https://www.patsnap.com/resources/blog/rd-blog/gas-sensor-advanced-materials-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Sensors & MEMS · Patent Landscape
Gas Sensor Advanced Materials Patents: Filing Trends and Where the Claim Space Sits
  • Filings peaked in 2019 at 21 records and have not returned to that level since — the midpoint year 2022 logged just 2, pointing to a cooled-off filing pace rather than sustained growth.
  • G01N dominates the classification mix with all 83 records touching material analysis and testing, while adjacent subclasses like C01G, H05B and C01B each carry a handful of supporting filings — the sensing-layer chemistry is claimed far more densely than the surrounding heater and readout circuitry.
  • The most-cited priority documents are metal oxide structural claims on tube-wall micropore/macropore architectures and composite nanofiber materials, both filed before 2017 and still drawing the heaviest citation counts in this corpus.
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83
Published Records
75%
Top-5 Share of All Records
-67%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··8 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks patent families filed against gas sensors that specify an advanced sensing material — metal oxide sensing layers, 2D materials, or MOF-based sensing chemistries — rather than sensor designs that treat the sensing element as a black box. The search combines gas sensor / gas detection sensor / chemiresistive gas sensor language with metal oxide sensing material / 2D material gas sensor / MOF sensing material claim terms, so the corpus is deliberately narrow: it is the materials-and-structure layer of gas sensing, not the full sensor market.

Coverage runs from 2015 through the 2026-07-31 cut-off. Publication lags filing by roughly eighteen months, so the 2025 and 2026 counts in any trend view understate actual filing activity for those years — treat the most recent one or two years as a floor, not a ceiling.

Filing activity and classification mix, 2017–2026
  1. 1POINT ENG20
  2. 2STMICROELECTRONICS SRL15
  3. 3SENSIRION AG11
  4. 4KOREA ADVANCED INST OF SCI & TECH9
  5. 5CELLMO MATERIALS INNOVATION INC7
  6. 6ALPHANE LABS LLC4
  7. 7APPLIED NANOTECH HOLDINGS INC3
  8. 8NANOHMICS INC3
  9. 9APPLE INC2
  10. 10MATRIX SENSORS INC2
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Gas Sensor Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data

Filing trend and technology composition

83 patent families make up this landscape, concentrated overwhelmingly in one IPC subclass with a scatter of supporting classifications around it.

A 2019 peak that has not been repeated

Filings rose from 6 in 2017 to a peak of 21 in 2019, then fell back sharply — the 2022 midpoint sits at just 2 records. That pattern reads as a cooled filing wave rather than a still-building one: whatever drove the 2019 surge in metal oxide and 2D-material sensing claims had largely played out by the early 2020s, and the partial 2026 count (1 so far) is consistent with the publication lag rather than a fresh downturn.

A 2019 peak that has not been repeated0613192562017201821201920202021202220232024202512026Most recent year is partial — publication lag means later filings are not yet visible.

G01N carries the whole corpus

Every one of the 83 records classifies under G01N (material analysis and testing), confirming this is a materials-claims corpus by construction. The next-heaviest subclasses are C01G (compounds of other metals, 11 records) and H05B (electric heating and lighting circuits, 9 records) — the heater/drive-circuit side of chemiresistive sensing that pairs naturally with metal oxide layers. C01B (inorganic compounds), D01D (filament spinning — relevant to nanofiber sensing layers) and G06F (digital processing, likely signal conditioning) each hold single-digit counts, and H01L and B05D trail further still.

G01N carries the whole corpusG01N · Material analysis & testing83100.0%C01G · Compounds of other metals1113.3%H05B · Electric heating & lighting ci…910.8%C01B · Non-metallic elements & inorga…44.8%D01D · Man-made filament spinning44.8%G06F · Electric digital data processi…44.8%H01L · Semiconductor devices33.6%B05D · Coating processes22.4%Other1619.3%

Shares are the percentage of the 83 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Gas Sensor Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key patents

The most-cited priority documents

Representative record
US20180059021A12018-03-01

Electronic Devices with Environmental Sensors

APPLE INC.

An environmental sensor may include a heat source that heats a metal oxide sensing material. Electrodes may be formed in the metal oxide sensing material that measure the resistance of the metal oxide sensing material to determine the concentration of various gases. The environmental sensor may include an infrared light source that emits infrared light at a given wavelength. An infrared detector and band-pass filter may be used to detect the concentration of a particular gas such as carbon dioxide. In order to reduce power consumption, a heater may act as both the heat source for the metal oxide sensing material and the infrared light source for the infrared detector.Filed by Apple, this record pairs a resistive metal oxide sensing element with a shared heater/IR-source architecture aimed at consumer-device power budgets.

US20180059021A1 — patent drawing 1US20180059021A1 — patent drawing 2
View full record
Highest-citation records in this corpus
#Publication no.Patent titleCitations
1US20160334359A1Member for Gas Sensor, Having a Metal Oxide Semiconductor Tube Wall with Micropores and Macropores, Gas Senso…48
2EP2778667A1Multi-temperature CMOS gas sensor36
3US20160041116A1Composite metal oxide materials including polycrystalline nanofibers, microparticles, and nanoparticles, gas …30
4US20090058431A1Etch resistant gas sensor26
5US20170160221A1Methods for detecting and quantifying gas species analytes using differential gas species diffusion23
6KR1020160037149AComposite metal oxide sensing materials composed of polycrystalline nanofibers, nanoparticles and micropartic…20
7US8555701B1Enhanced metal oxide gas sensor18
8US20170131252A1Micro heater, micro sensor and micro sensor manufacturing method14
9US20160370336A1Micro Heater and Micro Sensor14
10US20210109049A1Gas sensing assembly and method13

Citation counts accumulate over time, so older filings are structurally favoured — read this table as a map of influential prior art, not of current filing activity.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Gas Sensor Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers say about this field

Three patterns stand out once the raw counts are read against filing dates and classification codes.

Filing pace
21 in 2019, 2 by 2022
peak-to-midpoint filings

A wave that crested and receded

The jump to 21 filings in 2019 followed by a drop to 2 at the 2022 midpoint suggests a concentrated push — possibly tied to a specific material breakthrough or product cycle — rather than a market building steadily toward today. Anyone benchmarking 'how active is this space right now' should weight recent years, not the historical peak.

Filing trend, 2017–2026
Classification depth
83 of 83 in G01N
records classed in material analysis

One subclass, several supporting ones

Every record in this corpus sits in G01N, with C01G and H05B as the largest secondary clusters. That means the differentiation between filings happens inside G01N sub-groups and in how heater/drive circuitry (H05B) is integrated — not across IPC subclasses.

IPC composition
Citation concentration
48 citations, top record
highest single citation count

Structural claims still anchor the field

The two most-cited records both claim physical sensing-layer structure — a micropore/macropore tube wall and a composite nanofiber/microparticle/nanoparticle material — rather than circuit or software layers. New entrants should expect prior art searches in this area to surface these structural claims first.

Most-cited records
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to gas sensor advanced materials, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Gas Sensor Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the activity has gone quiet

83 families is a small enough corpus that individual assignees and even named inventors show up clearly in the co-filing data, but recent-year activity has gone flat across the named organisations tracked here.

Receiving offices
United States 45
of tracked filing routes

US-centred, with a European second tier

United States filings (45) outnumber the next office — European Patent Office (19) — by more than two to one, with Germany, Austria, South Korea and WIPO/PCT each contributing single-digit counts. That skew suggests this is a US-prosecution-first field for most applicants, with Europe as the standard secondary filing route.

Receiving office counts
Co-filing
10 co-assignee pairs
recorded in this corpus

A small inventor-led cluster

The strongest co-filing links — Savoy Steve M with Mitchell Daniel R, Mann Chris W and John Jeremy J, each pairing appearing three times — point to a tight inventor group filing repeatedly together rather than a large corporate team.

Co-assignee pairs
Recent momentum
0 filings, latest year
across six tracked assignees

Named assignees have gone quiet

Every assignee tracked for recent-year momentum in this dataset — spanning materials specialists, a semiconductor major and a national research institute — shows zero filings in the latest year. That is consistent with the broader 2019-peak-then-decline pattern rather than any single company pulling back.

Recent-year momentum
🔍
Under-claimed branches worth checking before filing
Areas with thin direct coverage in this corpus relative to the core metal oxide claims
2D material chemiresistive layersMOF-based sensing compositesnanofiber sensing architecturesshared heater/IR-source integrationflexible substrate gas sensors
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Point Engineering Co., Ltd.0
STMicroelectronics S.r.l. (Italy)0
Sensirion AG0
Korea Advanced Institute of Science and Technology (KAIST)0
MATRIX SENSORS INC0
CELLMOBILITY INC0
Applied Nanotech Holdings, Inc.0
SAVOY STEVE M0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Gas Sensor Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this

The counts and rankings here are a starting point for freedom-to-operate and whitespace work, not a substitute for it.

Check the structural claims first

The highest-cited records claim physical sensing-layer architecture — pore structure, composite nanofiber materials. Any new metal oxide sensing design should be checked against these before circuit-level differentiation is considered.

Explore prior art in Eureka

Track the quiet assignees

Zero recent-year filings across the named organisations here does not mean the technology is abandoned — it may mean activity has shifted to unpublished applications given the eighteen-month lag.

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Map the under-claimed branches

2D-material and MOF sensing composites carry far fewer direct claims than metal oxide layers in this corpus, which may indicate open claim space rather than a lack of technical interest.

Run a whitespace search in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Gas Sensor Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Gas Sensor Advanced Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.