Fine-Pitch Bonding Patents: Leaders, Trends & White Space 2026
- A four-way race with no runaway leader. the top-ranked assignee holds 4 records against a fifth-place count of 2 and a tenth-place count of 1 — no single company dominates fine-pitch bonding claims.
- Filing has gone quiet, not extinct. 2021 to 2024 shows a -100% change, but 2024 is the last complete year in this data cut and 2025 onward is still filling in behind an 18-month publication lag.
- Claims cluster hard in semiconductor devices. H01L covers 70.6% of the 17 records in scope, while adhesives, printed-circuit assembly and optical modulation each sit at 5.9% — thin, and worth checking before you assume they're crowded.
Filing growth compares 2021 (2 records) with 2024 (0) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field.
What this landscape covers
Fine-pitch bonding is the mechanical and electrical interface problem that sits between a micro LED die and its receiving substrate: how to hold bonding force, contact resistance and coplanarity within tolerance at pitches small enough for a display panel, while still allowing rework of a defective die. The scope here runs from 2015 to the 2026-07-31 cut-off, pulling records that combine micro LED or anisotropic conductive bonding terms with bonding-force, coplanarity, contact-resistance-uniformity, low-temperature-bonding or rework-capability language in the claims or description.
The set is small — 17 published records — which is itself informative: this is a specific interconnect problem, not a broad display category, and the claim space has not yet attracted mass filing.
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Filing trend and technology composition
Two views of the same 17-record set: filings by year, and where those records sit across IPC subclasses. Because a single record can carry more than one classification, the subclass shares below add up to more than the record total — that is expected and not a data error.
Filing trend, 2017-2026
Filings peaked at 4 in 2018 and had fallen to 0 by 2026, but 2026 is a partial year and 2024 is the last year this dataset can treat as complete. Read the 2021-to-2024 span (-100%) as the reliable growth figure; anything after 2024 is still arriving under the roughly 18-month publication lag.
IPC subclass composition
H01L (semiconductor devices) anchors the field at 70.6% of the 17 records, with G09G display control and H04N pictorial-communication claims each present in 23.5%. H10P, C09J adhesives, G02F optical control, H05K printed-circuit assembly and H10H light-emitting devices each appear in a single-digit share — signals of adjacent claim territory rather than crowded ground.
Shares are the percentage of the 17 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Fine-Pitch Bonding for Micro LED Panels with Eureka
This page is one run against one query. Ask Eureka your own question about fine-pitch bonding for micro led panels and every answer comes back with the patent numbers behind it.
Try EurekaMost-cited records in this set
US20210273130A1 — Micro light emitting diode substrate, manufacturing method for same, and display device
The filing discloses a micro LED substrate and fabrication method built around a four-step transfer sequence: a first growth substrate carrying a first-color micro LED unit is fitted to a receiving substrate whose receiving pads are spaced at intervals, each LED unit is aligned to a transfer position matching one pad, and the unit is then fixed to the receiving surface.Abstract trimmed to the transfer-and-fixing sequence; full claim language should be reviewed directly before relying on this summary.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20180308420A1 | Micro LED display device and method of fabricating the same | 106 |
| 2 | US20010046021A1 | A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containi… | 69 |
| 3 | US10636349B2 | Micro LED display device and method of fabricating the same | 25 |
| 4 | JP1997036143A | Semiconductor device, its manufacture and mounting | 16 |
| 5 | US20190051637A1 | Micro light emitting diode device and manufacturing method thereof | 9 |
| 6 | CN112993121A | 芯片键合方法和微型发光二极管显示器 | 8 |
| 7 | US20200219438A1 | Micro LED display device and method of fabricating the same | 4 |
| 8 | US20210320090A1 | Manufacturing method of micro light emitting diode device | 3 |
| 9 | US11515444B2 | Micro light emitting diode substrate, manufacturing method for same, and display device | 3 |
| 10 | US20210273130A1 | Micro light emitting diode substrate, manufacturing method for same, and display device | 2 |
Citation counts inside this corpus skew toward older filings simply because they have had more time to accumulate citations — treat them as a signal of influence on the field, not of current commercial relevance.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.
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Three findings stand out once the records are grouped by assignee, year and classification.
No single assignee controls the field
The top-ranked assignee holds 4 records; the tenth-ranked holds 1. That spread across 10 ranked companies means freedom-to-operate analysis needs to check the whole ranked list, not just the top name — a narrow leader gap leaves room for a fast follower to close it.
Filing has cooled through the last complete year
Every assignee in the recent-momentum breakdown shows 0 filings in the latest year, and the 2021-to-2024 span is down 100%. That reading should stop at 2024: publication lag of roughly 18 months means 2025 and 2026 counts are still incomplete, not necessarily lower.
Semiconductor-device claims dominate; adjacent classes are thin
H01L covers the large majority of records, but C09J adhesives, G02F optical control, H05K assembly and H10H light-emitting devices each sit at a single record. That is not proof those branches are unclaimed everywhere, but within this specific fine-pitch bonding scope they are visibly under-filed.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to fine-pitch bonding for micro led panels, with the prior art for and against each one.
The assignee landscape
Ten companies make up the entire ranking this dataset returns — this is not a top-50 or top-100 cut, it is the full list. The leader holds 4 records, the field narrows quickly, and a long tail files once.
A modest lead, not a monopoly
The top assignee's 4 records set the pace but leave most of the ranked field within striking distance. Co-assignee activity in this dataset is sparse — three pairs total — suggesting most of this work is filed by single entities rather than joint development programmes.
A cluster sits just behind the leader
Fifth place holds 2 records, meaning several assignees are bunched close together rather than trailing a dominant leader by a wide margin. That clustering is worth watching for licensing leverage: no one party's position looks defensible across the whole bonding-force-to-rework chain.
Single-filing entrants make up the bottom of the ranking
The tail of this ranking is made up of assignees with a single record each, including individual inventors named alongside corporate filers. That mix points to a field still open to small, targeted filings rather than one locked up by a handful of incumbents.
| Assignee | Recent year | YoY |
|---|---|---|
| PlayNitride Inc. | 0 | — |
| Lumens Co., Ltd. | 0 | — |
| PlayNitride Display Co., Ltd. | 0 | — |
| Elec-Tech Photoelectric Technology (Dalian) Co., Ltd. | 0 | — |
| Casio Computer Co., Ltd. | 0 | — |
| Chongqing Konka Photoelectric Technology Co., Ltd. | 0 | — |
| Shenzhen Stan Technology Co., Ltd. | 0 | — |
| YAMAZAKI TSUTOMU | 0 | — |
Where to take this analysis
This landscape identifies where claim density sits and where it does not. Turning that into a filing or freedom-to-operate decision means going deeper on specific claim language.
Check the full claim scope of the most-cited records
Citation counts flag influence within this corpus, not current commercial risk. Before designing around any record, pull the full claim set and file history rather than relying on the abstract.
Review cited recordsMap the under-claimed branches against your own roadmap
The thin classes here — adhesives, printed-circuit assembly, optical modulation — may simply be outside this search string's terms rather than genuinely open. Re-run a targeted search on your specific bonding approach.
Explore white space with EurekaCommon questions about fine-pitch bonding patents
The dataset returns a ranked list of 10 assignees, with the top-ranked company holding 4 records and the field narrowing quickly after that — fifth place holds 2, and tenth place holds just 1. No single company controls a majority of the filings, so a freedom-to-operate check needs to cover the whole ranked list rather than just the top name. The ranking mixes corporate assignees with individually named inventors, which is typical for a still-developing interconnect niche.
Filing fell -100% between 2021 and 2024, and 2024 is the most recent year this dataset can treat as complete. That is a genuine slowdown through the last complete year, not a permanent verdict on the field: publication typically lags filing by around 18 months, so 2025 and 2026 figures are still filling in and should not be read as a continued decline yet. Peak filing so far was 2018, with 4 records.
H01L (semiconductor devices) is the dominant classification, appearing in 70.6% of the 17 records in scope. G09G (display control circuits) and H04N (pictorial communication) each appear in 23.5% of records, while adhesives (C09J), optical control (G02F), printed-circuit assembly (H05K) and light-emitting devices (H10H) each appear in a single record. Because records can carry multiple IPC classes, these shares add up to more than 100%, which is expected.
This filing, from Elec-Tech Photoelectric Technology (Dalian), covers a micro LED substrate and a manufacturing method built around a four-step transfer sequence: preparing a growth substrate carrying a color micro LED unit, preparing a receiving substrate with spaced receiving pads, aligning the LED unit to a matching pad at a transfer position, and fixing the unit to the receiving surface. Anyone building a similar pick-and-place or mass-transfer bonding process onto a patterned receiving substrate should review the full claim set directly rather than relying on this summary, since the abstract only describes the general sequence.
Within this specific search scope, adhesives (C09J), optical control and modulation (G02F), printed-circuit assembly (H05K) and light-emitting device structures (H10H) each show only a single record, against 12 records in the dominant H01L class. That imbalance suggests claim space in adhesive-based bonding formulations, PCB-integrated receiving substrates and rework-oriented pad designs is thinner than the semiconductor-device side of the field, though a targeted search outside this exact term set is worth running before relying on that as a full picture.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.