GaN Power/Thermal Cycling Durability Patent Snapshot
GaN Systems dominates this nascent, highly concentrated field, holding the overwhelming share of patent records among the handful of active filers. The field is still expanding on a multi-year basis with recent-window growth positive, though annual volume has eased from its 2022 peak and the most recent years remain understated by publication lag.
GaN Systems holds near-total leadership in a nascent, two-player field
GaN Systems leads the applicant ranking with 11 patent records, followed by the Regents of the University of California with 1 patent record — together they account for the entire visible corpus in this topic.
The top five filers hold 100% of the ranked applicants visible in this query’ combined total, confirming extreme concentration in a single visible commercial entity with one academic co-filer at a distant second. There is no meaningful challenger tier at present.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | GaN Systems Inc. | 11 | |
| 2 | Regents of the University of California | 1 |
GaN Systems’ position, built primarily around semiconductor device packaging (H01L 23, H01L 29, and H01L 21), signals a deliberate proprietary strategy around thermal and packaging durability that would be difficult to design around without engaging the existing claim evidence snapshot directly.
The most recent 18–24 months are subject to publication lag and likely understate actual filing activity; the competitive picture may shift as those applications publish. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Filing activity accelerated from 2020, peaked in 2022, and remains understated in recent years
Two charts together reveal when and where technical activity concentrated: an annual filing trend showing the 2020–2022 ramp, and a technology branch composition showing the IPC classes that define the field’s current scope.
Annual filing trend
Meaningful filing activity began in 2020, reached its highest recorded annual level in 2022, then shows zeros for 2023–2026 — a pattern consistent with publication lag rather than an actual cessation of activity. The multi-year recent window sits 50% above the prior window, confirming net expansion on a multi-year basis despite the apparent post-2022 quiet.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01L (Semiconductor devices) accounts for the largest share of patent records, with H10D (Semiconductor devices, general) and H10W each contributing a smaller but notable share. The clustering around semiconductor device structure and packaging IPC classes reflects the field’s focus on die-level and package-level thermal management rather than circuit or system-level approaches.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Embedded packaging for devices and systems compris…
Embedded packaging for devices and systems comprising lateral GaN power transistors is disclosed. The packaging assembly is suitable for large area, high power GaN transistors and comprises an assembly of a GaN power transistor and package components comprising a three level interconnect structure. In preferred embodiments, the three level interconnect… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRI… | 47 |
| 2 | Packaging solutions for devices and systems compri… | 30 |
| 3 | PACKAGING SOLUTIONS FOR DEVICES AND SYSTEMS COMPRI… | 28 |
| 4 | Embedded packaging for devices and systems compris… | 23 |
| 5 | Embedded die packaging for power semiconductor dev… | 22 |
| 6 | Packaging solutions for devices and systems compri… | 19 |
| 7 | Packaging solutions for devices and systems compri… | 16 |
| 8 | Embedded packaging for devices and systems compris… | 12 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
GaN Systems
GaN Systems holds 11 patent records, concentrated across H01L 23 (device packaging and thermal management), H01L 29 (semiconductor device structures), and H01L 21 (semiconductor manufacturing). Its momentum is classified as a new entrant on a recent-filing basis, consistent with the field’s early stage. The portfolio’s packaging focus suggests a strategy of protecting thermal cycling durability at the die and package interface level.
patent records: 11University of California
The Regents of the University of California hold 1 patent record, distributed across H01L 21, H01L 23, and H01L 29 — the same IPC cluster as GaN Systems, indicating overlapping technical scope. Its momentum is also classified as a new entrant. As the only academic filer, it represents a potential licensing or collaboration pathway for commercial players seeking foundational IP.
patent records: 1Frequently asked questions
There are 5 patent families in scope for this topic, as identified by PatSnap Eureka’s analysis of GaN power and thermal cycling durability.
GaN Systems is the leading filer with 11 patent records, far ahead of the only other ranked applicant, the Regents of the University of California, which holds 1 patent record.
The field is classified as Growth: the recent three-year filing window is 50% above the prior three-year window. Annual volume has eased from its 2022 peak and the most recent years are understated by publication lag, so the apparent quiet after 2022 should not be read as decline.
H01L (Semiconductor devices) leads with 12 patent records, followed by H10D (Semiconductor devices, general) and H10W, each with 5 patent records. The concentration in H01L reflects a focus on packaging and device-structure approaches to thermal durability.
No co-applicant relationships are detected in the current evidence — GaN Systems and the University of California each appear as independent filers with no jointly assigned patents recorded in the corpus.
The United States accounts for 11 of the 12 jurisdiction-level patent records, with one WIPO (PCT) filing as the only international protection. No granted patents are visible in European, Asian, or other major jurisdictions in the current evidence.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.