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GaN HEMT Deposition Patents: Who Leads, Filing Trends 2026

GaN HEMT Deposition Patents: Who Leads, Filing Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/gallium-nitride-hemt-thin-film-deposition-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Semiconductors & Microelectronics
Gallium Nitride HEMT Thin Film Deposition Patents
  • Filing peaked in 2017 at 38 families and has not returned to that level since, with 2022 sitting at roughly half the peak — a pattern more consistent with claim consolidation than an expanding frontier.
  • H01L carries 337 of 355 records and H10D 180, meaning almost every filing sits inside general semiconductor device classification rather than the narrower crystal-growth code C30B, which holds just 7.
  • The five most-cited records date back to 2005-2015, and one 2015 filing alone carries 558 citations — foundational heterojunction and recessed-gate structures that any new entrant's claims will be read against.
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355
Published Records
50%
Top-5 Share of All Records
-68%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (28 records) with 2024 (9) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 355 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks 355 patent families published between 2015 and mid-2026 that combine GaN HEMT or GaN transistor claims with epitaxial growth methods — GaN epitaxy, MOCVD growth, or AlGaN barrier deposition. It captures the device layer and the deposition process together, which is the intersection where structural claims (gate architecture, buffer layers, barrier composition) meet process claims (growth temperature, precursor chemistry, layer sequencing).

Publication lags filing by roughly eighteen months, so the tapering shown for the most recent years understates real filing activity rather than reflecting an actual slowdown at the frontier. Even so, the shape of the decade-long trend — a 2017 peak followed by a plateau near half that level — is a real signal about where claim space has filled in.

Filing activity by year, 2017-2026
  1. 1WOLFSPEED INC112
  2. 2HEXAGEM AB19
  3. 3INTEL CORP17
  4. 4ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)15
  5. 5HRL LAB15
  6. 6INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW)14
  7. 7HUAWEI TECH CO LTD14
  8. 8MACOM TECH SOLUTIONS HLDG INC13
  9. 9VISIC TECH11
  10. 10NIPPON TELEGRAPH & TELEPHONE CORP10
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Gallium Nitride HEMT Thin Film Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Two views of the same 355 families: how filing activity has moved year over year, and which IPC subclasses the claims actually sit in.

A 2017 peak, not a rising curve

Filings ran at 38 in 2017, the high point across the coverage window. By the 2022 midpoint they had fallen to 18 — roughly half — and the partial-year 2026 figure of 0 reflects publication lag rather than a stop in filing. Read the recent years as incomplete, not as decline.

A 2017 peak, not a rising curve0102030403820172018201920202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Concentrated in general device classification

H01L (semiconductor devices) covers 337 of 355 records and H10D (semiconductor devices, general) covers 180 — most claims are drafted as device structure rather than pure crystal-growth process. C30B (crystal growth) appears in only 7 records, and H03H (impedance networks and filters) in 7, both comparatively open.

Concentrated in general device classificationH01L · Semiconductor devices33794.9%H10D · Semiconductor devices (general)18050.7%H10P5014.1%H10W246.8%H10N · Other electric solid-state dev…164.5%H10K · Organic semiconductors (OLED e…82.3%C30B · Crystal growth72.0%H03H · Impedance networks & filters72.0%Other3610.1%

Shares are the percentage of the 355 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Gallium Nitride HEMT Thin Film Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The foundational citations everyone builds on

Representative recent filing
US20250031402A12025-01-23

Hybrid Type AlGaN/GaN HEMT Device (US20250031402A1)

HUANG, CHIH-SHU

The filing combines a depletion-mode AlGaN/GaN HEMT with a p-GaN gate enhancement-mode AlGaN/GaN HEMT on a shared silicon substrate, wiring the depletion-mode device to protect the enhancement-mode gate structure from over-voltage under any gate bias.Filed by HUANG, CHIH-SHU; published 2025-01-23.

US20250031402A1 — patent drawing 1US20250031402A1 — patent drawing 2
View full record
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US20150014632A1Advanced Heterojunction Devices and Methods of Manufacturing Advanced Heterojunction Devices558
2US20100025730A1Normally-off Semiconductor Devices and Methods of Fabricating the Same298
3US7238560B2Methods of fabricating nitride-based transistors with a cap layer and a recessed gate242
4US7045404B2Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof219
5US20100117118A1High electron mobility heterojunction device196
6US20070164322A1Methods of fabricating transistors including dielectrically-supported gate electrodes and related devices194
7US20060108606A1Cap layers and/or passivation layers for nitride-based transistors, transistor structures and methods of fabr…185
8US7906799B2Nitride-based transistors with a protective layer and a low-damage recess177
9US20060019435A1Methods of fabricating nitride-based transistors with a cap layer and a recessed gate169
10US7592211B2Methods of fabricating transistors including supported gate electrodes166

Citation counts favour older records within the searched corpus; treat them as a measure of influence on subsequent drafting, not as a signal of current commercial importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Gallium Nitride HEMT Thin Film Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-throughs from the trend, classification, and citation data above.

Filing momentum
38 → 18
2017 peak vs. 2022 midpoint

The rate has halved, not accelerated

A 2017 peak followed by a decline to roughly half that level by 2022 points to claim space filling in around core HEMT structures rather than a technology still opening up. New filers are more likely to be defending narrow improvements than staking broad architecture claims.

Based on year-over-year family counts, 2017-2022.
Classification concentration
337 / 355
records classified under H01L

Device structure claims dominate over pure process claims

With H01L and H10D together covering the overwhelming majority of records, most applicants are drafting around device architecture — gate structure, buffer stack, substrate integration — rather than filing narrowly on crystal-growth process itself, which sits in C30B at just 7 records.

IPC subclass distribution across 355 families.
Citation depth
558 citations
on the single most-cited record

Old heterojunction patents still anchor freedom-to-operate review

The five most-cited records in this corpus predate 2016 and describe core heterojunction, recessed-gate, and cap-layer structures. Any new HEMT device claim is likely to be examined against this cluster first, regardless of how recent the filing is.

Citation counts reflect influence within this searched corpus, not overall novelty.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to gallium nitride hemt thin film deposition, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Gallium Nitride HEMT Thin Film Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the ground, and where it opens up

Assignee activity in this corpus has gone quiet at the top: the leading names in recent-year momentum all show zero families in the latest year, consistent with the broader plateau in filing.

Co-filing pattern
8 pairs
strongest co-assignee link

Research-institute partnerships cluster around a few pairs

The strongest co-assignee relationship in this dataset links an inter-university microelectronics centre with a Catholic university partner at 8 joint families, with device-maker and named-inventor pairs following behind. Co-filing here looks more like sustained academic-industrial collaboration than opportunistic joint ventures.

Based on 10 identified co-assignee pairs across the corpus.
Recent momentum
0
latest-year families, leading assignees

Even the most active historical filers show no latest-year activity

Every assignee tracked for recent-year momentum, including the most historically active names, records zero families in the latest year. Given the roughly 18-month publication lag, this likely reflects filings still in the pipeline rather than firms exiting the space.

Momentum tracked against the most recent filing year in coverage.
Receiving office split
176 US
vs. 65 EPO, 52 WIPO

US filing leads, but PCT and European coverage is substantial

United States filings account for the largest single share of records, with EPO and WIPO/PCT routes each carrying meaningful volume behind it. A filer targeting only the US risks missing a real fraction of prior art and competitor coverage sitting in European and PCT records.

Receiving office counts: US 176, EPO 65, WIPO 52, Germany 15, AT 14, China 10.
🔍
Under-claimed sub-areas worth checking before drafting
These branches carry comparatively few records relative to the core device claims, based on the IPC composition above.
Crystal growth process claims (C30B)AlGaN barrier composition gradingImpedance/filter integration with HEMT (H03H)Organic-semiconductor hybrid stacks (H10K)Buffer-layer defect management
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Wolfspeed, Inc.0
HEXAGEM AB0
Intel Corporation0
HRL Laboratories, LLC0
École Polytechnique Fédérale de Lausanne (EPFL)0
Interuniversity Microelectronics Centre (IMEC)0
Huawei Technologies Co., Ltd.0
SHEPPARD SCOTT T0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Gallium Nitride HEMT Thin Film Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to specific next steps depending on whether the goal is freedom-to-operate, white-space drafting, or competitor tracking.

Run a freedom-to-operate check against the most-cited cluster

The five most-cited records, several carrying over 200 citations, describe core heterojunction and recessed-gate structures that recur across the corpus. Any new device claim should be checked against this cluster before drafting proceeds further.

Explore prior art in Eureka

Draft around the under-claimed process branches

C30B crystal-growth process claims and H03H filter-integration claims carry a fraction of the volume seen in H01L device claims, suggesting narrower prior art density for process-specific drafting.

Map white space in Eureka

Track assignees through the publication-lag window

Zero latest-year momentum across leading assignees is likely a reporting artefact of the roughly 18-month lag rather than a real exit from the field; a rolling watch will catch filings as they publish.

Set up assignee tracking in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Gallium Nitride HEMT Thin Film Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Gallium Nitride HEMT Thin Film Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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