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GAA Fab Process Control (APC) Patent Snapshot 2026

GAA Fab Process Control (APC) Patent Snapshot 2026
Evidence Snapshot
GAA Fab Process Control (APC) Patent Snapshot in 2026

The GAA fab process control (APC) patent corpus is tightly concentrated among three filers — Applied Materials, Tokyo Electron, and Onto Innovation — who collectively hold all 10 patent families in scope. Activity peaked in 2020 and has eased substantially since, signalling a post-peak field that remains technically active but is no longer attracting broad new entrants.

10
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
United States
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

Three applicants hold the entire GAA APC corpus

Applied Materials leads with 5 patent families, followed by Tokyo Electron with 4 and Onto Innovation with 1 — together accounting for every family in the ranked corpus.

The top five filers’ share of the ranked applicants visible in this query stands at 100%, a level of concentration that is extreme even by niche-technology standards. The gap between the leader (5 families) and the third-place holder (1 family) illustrates a two-tier structure with Applied Materials and Tokyo Electron clearly separated from the rest of the field.

Leading applicants
#ApplicantPatent familiesShare
1Applied Materials, Inc.5
2Tokyo Electron Ltd.4
3Onto Innovation Inc.1
↗ Hover a row · click a company to ask Eureka

Applied Materials’ position, grounded in coating and deposition process technology alongside semiconductor device logic, suggests deep vertical integration into APC-relevant process steps. Tokyo Electron’s comparable count, focused on semiconductor device and nanowire/nanosheet transistor classifications, indicates a parallel but distinct technical approach.

Patent publications typically lag filing dates by 18–24 months, so the most recent years in this corpus should be treated as under-counted; apparent absence of activity in 20252026 does not necessarily reflect a halt in actual R&D.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

A 2020 surge followed by rapid easing; semiconductor device logic dominates the IPC mix

Filing activity burst in 2020 then contracted sharply, while the technology mix is anchored in semiconductor device classifications with secondary coverage in coating, crystal growth, and nanotechnology.

Annual filing trend

The corpus shows negligible activity before 2020, a sharp spike to 8 families in that year, then a stepdown to single-digit annual counts in 2022 and 2023 with no recorded families in 2024–2026. Given standard publication lag, 2024 and later years are likely under-reported and should not be read as zero activity.

Annual filing trendAnnual values from 2017 to 2026, peaking at 8 in 2020.02017020180201982020020211202212023020240202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

H01L (semiconductor devices) covers all 10 families and is the visible classification. H10P (nanowire/nanosheet transistors) follows closely, reflecting the structural specificity of GAA architectures. C23C (coating and surface deposition) is the third-largest branch, pointing to APC relevance in atomic-layer and thin-film deposition steps. C30B (crystal growth), H01J (electron and discharge tubes), and B82Y (nanotechnology applications) each represent smaller secondary branches.

Technology compositionH01L · Semiconductor devices leads with 10; H10P 9.H01L · Semiconductor dev…10H10P9C23C · Coating & surface…7C30B · Crystal growth4H01J · Electron & discha…3B82Y · Nanotechnology ap…2↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
WO2021067525A1Published 2021-04-08

Gate all around I/O engineering

Applied MATERIALS, INC.

Described is a method of manufacturing a gate-all-around electronic device. The method includes forming a thermal oxide layer though an enhanced in situ steam generation process in combination with atomic layer deposition of a low-κ layer. The thin thermal oxide layer passivates the interface between the silicon layer and the dielectric layer of the GAA. A… (excerpt from the patent abstract)

Gate all around I/O engineering — patent drawingGate all around I/O engineering — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1基板处理方法、基板处理装置和纳米线或纳米片的晶体管的制造方法6
2Substrate processing method, substrate processing …4
3Gate all around I/O engineering2

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Applied Materials

Applied Materials

Applied Materials holds 5 patent families, the largest position in this corpus. Their technology focus spans C23C 16 (coating and surface deposition), H01L 21, and H01L 29 — a combination that ties APC directly to deposition process control, a natural fit with their equipment portfolio. Recent filing momentum is classified as a new entrant signal in the most recent window, indicating re-entry or broadening after a gap rather than continuous accumulation.

families: 5
Challenger · Tokyo Electron

Tokyo Electron

Tokyo Electron holds 4 patent families and concentrates its IPC coverage on H01L 21 (semiconductor fabrication process), H10P 14, and H10P 72 — classifications specific to GAA nanowire and nanosheet transistor structures. This positions Tokyo Electron as the leading filer on the structural device side of APC, complementary to but distinct from Applied Materials’ deposition-process emphasis. No recent-window momentum data is available for Tokyo Electron in the evidence.

families: 4
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Applied MaterialsTokyo Electron+ more
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Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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