GaN Power Module Packaging Patent Snapshot 2026
GaN power module packaging is a highly concentrated, early-growth field dominated by Navitas Semiconductor, which alone holds a commanding share of the ranked filers’ combined patent records. The corpus is still expanding on a multi-year basis, though annual volume eased from its 2022 peak and the most recent periods remain understated by publication lag.
Navitas leads a tightly held field with the top five filers accounting for most ranked activity
Navitas Semiconductor sits at the top of the applicant ranking with 14 patent records, followed by GaN Systems with 8 and Semicon Components Industries with 4 — establishing a clear three-tier hierarchy among the six ranked filers.
The top five filers collectively account for 97% of the ranked applicants visible in this query’ combined patent records, a concentration level that leaves almost no room in the leaderboard for new entrants unless they displace existing positions.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Navitas Semiconductor | 14 | |
| 2 | GaN Systems | 8 | |
| 3 | Semicon Components Industries LLC | 4 | |
| 4 | MACOM Technology Solutions Holdings Inc | 2 | |
| 5 | ND-Hi Tech Lab Inc | 2 | |
| 6 | Xidian University | 1 |
The leaders’ positions imply that core packaging architectures — particularly semiconductor device integration and multi-chip module approaches under H01L — are already being claimed, making differentiation through adjacent technical routes increasingly important for challengers.
The most recent 18–24 months are subject to publication lag and will likely show higher counts as applications are published; the current totals for 2023 onward should be treated as provisional. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
A 2022 filing surge shaped the corpus; semiconductor device packaging dominates the technology mix
Two charts together reveal when and where inventive activity has concentrated: the annual trend identifies the growth pulse, while the IPC branch breakdown shows which technical sub-domains attract the most filings.
Annual filing trend
Filings were negligible through 2020, accelerated sharply to a peak in 2022 with 14 records filed that year, then eased to 2 in 2023. Years from 2023 onward are understated by publication lag and will revise upward; the 2022 peak should be read as the current high-water mark rather than a ceiling.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01L (Semiconductor devices) is the visible branch with 34 patent records, followed by H10D (Semiconductor devices — general) at 15, H03K (Pulse technique and logic circuits) at 13, and H02J and H02M (power supply and power conversion) each at 11. Amplifier (H03F), H10W, and antenna (H01Q) branches each hold only 1–2 records, marking them as under-represented relative to the core packaging cluster.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Packaging solutions for devices and systems compri…
Packaging solutions for devices and systems comprising lateral GaN power transistors are disclosed, including components of a packaging assembly, a semiconductor device structure, and a method of fabrication thereof. In the packaging assembly, a GaN die, comprising one or more lateral GaN power transistors, is sandwiched between first and second leadframe… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRI… | 70 |
| 2 | PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRI… | 47 |
| 3 | Packaging solutions for devices and systems compri… | 30 |
| 4 | Method and system for co-packaging vertical galliu… | 30 |
| 5 | PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRI… | 28 |
| 6 | Embedded packaging for devices and systems compris… | 23 |
| 7 | Packaging solutions for devices and systems compri… | 19 |
| 8 | Bandwidth limiting methods for GAN power transistors | 17 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Navitas Semiconductor
Navitas Semiconductor holds 14 patent records — the largest position in the ranking — and is classified as a new entrant with a trend of new entrant, meaning all activity is concentrated in the recent window. Their technology emphasis spans H01L 23, H01L 25, and H01L 27 (semiconductor device packaging and integration sub-classes), indicating a broad claim strategy across multi-chip and integrated module architectures.
patent records: 14GaN Systems
GaN Systems holds 8 patent records and focuses its technology coverage on H01L 23, H01L 21, and H01L 29 — spanning packaging, fabrication process, and device structure sub-classes. Momentum data for GaN Systems is not available in the applicant momentum evidence, but their ranking position as second-largest filer and their breadth across fabrication and packaging sub-classes signals a vertically integrated IP approach.
patent records: 8Frequently asked questions
The corpus covers 20 patent families in scope. This is a small, early-stage field that only began generating meaningful filing volume in 2021.
Navitas Semiconductor leads with 14 patent records, followed by GaN Systems with 8 and Semicon Components Industries with 4. The top five filers account for 97% of the ranked applicants visible in this query’ combined total.
Filings were negligible from 2017 through 2020, then accelerated sharply from 2021, peaking at 14 records in 2022. The field is in a Growth lifecycle stage with a 300% increase in recent-window filings versus the prior window, though annual volume has eased from the 2022 peak.
The United States is visible in with 31 patent records. China, Europe (EPO), and WIPO (PCT) each account for just 1 record, indicating a strongly US-centric filing strategy across the visible assignees.
H01L (Semiconductor devices) is the largest branch at 34 patent records, followed by H10D at 15, H03K (Pulse technique and logic circuits) at 13, and H02J and H02M (power supply and power conversion) at 11 each. Amplifier (H03F), H10W, and antenna (H01Q) branches hold only 1–2 records each.
No co-applicant filing relationships are detected in the current evidence. All ranked applicants appear to be filing independently, which may reflect the proprietary and competitive nature of early-stage GaN packaging IP development.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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