Book a demo

Epoxy Resin Quality Control Patents: Leaders, Trends & White Space 2026

Epoxy Resin Quality Control Patents: Leaders, Trends & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/epoxy-resin-quality-control-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Polymers & Composites · Patent Landscape
Epoxy Resin Quality Control Patents: Cure Monitoring, Viscosity Control and Defect Detection
  • Filing has plateaued, not grown. the peak year so far is 2021 at 10 families, and the 2022 midpoint matches it — this is a flat field, not an expanding one.
  • Claim density sits overwhelmingly in one IPC bucket. C08G condensation-polymer chemistry covers 524 of 536 records, while adjacent process and inspection classes (H05K, C08F) are comparatively thin.
  • No tracked assignee filed in the latest year. every major name in the momentum data — including Dow Chemical Company and BASF Coatings GmbH — shows zero recent-year filings, consistent with the 18-month publication lag rather than exit.
Get a prior-art report on your approach
536
Published Records
26%
Top-5 Share of All Records
-50%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (10 records) with 2024 (5) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 536 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This landscape tracks 536 patent families published between 2015 and mid-2026 that combine epoxy resin chemistry with quality-control practice — cure monitoring, viscosity control and defect detection — under IPC classes spanning condensation polymer chemistry (C08G59), thermal analysis (G01N25) and moulding processes (B29C37). The scope is deliberately narrow: it is not all epoxy resin filings, but the subset where the claim language ties resin formulation directly to a measurable process or quality check.

Filing offices cluster in the United States, Japan and Europe, with WIPO PCT and UK filings forming a smaller secondary tier — a pattern typical of an established industrial chemistry rather than an emerging one.

Filing activity and technology composition, 2015–2026
  1. 1TORAY INDUSTRIES INC37
  2. 2GENERAL ELECTRIC CO33
  3. 3THE DOW CHEM CO33
  4. 43M CO18
  5. 5EI DU PONT DE NEMOURS & CO17
  6. 6BASF COATINGS GMBH15
  7. 7DOW GLOBAL TECHNOLOGIES LLC13
  8. 8UNION CARBIDE CORP13
  9. 9AMOCO CORP12
  10. 10BASF CORPORATON12
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Epoxy Resin Quality Control covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Let an AI agent run this analysis on your own technology

Pick a task. Every answer cites the patents behind it.

10,000 free credits to start
The data

Filing trend and technology composition

Two views of the same 536-family dataset: how filing volume has moved year over year, and how those filings distribute across IPC subclasses.

Filing trend, 2017–2026

Annual filings rose from 8 in 2017 toward a peak of 10 in 2021, held at 10 through the 2022 midpoint, and have not exceeded that level since. The 2026 figure of 0 reflects the partial year and publication lag rather than a genuine drop-off; expect upward revision as later filings publish.

Filing trend, 2017–20260358108201720182019202010202110202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

IPC composition

C08G (condensation polymers) dominates at 524 of 536 records, essentially co-extensive with the search scope itself. C08L (polymer compositions, 292), C09D (coatings, 127) and C08J (polymer processing, 126) form a clear second tier, while C09J (adhesives, 84), C08F (addition polymers, 72) and H05K (printed circuits, 47) mark the outer, thinner edges of the field.

IPC compositionC08G · Condensation polymers52497.8%C08L · Polymer compositions29254.5%C09D · Coatings, paints & inks12723.7%C08J · Polymer processing & solutions12623.5%C08K · Use of additives in polymers10319.2%C09J · Adhesives8415.7%C08F · Addition polymers (vinyl etc.)7213.4%H05K · Printed circuits & assemblies478.8%Other31558.8%

Shares are the percentage of the 536 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Epoxy Resin Quality Control covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on Epoxy Resin Quality Control with Eureka

This page is one run against one query. Ask Eureka your own question about epoxy resin quality control and every answer comes back with the patent numbers behind it.

Try Eureka
Key patents

Most-cited prior art and a representative recent filing

Representative recent filing
US20230416521A12023-12-28

US20230416521A1 — Thermosetting epoxy resin composition, molded article, and fiber-reinforced composite production method

TORAY INDUSTRIES, INC.

Filed by TORAY INDUSTRIES, INC., this application claims a thermosetting epoxy resin composition combining an epoxy resin, an isocyanate curing agent held to a defined stoichiometric ratio, and additional components, aimed at cured products that hold both toughness and high stiffness — a combination the abstract frames as difficult to achieve together.Abstract trimmed for length; stoichiometric ratio and component definitions are claim-critical.

View full record
Most-cited records in this landscape
#Publication no.Patent titleCitations
1US4069055APhotocurable epoxy compositions containing group Va onium salts1,296
2US4058401APhotocurable compositions containing group via aromatic onium salts563
3EP0249201A2High solids sag resistant cycloaliphatic epoxy coatings containing low molecular weight high Tg organic polym…371
4US4216288AHeat curable cationically polymerizable compositions and method of curing same with onium salts and reducing …317
5US4778851ARubber-modified epoxy compounds311
6US4212781AModified epoxy resins, processes for making and using same and substrates coated therewith291
7US4138255APhoto-curing method for epoxy resin using group VIa onium salt286
8US4442197APhotocurable compositions282
9US4026705APhotocurable compositions and methods219
10WO2003066704A1Oligomeric chain extenders for processing, post−processing and recycling of condensation polymers, synthesis,…189

Citation counts favour older filings by construction — a searched corpus accumulates citations over time — so read this table as a map of foundational chemistry, not of current competitive priority.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Epoxy Resin Quality Control covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Run it yourself

Put your own technology through the same analysis

 
Where to run it
Fastest

Eureka on the web

When you want the answer in the next five minutes.

The agent works the prompt against patents and technical literature, citing every source.

Run your analysis now →
For builders

MCP server & REST API

When it has to run inside your own pipeline.

Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.

Browse MCP servers →
Insights

What the numbers mean for filing strategy

Three read-throughs from the trend, composition and citation data above.

Filing momentum
Peak 2021 = 10; 2022 midpoint = 10
families/year

A mature, not a growing, field

The absence of growth past the 2021 peak suggests the core chemistry-to-QC claim space is largely staked out. New entrants are more likely to find room in adjacent process integration than in the core resin-plus-monitoring claim itself.

Trend data, 2017–2026
Claim concentration
C08G = 524 of 536 records
share of dataset

One IPC bucket carries nearly the whole field

With C08G covering 98% of records, differentiation inside this landscape happens at the level of specific curing agents, ratios and additive systems, not at the level of broad resin-monitoring concepts — those are already occupied.

IPC composition
Prior art depth
US4069055A cited 1,296 times
citation count

Foundational onium-salt cure chemistry still anchors the field

The most-cited records date to photocurable and cationic cure chemistry from the late 1970s and 1980s. Their persistence as citation anchors signals that cure-triggering chemistry, not measurement instrumentation, is the doctrinal center of this space.

Most-cited records
Collaboration signal
10 co-assignee pairs identified
paired filings

Collaboration is narrow and vendor-specific

Co-assignee activity concentrates around a small number of individual-inventor pairings inside a few large filers, rather than broad cross-company joint filing — consistent with in-house formulation work rather than open co-development.

Co-assignee pairs
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to epoxy resin quality control, with the prior art for and against each one.

Find the white space →
Collaboration patterns
AssigneeCo-assigneeShared families
E. I. du Pont de Nemours and Company (DuPont)RAJENDRAN GOVINDASAMY PARAMASIVAM7
BASF Coatings GmbHVILLALOBOS MARCO A3
BASF Coatings GmbHTAZZIA CHARLES L3
BASF Coatings GmbHHARRIS PAUL J3
Dow Global Technologies LLCHEFNER ROBERT E JR3
Dow Global Technologies LLCLUDOVIC VALETTE2
Dow Global Technologies LLCEARLS JIM D2
Dow Global Technologies LLCCARSON TERRI J2

The strongest co-assignee pairing links E. I. du Pont de Nemours and Company (DuPont) with an individual inventor across seven records; the next tier links BASF Coatings GmbH with two individual inventors at three records each.

Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Epoxy Resin Quality Control covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claim space

Filing activity concentrates among a handful of established materials and chemicals companies, with a long tail of single- or few-filing entities behind them.

Incumbent depth
0 filings in latest year
across all tracked leaders

Every major assignee shows zero recent-year filings

Toray Industries, Inc., Dow Chemical Company, E. I. du Pont de Nemours and Company (DuPont), 3M Company, BASF Coatings GmbH and General Electric Company all register zero filings in the most recent tracked year — a pattern the 18-month publication lag explains better than a genuine pullback.

Momentum data
Filing office spread
US 131 · Japan 113 · EPO 107
receiving offices

Three-region filing strategy, no single dominant office

The United States, Japan and Europe each account for a comparable share of filings, with WIPO PCT, the UK and Canada forming a smaller secondary tier — indicative of deliberate multi-region protection rather than a single home-market focus.

Receiving office data
Concentration vs. tail
536 families total
dataset size

A recognizable core group plus a long tail

A small set of chemicals and materials majors — including Dow Global Technologies LLC, Amoco Corporation, Union Carbide Corporation and Borden Chemical, Inc. — recur across the dataset, but the bulk of the 536 families trace to single- or few-filing entities, typical of a chemistry where formulation know-how is dispersed across many smaller players.

Assignee ranking
🔍
Under-claimed sub-areas worth checking before filing
These branches show thin coverage relative to the core C08G cure chemistry and may offer more open claim space.
in-line viscosity sensing during resin transferreal-time cure-state feedback for fiber-reinforced compositesprinted-circuit-board epoxy defect imagingadditive-driven cure-rate tuning for adhesivesnon-contact defect detection in cured laminates
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Toray Industries, Inc.0
General Electric Company0
Dow Chemical Company0
E. I. du Pont de Nemours and Company (DuPont)0
3M Company0
BASF Coatings GmbH0
Dow Global Technologies LLC0
Amoco Corporation0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Epoxy Resin Quality Control covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this landscape

The dataset points to where claim space is dense and where it is not. The next step is usually one of these.

Map a specific curing-agent system against prior art

Run the stoichiometric ratio and curing-agent combination from a target formulation against the most-cited onium-salt and cationic cure patents to check for freedom to operate.

Explore in Patsnap Eureka →

Track the recent-year publication gap

Re-pull the filing trend in six months once 2025–2026 filings clear the publication lag, to see whether the 2021 peak has actually been exceeded.

Explore in Patsnap Eureka →

Scope a white-space filing in defect detection

Use the under-claimed sub-areas identified here as a starting point for a first claim in non-contact or in-line inspection, where C08G coverage is thinner.

Explore in Patsnap Eureka →
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Epoxy Resin Quality Control covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about epoxy resin quality control patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Epoxy Resin Quality Control covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Research Epoxy Resin Quality Control in depth with Eureka

Go past this page: query the whole epoxy resin quality control corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.

Try Eureka

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

Help us improve this page

Found incorrect or outdated information? Let us know and we'll get it fixed.