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Run your analysis now →Filing growth compares 2021 (19 records) with 2024 (34) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,090 records in scope (CR5), not by the ranked leaders only.
Fiber laser reliability and durability patenting sits at the intersection of laser physics, precision measurement and semiconductor manufacturing. The dataset behind this page spans 1,090 patent families filed between 2017 and 2026, drawn from records that combine fiber or fibre laser terminology with explicit reliability, long-term stability or component durability language in the title, abstract or claims. That combination narrows the field to inventions addressing failure modes, lifetime performance and stability under operating stress, rather than general laser design.
Filing activity peaked in 2018 and has since flattened, with the most recent full years sitting below the midpoint level. Because publication typically lags filing by around 18 months, the last one to two years in any trend chart will understate true filing volume; treat the tail as provisional rather than a genuine drop-off.
Two views of the same 1,090 families: when the inventions were filed, and which technical subclasses they claim into.
Filings opened the window at 58 in 2017, rose to a peak of 69 in 2018, and had eased to 44 by the 2022 midpoint. The partial 2026 count of 2 reflects publication lag, not a sudden halt in R&D.
G03F (photolithography and photomechanics) leads at 302 records, closely followed by H01S (lasers and stimulated emission) at 278 — together confirming that reliability claims in this corpus are as much about manufacturing tool durability as about the laser cavity itself. G01B measurement, H01L semiconductor devices and G02B optical elements each carry a meaningful secondary share.
Shares are the percentage of the 1,090 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about fiber laser reliability and durability and every answer comes back with the patent numbers behind it.
Try EurekaThe filing describes a mode-locked fiber laser cavity built around a SESAM and a polarization-maintaining, highly-doped active fiber, with an isolator protecting the cavity from back reflections and fiber properties tuned to manage dispersion and nonlinear effects for stable ultrashort-pulse generation.WO2019030601A1 — FYLA LASER, S.L., published 2019-02-14.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20070288121A1 | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, ex… | 595 |
| 2 | US5818630A | Single-mode amplifiers and compressors based on multi-mode fibers | 581 |
| 3 | US20080094592A1 | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure met… | 344 |
| 4 | US5627848A | Apparatus for producing femtosecond and picosecond pulses from modelocked fiber lasers cladding pumped with b… | 285 |
| 5 | US20050111500A1 | Utilization of Yb: and Nd: mode-locked oscillators in solid-state short pulse laser systems | 245 |
| 6 | US20040213302A1 | Pulsed laser sources | 232 |
| 7 | US20120287418A1 | High-Accuracy Mid-IR Laser-Based Gas Sensor | 198 |
| 8 | US20080094593A1 | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure met… | 187 |
| 9 | US6275512B1 | Mode-locked multimode fiber laser pulse source | 165 |
| 10 | US20080094594A1 | Movable body system, pattern formation apparatus, exposure apparatus and exposure method, and device manufact… | 158 |
Citation counts favour older, foundational filings within this searched corpus; treat them as a signal of influence on the field, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Reading the filing trend and technology split together points to a field that has already staked out its core claim territory.
The 2018 peak of 69 filings has not been matched since; the 2022 midpoint of 44 sits well below it, and the trend line points down even before accounting for publication lag on the final years.
Photolithography/photomechanics and core laser physics together dominate the IPC split, meaning reliability claims are frequently tied to exposure-tool uptime and cavity-level stability rather than standalone fiber component wear.
With 453 US records against 183 at the EPO and 101 through WIPO's PCT route, reliability-focused fiber laser IP has been built predominantly around US protection, with Hong Kong, Germany and Austria as smaller secondary venues.
Only ten co-assignee pairs appear in the dataset, with the strongest links all involving the same single organisation paired with different named inventors, suggesting concentrated internal teams rather than broad industry cross-filing.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to fiber laser reliability and durability, with the prior art for and against each one.
Recent-year filing activity has gone quiet across the named assignees tracked in this dataset, each showing zero filings in the latest year — consistent with the broader flat-to-declining trend and the effect of publication lag.
Across more than a thousand families, the named organisations tracked for recent momentum all show zero filings in the latest year, reinforcing that this is a field consolidating around established filings rather than one seeing fresh entrants push volume up.
The strongest co-assignee relationships in the dataset pair one organisation with individual named inventors at counts of six, rather than showing cross-company joint filings — a pattern typical of a single R&D group protecting its own cavity and component designs.
Filings cluster heavily in the United States and Europe, with Hong Kong, Germany and Austria serving as smaller secondary venues rather than independent filing hubs, which narrows where competitive clearance work needs to focus.
| Assignee | Recent year | YoY |
|---|---|---|
| Nikon Corporation | 0 | — |
| IMRA America, Inc. | 0 | — |
| The Board of Trustees of the Leland Stanford Junior University | 0 | — |
| William Marsh Rice University | 0 | — |
| Raytheon Company | 0 | — |
| Contemporary Amperex Technology Co., Ltd. (CATL) | 0 | — |
| Sciencetronics Co., Ltd. | 0 | — |
| LSP Technologies, Inc. | 0 | — |
The filing trend and technology split point to specific next steps depending on whether the goal is clearance, licensing or new filing strategy.
With G03F and H01S carrying the heaviest claim load, any new filing in exposure-tool reliability or core cavity stability should be checked against this concentration before drafting.
Explore the IPC breakdownThe drop to 2 filings in the latest partial year is very likely a publication-lag artefact rather than a real halt; revisit the trend once 18 months have passed to see the corrected picture.
Track the filing trendSplice fatigue monitoring, SESAM degradation compensation and related sub-areas show thin coverage relative to the core classes, which is where a narrowly drafted first claim has the best odds of standing alone.
See the white space chipsThis dataset identifies 1,090 patent families filed between 2017 and 2026 that combine fiber or fibre laser terminology with explicit reliability, long-term stability or component durability language. That figure counts families rather than raw publications, which gives a fairer view of distinct inventions once continuations and multi-jurisdiction duplicates are removed. The true current total is likely somewhat higher because the most recent one to two years are understated by publication lag.
No, not on the evidence here. Filings peaked at 69 in 2018, had eased to 44 by the 2022 midpoint, and the trend line points down rather than up. Some of the apparent decline in the final years is an artefact of the roughly 18-month gap between filing and publication, but even accounting for that, the field looks flat-to-declining rather than accelerating.
G03F, covering photolithography and photomechanics, leads with 302 records, closely followed by H01S, covering lasers and stimulated emission, at 278. That pairing shows reliability claims in this corpus are often tied to exposure-tool uptime in semiconductor manufacturing as much as to the fiber laser cavity itself. G01B measurement and H01L semiconductor device classes carry meaningful secondary volume.
The United States is the dominant venue with 453 records, more than double the European Patent Office's 183. WIPO's PCT route accounts for 101 filings, with Hong Kong, Germany and Austria trailing as smaller secondary jurisdictions. Anyone doing freedom-to-operate work in this space should prioritise US prior art first, then extend to EPO and PCT families.
Branches adjacent to the dense G03F and H01S core show comparatively thin coverage, including fiber splice fatigue monitoring, SESAM degradation compensation, back-reflection isolator lifetime testing and cladding-pump thermal cycling. These sit close enough to the core technology to be commercially relevant but are not yet crowded with competing claims. A narrowly drafted first claim in one of these areas has a better chance of standing without immediately colliding with prior art than a filing aimed squarely at the core classes.
Go past this page: query the whole fiber laser reliability and durability corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.
Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.