Fiber to Chip Coupling Patents: Top Companies & Trends 2026
Fiber to Chip Coupling Patents: Who Leads and Where the Gaps Sit
Filing is concentrated but not locked up: the top 5 assignees hold 22.2% of all 6,368 records in scope, and the top 10 hold 32.1% — leaving most of the field to single- or few-filing entrants. Filings rose from 408 in 2017 to a peak of 549 in 2021, then eased to 350 by 2024 — a 36% decline over that three-year span. 2025 and 2026 figures are shown but understated, since publication typically lags filing by around 18 months.
- 1CISCO TECHNOLOGY INC6.9%
- 2TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD4.9%
- 3META PLATFORMS TECHNOLOGIES LLC4.2%
- 4INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW)3.3%
- 5QUANTUM SI INC3.0%
See the full fiber to chip coupling analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on fiber to chip coupling patents
Who holds the most fiber to chip coupling patents?
The assignee ranking in this dataset spans 100 companies, with the leader holding 439 records against 189 for the fifth-place assignee — a meaningful gap that signals a sustained, deliberate filing program rather than incidental activity. The leaders include large semiconductor foundries and networking equipment makers alongside academic and research-centre filers. No single company controls the field: the top 5 combined hold only 22.2% of all 6,368 records, leaving substantial room for other filers.
Is the fiber to chip coupling patent field growing or shrinking?
Filing activity peaked in 2021 at 549 records and had fallen to 350 by 2024, a 36% decline over that three-year span. That is a real pullback from an unusually active year rather than an abandonment of the technology. The 2025 and 2026 figures in the trend line should be read cautiously, since patent publication typically lags filing by around 18 months and those years are still filling in.
What is the difference between edge couplers and grating couplers in the patent literature?
Both are structural approaches to getting light between a fiber and a photonic chip, and both appear heavily in this dataset’s search terms alongside coupling efficiency and alignment tolerance claims. Grating couplers use periodic structures etched into the waveguide layer to diffract light vertically, while edge couplers taper the waveguide to match the fiber’s mode at the chip’s facet. The representative filing in this dataset, US12591095B2, combines both coupler types on a single semiconductor layer, which is itself a sign that integration of the two approaches is an active area of claim activity.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Fiber to Chip Coupling covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.