GaN HEMT Patents: Who Leads, Where the Gaps Are 2026
- Filing has plateaued, not grown. activity peaked in 2018 at 16 families and sat at 8 by the 2022 midpoint, with no assignee showing positive year-over-year momentum in the latest tracked year.
- Claim density sits almost entirely in two IPC subclasses. H01L and H10D together account for the bulk of the 148 families, while power-conversion (H02M) and pulse/logic (H03K) crossover filings stay in the low teens.
- The United States dominates the filing venue. 90 of the tracked records were filed there against 17 at the EPO and 12 through the PCT route, which concentrates the enforceable prior art in one jurisdiction.
What the GaN HEMT architecture filing record shows
Gallium nitride HEMT architecture patenting is a mature, narrow field rather than an expanding one. The corpus tracked here — 148 patent families filed between 2015 and the 2026 cut-off — centres on normally-off device structures, p-GaN gate architectures and cascode GaN configurations, and the filing curve already peaked in 2018. That does not mean the technology is exhausted: it means the core claim space around gate structure and threshold-voltage control was staked out early, and later entrants are filing around or beneath those claims rather than opening new ground.
Because publication typically lags filing by around eighteen months, the most recent year in any trend understates true activity — the 2026 figure should be read as incomplete, not as a collapse. Patent families, not raw document counts, are used throughout this page because they neutralise continuation filings and multi-jurisdiction duplicates that would otherwise inflate any single assignee's apparent output.
Filing trend and technology composition
Two views of the same 148-family corpus: when the claims were filed, and which IPC subclasses they sit in. Both point to a field where the architecture debate has largely settled into two adjacent semiconductor-device classifications.
A flat-to-declining filing curve since 2018
From 11 families in 2017 to a peak of 16 in 2018, the trend eases back to 8 by the 2022 midpoint and continues down toward the partial 2026 count. Read this as consolidation of an established architecture rather than as retreat from the technology.
Concentration in H01L and H10D
H01L (general semiconductor devices) covers 115 of the 148 records and H10D a further 56, meaning most families are tagged into both. Power conversion (H02M, 16) and pulse/logic circuitry (H03K, 15) mark the main crossover applications, while measurement and material-analysis classes (G01B, G01N) stay in single digits — a sign that process-characterisation claims are a minor share of the corpus.
Shares are the percentage of the 148 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Gallium Nitride HEMT Transistor Architecture with Eureka
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Try EurekaThe prior art carrying the most citation weight
Normally-on GaN HEMT integration on monolithic p-GaN integrated circuits
This filing from STMicroelectronics International describes monolithically integrating both enhancement-mode and depletion-mode HEMT power devices on a single p-GaN power IC platform. The distinguishing step is an in-situ plasma treatment that deactivates and depletes magnesium in selected p-GaN gates, converting those gates to normally-on behaviour while gates left untreated remain normally-off — giving both device types on one die without a second epitaxial process.Filed 2025-05-01. Abstract condensed from the published application.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20100019279A1 | Integrated HEMT and Lateral Field-Effect Rectifier Combinations, Methods, and Systems | 247 |
| 2 | US8076699B2 | Integrated HEMT and lateral field-effect rectifier combinations, methods, and systems | 105 |
| 3 | US20070295993A1 | Low Density Drain HEMTs | 104 |
| 4 | US20120261720A1 | Method for manufacturing a HEMT transistor and corresponding HEMT transistor | 74 |
| 5 | US20130092958A1 | Normally-off iii-nitride metal-2DEG tunnel junction field-effect transistors | 68 |
| 6 | US20190081164A1 | A High-electron-mobility transistor (HEMT) | 55 |
| 7 | US20130020614A1 | Dual-gate normally-off nitride transistors | 49 |
| 8 | US20160261266A1 | Electronic Circuit | 39 |
| 9 | US20190115459A1 | Wafer bonded GAN monolithic integrated circuits and methods of manufacture of wafer bonded GAN monolithic int… | 31 |
| 10 | US20140367700A1 | High-Voltage Cascaded Diode with HEMT and Monolithically Integrated Semiconductor Diode | 30 |
Citation counts inside a searched corpus favour older filings simply because they have had longer to accumulate references — treat this table as a map of foundational influence, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers mean for a filing decision
Three patterns matter more than the headline family count: where the claim volume sits, where it was filed, and how citation weight is distributed.
Enforcement risk concentrates in the United States
With 90 US filings against 17 at the EPO, 12 via PCT, 7 in China, 6 in Germany and 5 in India, freedom-to-operate work on GaN HEMT architecture has to start with US prior art. Filers targeting China or India face a thinner but still active local record.
Two IPC classes carry almost the whole corpus
The overlap between H01L and H10D means most families claim both general and detailed semiconductor-device structure simultaneously. Power-conversion (H02M, 16) and logic-circuit (H03K, 15) applications are present but secondary, which is where crossover claims are less contested.
The architecture question is largely settled
Filing volume roughly halved between the 2018 peak and the 2022 midpoint, and no tracked assignee shows positive year-over-year momentum into the latest year. New filings are more likely to be refinements of gate structure or integration steps than fresh architectural claims.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to gallium nitride hemt transistor architecture, with the prior art for and against each one.
Who holds the ground, and where it is thin
Assignee activity is concentrated among a small group of universities and device makers, with a long tail of single-family filers. None of the tracked assignees show growth into the latest year, which is more a sign of a settled architecture than of retreat.
TU Dresden and NAMLAB anchor a dense collaboration
The strongest co-assignee link in the corpus is TU Dresden paired with NAMLAB, with six shared families — well ahead of the next pairings. That density suggests a specific joint research programme rather than incidental overlap, and any freedom-to-operate check on gate-structure claims from that group should treat the two as a single block.
No assignee is currently accelerating
Every major assignee tracked, including Infineon Technologies Austria, TSMC and Hong Kong University of Science and Technology, shows zero filings in the latest tracked year. Hong Kong UST's year-over-year change is recorded at -100%, consistent with the broader plateau rather than a company-specific pullback.
STMicroelectronics is still filing on integration detail
STMicroelectronics International's 2025 filing on combining normally-on and normally-off HEMTs on one p-GaN IC platform shows activity continuing at the integration-process layer even as headline volume has flattened. This is where late entrants are finding room to claim.
| Assignee | Recent year | YoY |
|---|---|---|
| Infineon Technologies Austria AG | 0 | — |
| AZUR SPACE Solar Power GmbH | 0 | — |
| Taiwan Semiconductor Manufacturing Company (TSMC) | 0 | — |
| Indian Institute of Science | 0 | — |
| Hong Kong University of Science and Technology | 0 | -100% |
| TU Dresden | 0 | — |
| NAMLAB GGMBH | 0 | — |
| EpiGaN Holdings | 0 | — |
Where to take this analysis
The dataset points to a settled core and a thin but active integration layer. The next steps depend on whether the goal is freedom-to-operate clearance or finding room to file.
Map the p-GaN gate claim boundary precisely
With H01L and H10D carrying nearly the whole corpus, a claim-by-claim comparison of gate-structure limitations against the most-cited records is the fastest way to see exactly where the fenced territory ends.
Explore in EurekaWatch the integration layer, not the architecture layer
Recent activity, including the 2025 STMicroelectronics filing, sits in process integration of dual-mode devices rather than in new gate architectures. That is where a design-around is more likely to succeed.
Explore in EurekaCheck TU Dresden/NAMLAB and Hong Kong UST family scope
The strongest co-assignee cluster and a major academic filer both show zero recent activity — worth confirming whether that reflects licensing, abandonment, or a pause before a next filing wave.
Explore in EurekaCommon questions on GaN HEMT architecture patents
The corpus shows filing concentrated among a mix of device manufacturers and universities rather than a single dominant holder. The most-cited foundational records date back to the late 2000s and early 2010s and relate to integrated HEMT and lateral field-effect rectifier combinations, which still anchor much of the citation graph. Any clearance search should start with those records before moving to more recent, narrower integration filings such as the 2025 STMicroelectronics application.
Filing volume has declined from a 2018 peak of 16 families to roughly half that by 2022, and no tracked assignee shows growth into the latest year. That points to a maturing architecture rather than a shrinking market — the underlying GaN device business continues to grow, but the foundational structural claims were largely staked out by the late 2010s. New filings now tend to sit at the process-integration layer, such as combining normally-on and normally-off devices on one platform.
A normally-off HEMT is a device that does not conduct current with zero gate voltage, which matters for power-switching safety and is a key differentiator from the naturally depletion-mode behaviour of standard GaN HEMTs. Much of the p-GaN gate architecture patenting in this corpus exists specifically to achieve normally-off operation without sacrificing the high electron mobility that makes GaN attractive in the first place. Claims in this space typically cover the gate stack composition, threshold-voltage control method, or a specific fabrication step such as plasma treatment.
The United States accounts for 90 of the 148 tracked records, making it the primary jurisdiction for any clearance work, followed by Europe at 17 and the PCT route at 12. China, Germany and India each have a smaller but non-trivial presence in the single digits, so a global product launch still warrants a local check in those markets even though the bulk of the enforceable prior art sits in the US.
Cascode GaN structures pair a depletion-mode GaN HEMT with a low-voltage silicon FET to achieve normally-off behaviour at the circuit level, while p-GaN gate architecture achieves normally-off behaviour at the device level by altering the gate stack itself. Both routes are represented in this corpus and are frequently cited together in search strings because they solve the same normally-off requirement through different means. Patent claims tend to diverge sharply here: cascode claims often extend into H02M power-conversion and H03K logic-circuit territory, while p-GaN claims stay concentrated in H01L and H10D device-structure classes.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.