Fan Out Packaging and Molded Reconstitution Patents
67.8% concentration. The top 5 assignees hold 103 of 152 records in scope — a field where claim space is already staked out by a small group. Filings rose from 2 in 2017 to a peak of 31 in 2025, but the comparable year-over-year figure — 18 in 2021 against 18 in 2024 — shows 0% growth across that span. Because publication lags filing by roughly 18 months, the 2025 and 2026 counts are still incomplete and should not be read as a downturn.
- 1INNOLUX CORP50
- 2TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD21
- 3SAMSUNG ELECTRONICS CO LTD13
- 4INTEL CORP11
- 5BOE TECHNOLOGY GROUP CO LTD8
See the full fan out packaging and molded reconstitution analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
Who holds the most patents in fan out packaging and molded reconstitution?
The ranking covers 26 companies, and it is heavily front-loaded: the leading assignee alone holds 50 of the 152 records in scope, compared with 8 at fifth place and 4 at tenth place. Combined, the top 5 assignees account for 67.8% of all records, and the top 10 account for 85.5%. That means freedom-to-operate work in this space should focus first on the handful of leaders rather than spreading effort evenly across all 26 ranked companies.
Is fan out packaging patent filing activity growing or slowing down?
Filings grew from 2 in 2017 to a peak of 31 in 2025, but the more reliable year-over-year comparison — 18 filings in 2021 versus 18 in 2024 — shows 0% growth across that span, meaning the field plateaued rather than kept accelerating. Because patent publication lags filing by roughly 18 months, the apparent drop in 2025-2026 figures is largely an artefact of incomplete data rather than a genuine slowdown. Anyone citing a decline for years after 2024 should treat that claim with caution until later data fills in.
What does US11728291B2 actually cover?
US11728291B2, assigned to Taiwan Semiconductor Manufacturing Company Limited and granted 2023-08-15, claims a semiconductor arrangement in fan out packaging where a magnetic structure with tapered-sidewall top, bottom and side portions surrounds a transmission line coupled to the die's integrated circuit, sitting above the molding compound and die. It is a structural claim tied specifically to magnetic shielding geometry around an RF or signal transmission line in a fan-out package, not a claim over fan out packaging or molded reconstitution generally. Designs that route transmission lines without a comparable enclosing magnetic structure, or that use a materially different magnetic geometry, sit outside its literal scope.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Fan Out Packaging and Molded Reconstitution covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.