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Friction Stir Additive Manufacturing Patents 2026

Friction Stir Additive Manufacturing Patents 2026
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FSAM Patent Landscape

Friction Stir Additive Manufacturing Patents 2026

Solid-state FSAM is emerging as a credible alternative to fusion-based metal AM for high-strength aluminum and titanium structures. Active US patents from Blue Origin, Lockheed Martin, NASA, and the University of Alabama anchor the current IP landscape.

8
patents retrieved in dataset (2013–2026)
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5
active US patents in this dataset
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3
pending Indian patents filed 2024–2026
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2
Blue Origin US patents filed in 2025
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Published byPatSnap Insights Team··9 min readVerified by PatSnap Eureka Data
Technology Overview

What Is Friction Stir Additive Manufacturing?

Friction Stir Additive Manufacturing (FSAM) is a family of solid-state, thermomechanical metal deposition processes that build metallic structures layer-by-layer without melting the feedstock. Operating entirely below the melting temperature of the workpiece, it fundamentally distinguishes itself from beam-based processes such as selective laser melting and electron beam melting.

Three principal sub-processes define the FSAM family: sheet-lamination FSAM (SL-FSAM), which uses sequential friction stir lap welding of metal sheets; Additive Friction Stir Deposition (AFSD), which forces a solid rod through a rotating hollow tool; and wire-based variants that enable continuous deposition and composite reinforcement distribution.

FSAM Patent Filings by Jurisdiction (Retrieved Dataset)
FSAM Patent Filings by Jurisdiction: US 5, India 3, China 1, WO 1Horizontal bar chart showing retrieved FSAM patent counts by jurisdiction. US leads with 5 patents; India has 3; China and WO each have 1.Patent Filings by Jurisdiction (Retrieved Dataset)United States (US)5India (IN)3China (CN)1International (WO)↗ Click bars to explore

The defining mechanical advantages emphasized across retrieved records include elimination of solidification defects, equiaxed grain refinement, reduced residual stress, high-strength bonding of dissimilar alloys, and suitability for large-format structures with minimal post-processing distortion. These properties make FSAM particularly attractive for aerospace, defense, and structural repair applications.

The field evolved through three phases: a foundational FSW/FSP phase pre-2019, an emergence and definition phase from 2019–2022 when AFSD was formally defined as a forging counterpart of fusion-based AM, and a maturation phase from 2023–2026 characterized by targeted engineering patents from Blue Origin, NASA, IIT Kharagpur, IIT Guwahati, and the University of Pittsburgh.

PatSnap Eureka Patent counts derived from retrieved dataset of 8 patents spanning 2013–2026; not a comprehensive industry view.Explore the data ↗
Filing Trends

FSAM Patent Activity by Phase and Technology Cluster

Among the 8 patents retrieved, 7 were published in 2023 or later, confirming that the most active filing period in this dataset is 2023–2026. The AFSD cluster shows the highest patent activity, while hybrid process integration is the fastest-emerging sub-cluster.

FSAM Patents by Technology Cluster (Retrieved Dataset)

AFSD rod-feedstock patents account for the largest cluster, followed by hybrid FSAM integration and wire-based/bobbin variants.

FSAM Patents by Technology Cluster: AFSD Rod-Based 3, Hybrid Integration 3, Wire/Bobbin Variants 2, Sheet-Lamination FSAM 1Horizontal bar chart showing patent count per FSAM technology cluster in the retrieved dataset of 8 patents.Patents by Technology Cluster (Retrieved Dataset)AFSD Rod-Based3Hybrid Integration3Wire/Bobbin Variants2Sheet-Lamination FSAM1↗ Click bars to explore

FSAM Patent Filing Activity by Phase (2013–2026)

Filing activity accelerated sharply in the maturation phase (2023–2026), which produced 7 of the 8 retrieved patents.

FSAM Patent Filing Activity by Phase: Pre-2019 0 patents, 2019-2022 1 patent, 2023-2026 7 patentsVertical bar chart showing retrieved FSAM patent counts per development phase, confirming dramatic acceleration in 2023–2026.Patent Filing Activity by Development Phase740Pre-201902019–202212023–20267↗ Click bars to explore
PatSnap Eureka Data derived from 8 retrieved patents and 20 literature records spanning 2013–2026; not representative of total global FSAM IP volume.Explore the data ↗
Application Domains

Key FSAM Application Sectors and Research Domains

FSAM has been adopted or targeted across four primary sectors — aerospace and space launch, defense and structural repair, metal matrix composites, and automotive/marine hybrid structures — with aerospace representing the dominant industrial adoption domain in this dataset.

SL-FSAM · 7xxx Aluminum · Space Launch

Aerospace and Space Launch Structures

SL-FSAM was first deployed industrially by Airbus in 2006 and Boeing in 2012 for lightweight aluminum airframe components. Blue Origin holds two active US patents filed in 2025 targeting space launch vehicle structures with integrated internal passages such as actively cooled chambers and manifolds. Lockheed Martin’s 2021 active US patent on tension-wound solid-state AM was explicitly developed for large aluminum spaceflight structures as an alternative to fusion-based processes that produce inferior grain sizes.

Aerospace AM
AFSD · 7075 Aluminum · Volume Repair

Defense and Structural Repair

AFSD’s ability to fill volume damage including through-holes and grooves in 7075 aluminum without hot cracking makes it a critical repair technology for defense assets, as demonstrated in 2019 literature on 7075 Al repair. The University of Alabama’s 2023 active US patent covers continuous large-deposit AFSD with non-circular feed rod anti-slip geometry. Wire-based FSAM, documented in 2022 literature, targets field-deployable structural repair with improved portability.

Defense Repair
FSAM · SiC/Al₂O₃ · MMC Fabrication

Metal Matrix Composites and Functional Structures

FSAM’s severe plastic deformation mechanism enables uniform dispersion of ceramic or metallic particles such as SiC and Al₂O₃ at volume fractions exceeding 30%, with refined interparticle spacing below 1 µm, as reported in 2022 literature on multifunctional MMCs. A 2022 study fabricated functionally graded structures from alternating AA6061-T6/AA7075-T6 layers using solid-state AM. These MMC capabilities are not yet heavily patented in the retrieved dataset, representing a potential IP filing opportunity.

Composites AM
Hybrid WAAM-FSP · Bimetallic · Wear Resistance

Automotive and Marine Bimetallic Walls

Delhi Technological University’s 2026 pending IN patent demonstrates CMT-WAAM deposition followed by FSP post-treatment at the interface layer of bimetallic ER4043/ER5356 aluminum walls to improve wear resistance and grain refinement, with explicit applicability to automotive and marine sectors. IIT Kharagpur’s 2026 pending IN patent on wire-fed FSAM also targets large-scale metal product fabrication in these industries. These hybrid WAAM-FSP approaches address dissimilar aluminum alloy structures requiring enhanced tribological performance.

Hybrid AM
PatSnap Eureka Application domains derived from patent claims and literature abstracts retrieved across targeted FSAM searches spanning 2013–2026.Explore insights ↗
Key Patent Assignees

Leading Assignees in FSAM Patent Filings

Among 8 retrieved patents, Blue Origin leads commercial filing activity with two US patents in 2025, while Lockheed Martin and NASA hold the foundational active US positions. India’s IIT ecosystem has filed three pending patents in the 2024–2026 window.

FSAM Patents by Assignee (Retrieved Dataset)

FSAM Patents by Assignee: Blue Origin 2, Lockheed Martin 1, NASA 1, University of Alabama 1, IIT Kharagpur 1Horizontal bar chart showing retrieved FSAM patent counts per named assignee from the dataset.Blue Origin2Lockheed Martin1NASA1University of Alabama1IIT Kharagpur1↗ Click bars to explore
Deposition Head Design · Integrated Passages

Blue Origin Manufacturing, LLC

Blue Origin is the most active single commercial FSAM filer in this dataset, with two US patents filed in 2025. The first active patent covers deposition head geometry with semi-cylindrical portions and chamfered inner surfaces to control weld profile; the second pending patent discloses FSAM-formed structural parts with integrated internal passages for actively cooled aerospace components. Both patents are explicitly directed at space launch vehicle structures.

United States
Tension-Wound Solid-State AM · Spaceflight Structures

Lockheed Martin Corporation

Lockheed Martin holds one active US patent filed in 2021 covering tension-wound solid-state additive manufacturing, explicitly developed for large aluminum spaceflight structures as an alternative to fusion-based processes that produce inferior grain sizes. This represents the earliest active commercial FSAM patent in the retrieved dataset. Lockheed’s filing anchors the foundational IP layer for aerospace solid-state AM alongside NASA and Blue Origin.

United States
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See detailed profiles for NASA’s bobbin FSW AM patent (2024, active), University of Alabama’s AFSD systems patent (2023, active), and the three pending IN filings from IIT Guwahati, IIT Kharagpur, and Delhi Technological University — including claim scope and white-space analysis.
NASA bobbin tool AFSD IIT Guwahati joining area + more
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PatSnap Eureka Assignee data derived from 8 retrieved FSAM patents spanning 2021–2026 across US, IN, CN, and WO jurisdictions.Explore players ↗
Emerging Directions

New FSAM Technology Directions Signaled by 2024–2026 Patents

Patents filed between 2024 and 2026 in this dataset point to five emerging engineering directions: integrated cooling passage structures, dual-tool wire-based FSAM, hybrid WAAM-FSP for bimetallic walls, bobbin tool simultaneous plasticization, and multi-process hybrid manufacturing platforms.

Integrated Passage and Cooling Channel Structures

Blue Origin’s 2025 pending US patent on FSAM-formed parts with integrated passages points toward using solid-state deposition to fabricate actively cooled rocket engine or aerospace structural components, replacing brazed or diffusion-bonded tube assemblies. The patent discloses integration of FSAM deposition with post-machining and tube-groove integration. This represents a direct commercial application of FSAM to next-generation space propulsion hardware.

Wire-Based FSAM with Dual-Tool Consolidation

IIT Kharagpur’s 2026 pending IN patent introduces a dual-tool W-FSAM architecture in which a leading wire-deposition tool is followed by a secondary consolidation tool, enabling more uniform composite reinforcement distribution and interfacial machining during multi-layer builds. This is documented as the first dual-tool FSAM configuration in this dataset. The system also accommodates composite reinforcement particle deposition and interfacial machining between layers.

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Full technical breakdowns for Hybrid WAAM-FSP bimetallic structures (Delhi Technological University, 2026) and closed-loop temperature/force control of AFSD — identified as a white-space IP opportunity — are available in the full Eureka report.
Hybrid WAAM-FSP bimetallicClosed-loop AFSD control+ more
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PatSnap Eureka Emerging directions are based on patents filed 2024–2026 within the retrieved dataset of 8 patents.Explore emerging trends ↗
Process Comparison

AFSD vs. Sheet-Lamination FSAM: Key Dimensions

Click any row to explore further.

DimensionAdditive Friction Stir Deposition (AFSD)Sheet-Lamination FSAM (SL-FSAM)
Feedstock FormSolid rod or wire feedstock forced through hollow rotating toolSequential stacked metal sheets joined via friction stir lap welding
Industrial AdoptionActive US patents from University of Alabama (2023) and Blue Origin (2025); demonstrated repair of 7075 AlFirst deployed industrially by Airbus (2006) and Boeing (2012) for aluminum airframe components
Patent Status (Dataset)Highest patent activity cluster in this dataset; 3 AFSD-specific patents retrieved1 dedicated sheet-lamination patent retrieved (IIT Guwahati, 2025, IN pending)
Primary MaterialsHigh-strength aluminum alloys including 7075; composite reinforcement deposition possibleHigh-strength 7xxx-series aluminum; airframe stringers, stiffeners, and skins
Key Microstructural OutcomeFully dense, equiaxed-grain microstructures in the as-printed state without meltingGap-free bonding via intermediate milling; 2022 literature investigates eliminating mandatory milling step
Repair CapabilityDemonstrated for filling through-holes and grooves in 7075 Al without hot cracking (2019 literature)Not cited as a repair process in this dataset; oriented toward new structure fabrication
Hybrid IntegrationCombined with DED and subtractive machining in University of Pittsburgh 2025 WO patentCombined with FSP post-treatment in Delhi Technological University 2026 IN patent (WAAM-FSP)
PatSnap Eureka Comparison derived from patent claims and literature abstracts retrieved in this dataset; not a comprehensive process benchmark.Compare in Eureka ↗
Frequently asked questions

Frequently Asked Questions: Friction Stir Additive Manufacturing

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Data and insights on this page are based on a limited patent and literature dataset and are for reference only. Figures may not represent the complete technology landscape.

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