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GaN HEMT Patents: Who Leads, Where the Gaps Are 2026

GaN HEMT Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/gallium-nitride-hemt-transistor-architecture-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Semiconductors & Microelectronics
Gallium Nitride HEMT Transistor Architecture Patents
  • Filing has plateaued, not grown. activity peaked in 2018 at 16 families and sat at 8 by the 2022 midpoint, with no assignee showing positive year-over-year momentum in the latest tracked year.
  • Claim density sits almost entirely in two IPC subclasses. H01L and H10D together account for the bulk of the 148 families, while power-conversion (H02M) and pulse/logic (H03K) crossover filings stay in the low teens.
  • The United States dominates the filing venue. 90 of the tracked records were filed there against 17 at the EPO and 12 through the PCT route, which concentrates the enforceable prior art in one jurisdiction.
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148
Published Records
49%
Top-5 Share of All Records
-50%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the GaN HEMT architecture filing record shows

Gallium nitride HEMT architecture patenting is a mature, narrow field rather than an expanding one. The corpus tracked here — 148 patent families filed between 2015 and the 2026 cut-off — centres on normally-off device structures, p-GaN gate architectures and cascode GaN configurations, and the filing curve already peaked in 2018. That does not mean the technology is exhausted: it means the core claim space around gate structure and threshold-voltage control was staked out early, and later entrants are filing around or beneath those claims rather than opening new ground.

Because publication typically lags filing by around eighteen months, the most recent year in any trend understates true activity — the 2026 figure should be read as incomplete, not as a collapse. Patent families, not raw document counts, are used throughout this page because they neutralise continuation filings and multi-jurisdiction duplicates that would otherwise inflate any single assignee's apparent output.

Filing activity, 2017–2026 (families by earliest priority year)
  1. 1INFINEON TECH AUSTRIA AG26
  2. 2AZUR SPACE SOLAR POWER16
  3. 3TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD12
  4. 4THE HONG KONG UNIV OF SCI & TECH10
  5. 5INDIAN INSTITUTE OF SCIENCE9
  6. 6TECHNISCHE UNIVERSITAT DRESDEN6
  7. 7NAMLAB GGMBH6
  8. 8SOUTH CHINA UNIV OF TECH5
  9. 9STMICROELECTRONICS INT NV5
  10. 10LAYTEC AKTIENGES4
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Gallium Nitride HEMT Transistor Architecture covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data

Filing trend and technology composition

Two views of the same 148-family corpus: when the claims were filed, and which IPC subclasses they sit in. Both point to a field where the architecture debate has largely settled into two adjacent semiconductor-device classifications.

A flat-to-declining filing curve since 2018

From 11 families in 2017 to a peak of 16 in 2018, the trend eases back to 8 by the 2022 midpoint and continues down toward the partial 2026 count. Read this as consolidation of an established architecture rather than as retreat from the technology.

A flat-to-declining filing curve since 201805101520112017162018201920202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Concentration in H01L and H10D

H01L (general semiconductor devices) covers 115 of the 148 records and H10D a further 56, meaning most families are tagged into both. Power conversion (H02M, 16) and pulse/logic circuitry (H03K, 15) mark the main crossover applications, while measurement and material-analysis classes (G01B, G01N) stay in single digits — a sign that process-characterisation claims are a minor share of the corpus.

Concentration in H01L and H10DH01L · Semiconductor devices11577.7%H10D · Semiconductor devices (general)5637.8%H02M · Power conversion (AC/DC etc.)1610.8%H03K · Pulse technique & logic circui…1510.1%H10W117.4%H10P64.1%G01B · Measuring length & dimensions42.7%G01N · Material analysis & testing42.7%Other2416.2%

Shares are the percentage of the 148 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Gallium Nitride HEMT Transistor Architecture covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key patents

The prior art carrying the most citation weight

Representative recent filing
US20250142862A12025-05-01

Normally-on GaN HEMT integration on monolithic p-GaN integrated circuits

STMICROELECTRONICS INTERNATIONAL N.V.

This filing from STMicroelectronics International describes monolithically integrating both enhancement-mode and depletion-mode HEMT power devices on a single p-GaN power IC platform. The distinguishing step is an in-situ plasma treatment that deactivates and depletes magnesium in selected p-GaN gates, converting those gates to normally-on behaviour while gates left untreated remain normally-off — giving both device types on one die without a second epitaxial process.Filed 2025-05-01. Abstract condensed from the published application.

US20250142862A1 — patent drawing 1US20250142862A1 — patent drawing 2
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Most-cited records in the corpus
#Publication no.Patent titleCitations
1US20100019279A1Integrated HEMT and Lateral Field-Effect Rectifier Combinations, Methods, and Systems247
2US8076699B2Integrated HEMT and lateral field-effect rectifier combinations, methods, and systems105
3US20070295993A1Low Density Drain HEMTs104
4US20120261720A1Method for manufacturing a HEMT transistor and corresponding HEMT transistor74
5US20130092958A1Normally-off iii-nitride metal-2DEG tunnel junction field-effect transistors68
6US20190081164A1A High-electron-mobility transistor (HEMT)55
7US20130020614A1Dual-gate normally-off nitride transistors49
8US20160261266A1Electronic Circuit39
9US20190115459A1Wafer bonded GAN monolithic integrated circuits and methods of manufacture of wafer bonded GAN monolithic int…31
10US20140367700A1High-Voltage Cascaded Diode with HEMT and Monolithically Integrated Semiconductor Diode30

Citation counts inside a searched corpus favour older filings simply because they have had longer to accumulate references — treat this table as a map of foundational influence, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Gallium Nitride HEMT Transistor Architecture covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three patterns matter more than the headline family count: where the claim volume sits, where it was filed, and how citation weight is distributed.

Filing venue
90 of 148 in the US
US receiving office share

Enforcement risk concentrates in the United States

With 90 US filings against 17 at the EPO, 12 via PCT, 7 in China, 6 in Germany and 5 in India, freedom-to-operate work on GaN HEMT architecture has to start with US prior art. Filers targeting China or India face a thinner but still active local record.

Receiving-office counts, 2015–2026 cut-off
Claim density
115 H01L + 56 H10D
records tagged to core semiconductor-device classes

Two IPC classes carry almost the whole corpus

The overlap between H01L and H10D means most families claim both general and detailed semiconductor-device structure simultaneously. Power-conversion (H02M, 16) and logic-circuit (H03K, 15) applications are present but secondary, which is where crossover claims are less contested.

IPC subclass distribution across 148 families
Growth signal
16 (2018) → 8 (2022)
peak year vs. midpoint filings

The architecture question is largely settled

Filing volume roughly halved between the 2018 peak and the 2022 midpoint, and no tracked assignee shows positive year-over-year momentum into the latest year. New filings are more likely to be refinements of gate structure or integration steps than fresh architectural claims.

Filing trend, 2017–2026 (2026 partial)
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Gallium Nitride HEMT Transistor Architecture covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the ground, and where it is thin

Assignee activity is concentrated among a small group of universities and device makers, with a long tail of single-family filers. None of the tracked assignees show growth into the latest year, which is more a sign of a settled architecture than of retreat.

Academic-industry pairing
6 co-filings
strongest co-assignee pair

TU Dresden and NAMLAB anchor a dense collaboration

The strongest co-assignee link in the corpus is TU Dresden paired with NAMLAB, with six shared families — well ahead of the next pairings. That density suggests a specific joint research programme rather than incidental overlap, and any freedom-to-operate check on gate-structure claims from that group should treat the two as a single block.

Co-assignee pairs, 148-family corpus
Momentum
0 in latest year
across every top assignee tracked

No assignee is currently accelerating

Every major assignee tracked, including Infineon Technologies Austria, TSMC and Hong Kong University of Science and Technology, shows zero filings in the latest tracked year. Hong Kong UST's year-over-year change is recorded at -100%, consistent with the broader plateau rather than a company-specific pullback.

Recent-year momentum by assignee
Recent entrant
2025-05-01
most recent representative filing date

STMicroelectronics is still filing on integration detail

STMicroelectronics International's 2025 filing on combining normally-on and normally-off HEMTs on one p-GaN IC platform shows activity continuing at the integration-process layer even as headline volume has flattened. This is where late entrants are finding room to claim.

Representative record, STMicroelectronics International N.V.
🔍
Under-claimed sub-areas worth a closer look
Branches with thin coverage relative to the core gate-structure claims
Mg-deactivation plasma treatment for dual-mode gatesMonolithic depletion/enhancement co-integrationCascode GaN gate-drive protection circuitryProcess-characterisation claims (G01B/G01N crossover)Lateral field-effect rectifier integration
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Recent-year momentum by assignee
AssigneeRecent yearYoY
Infineon Technologies Austria AG0
AZUR SPACE Solar Power GmbH0
Taiwan Semiconductor Manufacturing Company (TSMC)0
Indian Institute of Science0
Hong Kong University of Science and Technology0-100%
TU Dresden0
NAMLAB GGMBH0
EpiGaN Holdings0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Gallium Nitride HEMT Transistor Architecture covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this analysis

The dataset points to a settled core and a thin but active integration layer. The next steps depend on whether the goal is freedom-to-operate clearance or finding room to file.

Map the p-GaN gate claim boundary precisely

With H01L and H10D carrying nearly the whole corpus, a claim-by-claim comparison of gate-structure limitations against the most-cited records is the fastest way to see exactly where the fenced territory ends.

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Watch the integration layer, not the architecture layer

Recent activity, including the 2025 STMicroelectronics filing, sits in process integration of dual-mode devices rather than in new gate architectures. That is where a design-around is more likely to succeed.

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Check TU Dresden/NAMLAB and Hong Kong UST family scope

The strongest co-assignee cluster and a major academic filer both show zero recent activity — worth confirming whether that reflects licensing, abandonment, or a pause before a next filing wave.

Explore in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Gallium Nitride HEMT Transistor Architecture covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on GaN HEMT architecture patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Gallium Nitride HEMT Transistor Architecture covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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