Flexible Pressure Sensor Patent Landscape 2026
The flexible pressure sensor field is in active growth, with a 43% increase in filings over the recent window and China-based institutions dominating the applicant ranking. Activity is fragmented across universities and research institutes, with no single player commanding more than a small share of the overall corpus.
Chinese research institutions lead a fragmented but growing field
The Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences heads the applicant ranking, followed closely by Beijing Tashan Technology and Tsinghua University. The field is notably research-institution-heavy, with universities accounting for the majority of top-ranked filers.
The top five filers collectively hold 13% of the hundred largest filers’ combined total, indicating a low-concentration landscape where no single entity has established dominant control. The gap between first and fifth place is narrow — from 13 patent families down to 9 — reinforcing the fragmented character of the field.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences | 13 | |
| 2 | Beijing Tashan Technology Co., Ltd. | 10 | |
| 3 | Tsinghua University | 10 | |
| 4 | Xiamen University | 9 | |
| 5 | Tsinghua Shenzhen International Graduate School | 9 | |
| 6 | Zhejiang University | 8 | |
| 7 | Xi’an Jiaotong University | 7 | |
| 8 | Jilin University | 7 | |
| 9 | Hebei University of Technology | 7 | |
| 10 | Southeast University | 7 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | UNIV OF ELECTRONICS SCI & TECH OF CHINA | 7 | |
| 12 | Shandong University OF SCI & TECH | 7 | |
| 13 | Suzhou University | 6 | |
| 14 | Guangzhou Puhui Technology Co., Ltd. | 6 | |
| 15 | Suzhou Leanstar Electronics Technology | 6 | |
| 16 | Tianjin University | 6 | |
| 17 | Anhui University | 6 | |
| 18 | Hefei University of Technology | 6 | |
| 19 | Hangzhou Dianzi University | 5 | |
| 20 | KUNMING UNIV OF SCI & TECH | 5 |
The dominance of academic and public-research applicants signals that core sensor-design IP is still being generated primarily in research settings, leaving commercial players room to build application-specific or manufacturing-process positions.
The most recent 18–24 months of filings are likely under-counted due to publication lag and should not be read as a slowdown in activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Sustained filing growth anchored in force-measurement and medical diagnostics
Annual filing volume and the technology branch mix together reveal a field that has expanded steadily since 2017 and is anchored in core pressure-measurement IP, with a meaningful secondary cluster in medical and materials science branches.
Annual filing trend
Filings grew from a low base in 2017 and climbed materially through 2022, with volume remaining elevated through 2024–2025. The apparent dip in 2025–2026 reflects publication lag rather than a real deceleration, consistent with a 43% growth reading over the recent window.
↗ Hover for values · click a bar to ask EurekaTechnology composition
G01L (force and pressure measurement) dominates the branch mix by a wide margin, confirming that the bulk of IP targets core sensing mechanisms. A61B (diagnosis and surgery) forms the largest secondary cluster, pointing to wearable health-monitoring as the leading application pull. Polymer-materials branches (C08L, C08J, C08K) and nanotechnology (B82Y) account for a smaller but meaningful share, reflecting ongoing materials-innovation work.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Flexible pressure sensor using amorphous metal and…
Provided are a flexible pressure sensor using an amorphous metal and a flexible bimodal sensor for simultaneously sensing a pressure and a temperature. The sensors according to an exemplary embodiment of the present invention include a conductive layer formed of the amorphous metal to have stretchable characteristics so that it may be used for an electronic… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | 基于微结构化介电层的电容式柔性压力传感器及其制备方法 | 133 |
| 2 | 基于复合材料介电层的电容式柔性压力传感器及其制备方法 | 102 |
| 3 | 一种柔性压力传感器及其制备方法 | 95 |
| 4 | High sensitive flexible pressure sensor and method… | 79 |
| 5 | 一种高灵敏度电容型柔性压力传感器 | 77 |
| 6 | 基于三维多孔微结构复合介质层的高灵敏度电容式柔性触觉传感器及其制作方法 | 74 |
| 7 | 一种柔性压力传感器及其制作方法 | 70 |
| 8 | 电容式柔性压力传感器及其制备方法 | 69 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the competitive structure means for R&D investment
The combination of a growth-stage lifecycle, low concentration, and academic-led filing activity creates a landscape where both differentiation and freedom-to-operate opportunities exist for well-positioned entrants.
Growth stage with sustained filing momentum
The lifecycle evidence identifies this field as Growth, with annual filings still rising and recent years understated by publication lag. A 43% growth reading over the recent window confirms the field has not reached plateau. Entrants can still establish meaningful positions, but the window for low-competition entry in core sensing mechanisms is narrowing.
Growth stageFragmented field with no dominant commercial incumbent
The top five filers account for only 13% of the hundred largest filers’ combined total, and the leading applicant holds just 13 patent families. The roster is dominated by universities and public institutes rather than commercial manufacturers, which means no single company has locked up broad foundational IP. This fragmentation lowers entry barriers but also signals that cross-licensing and freedom-to-operate analysis will involve many parties.
Low concentrationTsinghua-led spin-out collaborations are the most active co-filing pairs
The most active co-filing relationship is between Tsinghua University and the Institute of Flexible Electronics Technology of THU Zhejiang, with 4 joint patent families. Tsinghua also co-filed with Wuxi Maijie Sensing Technology (1 family), and Xiamen University co-filed with its Shenzhen Research Institute (1 family). These patterns suggest that technology transfer from university labs to affiliated spin-outs is the primary collaboration model in this field.
University-spinout modelChina-centric filings with limited international protection
China accounts for the overwhelming majority of patent records, reflecting where the primary R&D base sits. PCT filings and South Korean records represent the next largest groups, with US and European coverage remaining limited. This geographic skew means that non-Chinese players operating in Western markets may find relatively open patent space, while entering the Chinese market would require careful freedom-to-operate assessment.
China-dominantGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| Tsinghua University | Institute of Flexible Electronics Technology of THU Zhejiang | 4 |
| Tsinghua University | Wuxi Maijie Sensing Technology Co., Ltd. | 1 |
| Xiamen University | Xiamen University Shenzhen Research Institute | 1 |
| Xi’an Jiaotong University | Xi’an University of Technology | 1 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
Top players: research institutes and a commercial tactile-sensor specialist
The applicant ranking is led by a public research institute and a commercial robotics-sensor company, with a cluster of top-tier Chinese universities immediately behind. All tracked leaders are classified as new entrants in recent momentum data, suggesting the current ranking reflects accumulated historical activity rather than entrenched dominance.
Shenzhen Institute of Advanced Technology, CAS
The top-ranked applicant holds 13 patent families, with technology focus concentrated in G01L force and pressure measurement and secondary coverage in A61B diagnostics. Recent momentum is classified as a new entrant in the current period, indicating that its current ranking reflects a longer-term accumulation rather than a recent filing surge. Its dual focus on sensing mechanisms and medical diagnostics positions it at the intersection of the two largest technology clusters in this field.
families: 13Beijing Tashan Technology Co., Ltd.
Beijing Tashan Technology is the highest-ranked commercial applicant, tied with Tsinghua University at 10 patent families. Unlike its academic peers, its technology emphasis extends beyond core pressure measurement into B25J manipulators and robotics (6 families), signaling a deliberate application focus on robotic tactile sensing. Recent momentum is also classified as a new entrant in the current window, suggesting its commercial position is still being established.
families: 10| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences | 2 | ▲ new entrant |
| Tsinghua University | 4 | ▲ new entrant |
| Beijing Tashan Technology Co., Ltd. | 2 | ▲ new entrant |
| Xiamen University | 6 | ▲ new entrant |
| Zhejiang University | 1 | ▲ new entrant |
| Guangdong Greater Bay Area Huangpu Materials Research Institute | 2 | ▲ new entrant |
| Xi’an Jiaotong University | 3 | ▲ new entrant |
| University of Electronic Science and Technology of China | 2 | ▲ new entrant |
Under-served branches adjacent to the dominant sensing core
Several IPC branches appear alongside the dominant G01L core but at relatively low counts, representing areas where the patent literature is sparse relative to the apparent technical relevance. These are observations of relative sparsity; whether they represent investable opportunities depends on commercial context.
B82Y · Nanotechnology applications
With 21 patent records, the nanotechnology branch is notably sparse given that nanomaterial-based sensing films (graphene, carbon nanotubes, metal nanowires) are widely reported in academic literature as high-sensitivity transduction layers. The low count suggests that IP protection for nano-enabled flexible pressure sensors lags behind the published science, creating a potential window for applicants with process-ready nanomaterial integration to establish positions before the branch matures. Entry would require demonstrating manufacturable deposition or composite-formation processes rather than material properties alone.
Search this in Eureka →B33Y · Additive manufacturing (3D printing)
Only 7 patent records appear under additive manufacturing, despite 3D-printed microstructured dielectric layers being an active area of academic investigation for tuning sensor sensitivity and dynamic range. The sparsity may reflect the early stage of scalable printing processes for conductive and piezoelectric polymers rather than a lack of technical interest. Players with access to multi-material printing capabilities for flexible electronics could find limited prior art in this sub-space.
Search this in Eureka →How leaders differ by technology route
Route coverage across the main technology branches in the current evidence set.
| Player | G01L 1 · Force & pressure measurement | G01L 9 · Force & pressure measurement | A61B 5 · Diagnosis & surgery | G01L 5 · Force & pressure measurement | C08K 3 · Use of additives in polymers |
|---|---|---|---|---|---|
| Beijing Tashan Technology Co., Ltd. | Strong · 10 | Absent | Emerging · 2 | Strong · 7 | Absent |
| Tsinghua Shenzhen International Graduate School | Strong · 9 | Moderate · 3 | Strong · 7 | Absent | Absent |
| Tsinghua University | Strong · 10 | Moderate · 5 | Moderate · 3 | Absent | Absent |
| Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences | Strong · 13 | Emerging · 2 | Absent | Absent | Absent |
| Jilin University | Strong · 7 | Strong · 5 | Moderate · 2 | Absent | Absent |
| Shandong University of Science and Technology | Strong · 7 | Moderate · 3 | Moderate · 3 | Absent | Absent |
| Xiamen University | Strong · 9 | Absent | Absent | Absent | Absent |
Frequently asked questions
The corpus in scope contains 455 patent families covering standalone flexible pressure sensor technology globally.
The Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences leads with 13 patent families, followed by Beijing Tashan Technology and Tsinghua University, each with 10 patent families.
Filing activity has grown 43% over the recent measurement window. The lifecycle evidence categorizes the field as Growth, with annual volume still rising. The 2025–2026 data points are understated due to publication lag and should not be interpreted as a slowdown.
China is by far the most active jurisdiction, accounting for the large majority of patent records. WIPO PCT filings and South Korean records represent the next largest groups, with US and European coverage considerably smaller.
The highest-cited patents focus on capacitive flexible pressure sensors with microstructured dielectric layers and composite-material dielectric layers, with citation counts reaching 133 and 102 respectively. High-sensitivity capacitive and tactile sensor designs with three-dimensional porous microstructures are also among the most-referenced works.
The most notable gaps relative to technical activity are in nanotechnology applications (B82Y, 21 records) and additive manufacturing processes (B33Y, 7 records). The medical diagnostics branch (A61B) has more coverage but remains well below the dominant G01L core, suggesting room for IP development in wearable health-monitoring applications.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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