Filamentous Fungi Stress Tolerance Patents: Leaders & Trends 2026
Filamentous Fungi Stress Tolerance Patents: Who Leads and Where Filing Is Heading
Concentrated at the top. The five leading assignees hold 236 of 717 records in scope (32.9%), with a long tail of single- and few-filing entrants behind them. Filings rose from 25 records in 2017 to a peak of 47 in 2019. From 2021's 34 records to 2024's 9, the recorded drop is -74% — the last year that can be read as a complete filing year, since publication lags filing by roughly 18 months and 2025-2026 will still fill in.
- 1DANISCO US INC82
- 2ZYMERGEN INC43
- 3DSM IP ASSETS BV38
- 4BASF ENZYMES LLC37
- 5SUGEN INC36
See the full filamentous fungi stress tolerance analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on this landscape
Who are the leading patent holders in filamentous fungi stress tolerance?
The assignee ranking in this dataset covers 100 companies, with the leading assignee holding 82 of the 717 records in scope and the fifth-ranked holder at 36. The top five combined account for 236 records, or 32.9% of all records in scope, while the remaining ranked companies hold progressively smaller counts down to single-digit filings. This head-and-tail structure means a licensing or FTO review should prioritise the leader group first, then check the long tail for narrower, more specific claims that the leaders may not cover.
Is patent filing in this field growing or shrinking?
Filing peaked at 47 records in 2019 and has declined since; the 2021-to-2024 window shows a drop from 34 to 9 records, a -74% move. Because publication lags filing by roughly 18 months, the 2025 and 2026 figures in any chart will still be filling in and should not be read as confirming a continued decline. Treat 2024 as the most recent year with a reasonably complete count.
What does US20190376070A1 actually cover?
US20190376070A1, filed by Zymergen Inc. and published in December 2019, claims a high-throughput genomic engineering method and system for producing filamentous fungal strains with altered morphology or growth under specified conditions. It is a platform-level claim around screening and strain selection rather than a single stress-tolerance mechanism, which makes it relevant to anyone using HTP screening workflows on filamentous fungal hosts. Reviewing its specific claim language against your own screening pipeline is a reasonable first check before assuming freedom to operate in this area.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Filamentous Fungi Stress Tolerance covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.