymers) appears across the full corpus by construction of the search, but C08L (polymer compositions, 81 records), C08K (additives, 46) and C09J (adhesives, 41) each account for a substantial share. B32B (laminates, 22) and H05K (printed circuit assemblies, 14) mark the smaller, more applied end of the distribution — evidence that most contested claim space is in what goes into the resin and how it bonds, not in the automation hardware alone.
Shares are the percentage of the 169 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Epoxy Resin Process Automation with Eureka
This page is one run against one query. Ask Eureka your own question about epoxy resin process automation and every answer comes back with the patent numbers behind it.
Try EurekaRepresentative and most-cited filings
US20020009581A1 — Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus for preparing the same
Filed by Toray Industries, this filing claims an epoxy resin composition and yarn prepreg defined by fiber-bundle weight content, filament count and a derived ratio between them, aimed at improving unwindability, drapability and post-cure tensile strength for fiber-reinforced composites.Abstract text and claim ranges are reproduced from the original filing; boundary values in the formulae are load-bearing for scope and should be checked against the granted claims, not the published application, before relying on them.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US5863970A | Epoxy resin composition with cycloaliphatic epoxy-functional siloxane | 160 |
| 2 | US5041358A | Negative photoresist and use thereof | 124 |
| 3 | JP1991026750A | Fiber-reinforced composite material | 113 |
| 4 | US20050159511A1 | Heat-curable eproxy resin composition | 83 |
| 5 | US6673441B1 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and s… | 62 |
| 6 | US6228474B1 | Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus fo… | 62 |
| 7 | US20030145949A1 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and s… | 53 |
| 8 | WO1998033645A1 | Die adhesive or encapsulant of epoxy siloxane and polyepoxy resin | 51 |
| 9 | US5780117A | Dual-cure latex compositions | 50 |
| 10 | US20020009581A1 | Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus fo… | 41 |
Citation counts favour older filings inside any searched corpus — they are a signal of influence on later filers, not a ranking of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers say about the field
Three readings of the same 169-family corpus, each pointing at a different decision a filer or licensor would need to make.
Growth has flattened, not accelerated
The filing count rose modestly from 2017 and topped out at 6 in 2022, with no year since exceeding that level. Combined with the publication lag, this reads as a mature, low-volume niche rather than an emerging one.
Formulation claims outnumber control claims
Nearly half the corpus carries a C08L polymer-composition tag alongside the base C08G chemistry, and C08K additive claims appear in 46 records. Process-automation claims sit on top of a formulation layer that is itself densely claimed.
US and EPO carry most of the filing volume
The United States leads receiving offices with 51 records, ahead of Europe at 33 and Japan at 28; WIPO PCT filings (17) and the smaller India and Australia counts point to a corpus still concentrated in three jurisdictions rather than spread globally.
Collaboration is rare and thin
Only three co-assignee pairings appear in the data, and the strongest links five shared families — modest by the standards of a jointly developed technology. Most filings in this space are solo efforts rather than joint development.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to epoxy resin process automation, with the prior art for and against each one.
| Assignee | Co-assignee | Shared families |
|---|---|---|
| Enichem S.p.A. | Enirisorse S.p.A. | 5 |
| Resonac Corporation | Hitachi, Ltd. | 1 |
| Planeteers Microparticle Corporation | DERSHEM STEPHEN M | 1 |
The strongest co-assignee link in this corpus pairs Enichem S.p.A. with Enirisorse S.p.A. across 5 shared families — the only pairing in the dataset with more than a single shared filing.
Who is filing, and where the field is still open
Recent-year momentum figures show a field between filing cycles: no tracked assignee, including large composite and laminate producers, filed in the latest year. That does not mean the space is closed — it means the openings sit in specific sub-areas rather than in a race between active filers.
Cytec Industries Inc. (Cytec)
Appears in the historical filing record for fiber-reinforced composite chemistry but shows no filings in the most recent tracked year, consistent with the corpus-wide plateau.
Shengyi Technology Co., Ltd. (Shengyi Technology)
A laminate-side filer whose activity in this specific automation-plus-epoxy intersection has gone quiet in the latest tracked year, mirroring the broader plateau in filing volume.
Toray Industries, Inc. (Toray Industries)
Toray's representative filing in this corpus dates to 2002; the company shows no recent-year activity here, though its historical filings remain among the field's reference points for fiber-reinforced epoxy composition claims.
| Assignee | Recent year | YoY |
|---|---|---|
| Cytec Industries Inc. | 0 | — |
| WARREN DANNY | 0 | — |
| Resonac Corporation | 0 | — |
| WARREN ENVIRONMENTAL INC | 0 | — |
| Shengyi Technology Co., Ltd. | 0 | — |
| Toray Industries, Inc. | 0 | — |
| International Business Machines Corporation (IBM) | 0 | — |
| Nisshinbo Holdings Inc. | 0 | — |
Where to take this analysis
The dataset behind this page can be filtered and queried further inside Patsnap Eureka for questions specific to your own filing strategy.
Check freedom to operate on a specific formulation
Cross-reference a candidate additive or metering ratio against the C08K and C08L subsets to see how densely a specific composition is already claimed.
Explore in EurekaTrack the assignees most active in laminate and substrate automation
Follow filing activity from laminate-side and PCB-substrate assignees to see whether the current lull in recent-year filings breaks in either direction.
Explore in EurekaRead the most-cited filings in full before drafting claims
The most-cited records in this corpus, several from the 1990s and early 2000s, still anchor prior-art searches in cycloaliphatic and photoresist-adjacent epoxy chemistry.
Explore in EurekaCommon questions about this landscape
This dataset identifies 169 patent families published between 2015 and mid-2026 that combine epoxy resin chemistry claim language with automated dispensing, resin metering or process-control claims. That figure reflects one specific search definition combining text and IPC criteria, so a broader or narrower query would return a different count. Because publication lags filing by roughly 18 months, the true number of families filed in the last one to two years is understated in any count taken today.
Filing volume rose slowly from 2 records in 2017 to a peak of 6 in 2022, and has not exceeded that peak since. Recent-year momentum data shows every tracked assignee, including established composite and laminate producers, with zero filings in the most recent year. Given the publication lag this likely overstates the slowdown somewhat, but the multi-year plateau through the 2022 peak is a real pattern, not just a lag artefact.
The corpus shows filing activity spread across composite-material, laminate-substrate and adhesive specialists rather than concentrated in a single dominant filer, and collaboration between assignees is limited to three identified co-assignee pairs. The strongest of those links five shared families between two co-assignees, well below what you would expect from a jointly developed core technology. This points to a fragmented ownership picture where no single company controls the intersection of resin chemistry and process automation outright.
The IPC composition thins out noticeably below the core C08G and C08L chemistry codes: printed-circuit assembly applications (H05K, 14 records) and layered-laminate applications (B32B, 22 records) carry far fewer claims than the additive and adhesive codes above them. Sub-areas such as in-line viscosity feedback, automated multi-part metering ratios and closed-loop dispense-rate correction show up rarely relative to the base chemistry claims that surround them. A freedom-to-operate search focused specifically on those control-loop mechanics, rather than the resin formulation itself, is likely to find less prior art blocking a new claim.
US20020009581A1, filed by Toray Industries, claims a yarn prepreg and epoxy resin composition defined by specific numeric relationships between fiber-bundle weight content, filament count and a derived ratio between them. Its scope is tied to those defined formulae rather than to epoxy chemistry or process automation broadly, so it constrains fiber-reinforced prepreg compositions that fall within those specific numeric ranges. Anyone designing a fiber-reinforced epoxy prepreg with fiber content or filament-count ratios outside the claimed formulae, or without the specific drapability and unwindability limitations, would sit outside its literal claim scope, though a full freedom-to-operate check should confirm this against the granted claim set.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.