GaN HEMT Deposition Patents: Who Leads, Filing Trends 2026
- Filing peaked in 2017 at 38 families and has not returned to that level since, with 2022 sitting at roughly half the peak — a pattern more consistent with claim consolidation than an expanding frontier.
- H01L carries 337 of 355 records and H10D 180, meaning almost every filing sits inside general semiconductor device classification rather than the narrower crystal-growth code C30B, which holds just 7.
- The five most-cited records date back to 2005-2015, and one 2015 filing alone carries 558 citations — foundational heterojunction and recessed-gate structures that any new entrant's claims will be read against.
Filing growth compares 2021 (28 records) with 2024 (9) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 355 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This dataset tracks 355 patent families published between 2015 and mid-2026 that combine GaN HEMT or GaN transistor claims with epitaxial growth methods — GaN epitaxy, MOCVD growth, or AlGaN barrier deposition. It captures the device layer and the deposition process together, which is the intersection where structural claims (gate architecture, buffer layers, barrier composition) meet process claims (growth temperature, precursor chemistry, layer sequencing).
Publication lags filing by roughly eighteen months, so the tapering shown for the most recent years understates real filing activity rather than reflecting an actual slowdown at the frontier. Even so, the shape of the decade-long trend — a 2017 peak followed by a plateau near half that level — is a real signal about where claim space has filled in.
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Filing trend and technology composition
Two views of the same 355 families: how filing activity has moved year over year, and which IPC subclasses the claims actually sit in.
A 2017 peak, not a rising curve
Filings ran at 38 in 2017, the high point across the coverage window. By the 2022 midpoint they had fallen to 18 — roughly half — and the partial-year 2026 figure of 0 reflects publication lag rather than a stop in filing. Read the recent years as incomplete, not as decline.
Concentrated in general device classification
H01L (semiconductor devices) covers 337 of 355 records and H10D (semiconductor devices, general) covers 180 — most claims are drafted as device structure rather than pure crystal-growth process. C30B (crystal growth) appears in only 7 records, and H03H (impedance networks and filters) in 7, both comparatively open.
Shares are the percentage of the 355 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Gallium Nitride HEMT Thin Film Deposition with Eureka
This page is one run against one query. Ask Eureka your own question about gallium nitride hemt thin film deposition and every answer comes back with the patent numbers behind it.
Try EurekaThe foundational citations everyone builds on
Hybrid Type AlGaN/GaN HEMT Device (US20250031402A1)
The filing combines a depletion-mode AlGaN/GaN HEMT with a p-GaN gate enhancement-mode AlGaN/GaN HEMT on a shared silicon substrate, wiring the depletion-mode device to protect the enhancement-mode gate structure from over-voltage under any gate bias.Filed by HUANG, CHIH-SHU; published 2025-01-23.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20150014632A1 | Advanced Heterojunction Devices and Methods of Manufacturing Advanced Heterojunction Devices | 558 |
| 2 | US20100025730A1 | Normally-off Semiconductor Devices and Methods of Fabricating the Same | 298 |
| 3 | US7238560B2 | Methods of fabricating nitride-based transistors with a cap layer and a recessed gate | 242 |
| 4 | US7045404B2 | Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof | 219 |
| 5 | US20100117118A1 | High electron mobility heterojunction device | 196 |
| 6 | US20070164322A1 | Methods of fabricating transistors including dielectrically-supported gate electrodes and related devices | 194 |
| 7 | US20060108606A1 | Cap layers and/or passivation layers for nitride-based transistors, transistor structures and methods of fabr… | 185 |
| 8 | US7906799B2 | Nitride-based transistors with a protective layer and a low-damage recess | 177 |
| 9 | US20060019435A1 | Methods of fabricating nitride-based transistors with a cap layer and a recessed gate | 169 |
| 10 | US7592211B2 | Methods of fabricating transistors including supported gate electrodes | 166 |
Citation counts favour older records within the searched corpus; treat them as a measure of influence on subsequent drafting, not as a signal of current commercial importance.
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Browse MCP servers →What the numbers mean for a filing decision
Three read-throughs from the trend, classification, and citation data above.
The rate has halved, not accelerated
A 2017 peak followed by a decline to roughly half that level by 2022 points to claim space filling in around core HEMT structures rather than a technology still opening up. New filers are more likely to be defending narrow improvements than staking broad architecture claims.
Device structure claims dominate over pure process claims
With H01L and H10D together covering the overwhelming majority of records, most applicants are drafting around device architecture — gate structure, buffer stack, substrate integration — rather than filing narrowly on crystal-growth process itself, which sits in C30B at just 7 records.
Old heterojunction patents still anchor freedom-to-operate review
The five most-cited records in this corpus predate 2016 and describe core heterojunction, recessed-gate, and cap-layer structures. Any new HEMT device claim is likely to be examined against this cluster first, regardless of how recent the filing is.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to gallium nitride hemt thin film deposition, with the prior art for and against each one.
Who holds the ground, and where it opens up
Assignee activity in this corpus has gone quiet at the top: the leading names in recent-year momentum all show zero families in the latest year, consistent with the broader plateau in filing.
Research-institute partnerships cluster around a few pairs
The strongest co-assignee relationship in this dataset links an inter-university microelectronics centre with a Catholic university partner at 8 joint families, with device-maker and named-inventor pairs following behind. Co-filing here looks more like sustained academic-industrial collaboration than opportunistic joint ventures.
Even the most active historical filers show no latest-year activity
Every assignee tracked for recent-year momentum, including the most historically active names, records zero families in the latest year. Given the roughly 18-month publication lag, this likely reflects filings still in the pipeline rather than firms exiting the space.
US filing leads, but PCT and European coverage is substantial
United States filings account for the largest single share of records, with EPO and WIPO/PCT routes each carrying meaningful volume behind it. A filer targeting only the US risks missing a real fraction of prior art and competitor coverage sitting in European and PCT records.
| Assignee | Recent year | YoY |
|---|---|---|
| Wolfspeed, Inc. | 0 | — |
| HEXAGEM AB | 0 | — |
| Intel Corporation | 0 | — |
| HRL Laboratories, LLC | 0 | — |
| École Polytechnique Fédérale de Lausanne (EPFL) | 0 | — |
| Interuniversity Microelectronics Centre (IMEC) | 0 | — |
| Huawei Technologies Co., Ltd. | 0 | — |
| SHEPPARD SCOTT T | 0 | — |
Where to take this analysis
The dataset points to specific next steps depending on whether the goal is freedom-to-operate, white-space drafting, or competitor tracking.
Run a freedom-to-operate check against the most-cited cluster
The five most-cited records, several carrying over 200 citations, describe core heterojunction and recessed-gate structures that recur across the corpus. Any new device claim should be checked against this cluster before drafting proceeds further.
Explore prior art in EurekaDraft around the under-claimed process branches
C30B crystal-growth process claims and H03H filter-integration claims carry a fraction of the volume seen in H01L device claims, suggesting narrower prior art density for process-specific drafting.
Map white space in EurekaTrack assignees through the publication-lag window
Zero latest-year momentum across leading assignees is likely a reporting artefact of the roughly 18-month lag rather than a real exit from the field; a rolling watch will catch filings as they publish.
Set up assignee tracking in EurekaCommon questions about this landscape
This dataset identifies 355 patent families published between 2015 and mid-2026 that combine GaN HEMT or GaN transistor claims with epitaxial growth methods such as MOCVD or AlGaN barrier deposition. That figure counts families, which is the fairer unit than raw document counts because it neutralises repeat filings of the same invention across jurisdictions. The true figure for the most recent year is understated because publication lags filing by roughly 18 months.
The corpus shows activity concentrated among a mix of established semiconductor device makers, national research institutes, and university consortia, with the strongest co-assignee relationship linking an inter-university microelectronics centre to a partner university at 8 joint families. Notably, every assignee tracked for recent-year momentum shows zero families in the latest year, which given the publication lag likely reflects pipeline filings rather than firms leaving the space. Anyone doing competitive tracking should treat the current leaderboard as a historical snapshot rather than an active-filing ranking.
Device claims, classified mostly under H01L and H10D, describe the transistor structure itself — gate architecture, buffer stack, substrate integration — and cover 337 and 180 of the 355 records respectively. Epitaxy and crystal-growth process claims, classified under C30B, describe how the material layers are grown and appear in only 7 records. The heavy skew toward device structure claims means the process side of the technology carries comparatively less prior art density.
Filings in this corpus reached 38 in 2017, the highest point in the coverage window, then fell to 18 by the 2022 midpoint. That pattern is more consistent with core claim space filling in around established HEMT structures than with the technology losing commercial relevance — high filing density in the mid-2010s marks that space as occupied, not that the field stopped moving. The steep drop shown for 2025-2026 should be read as incomplete publication data rather than an actual halt in filing.
The IPC composition points toward crystal-growth process claims (C30B, 7 records), impedance and filter integration with HEMT devices (H03H, 7 records), and organic-semiconductor hybrid stacking (H10K, 8 records) as comparatively under-claimed relative to the dominant H01L device-structure cluster. A first claim in one of these branches would need to specify a process parameter or integration detail not already covered by the foundational heterojunction patents that anchor citation counts in this corpus. Confirming true openness still requires a targeted prior art search beyond this landscape view.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.