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Run your analysis now →This dataset tracks patent families filed against gas sensors that specify an advanced sensing material — metal oxide sensing layers, 2D materials, or MOF-based sensing chemistries — rather than sensor designs that treat the sensing element as a black box. The search combines gas sensor / gas detection sensor / chemiresistive gas sensor language with metal oxide sensing material / 2D material gas sensor / MOF sensing material claim terms, so the corpus is deliberately narrow: it is the materials-and-structure layer of gas sensing, not the full sensor market.
Coverage runs from 2015 through the 2026-07-31 cut-off. Publication lags filing by roughly eighteen months, so the 2025 and 2026 counts in any trend view understate actual filing activity for those years — treat the most recent one or two years as a floor, not a ceiling.
83 patent families make up this landscape, concentrated overwhelmingly in one IPC subclass with a scatter of supporting classifications around it.
Filings rose from 6 in 2017 to a peak of 21 in 2019, then fell back sharply — the 2022 midpoint sits at just 2 records. That pattern reads as a cooled filing wave rather than a still-building one: whatever drove the 2019 surge in metal oxide and 2D-material sensing claims had largely played out by the early 2020s, and the partial 2026 count (1 so far) is consistent with the publication lag rather than a fresh downturn.
Every one of the 83 records classifies under G01N (material analysis and testing), confirming this is a materials-claims corpus by construction. The next-heaviest subclasses are C01G (compounds of other metals, 11 records) and H05B (electric heating and lighting circuits, 9 records) — the heater/drive-circuit side of chemiresistive sensing that pairs naturally with metal oxide layers. C01B (inorganic compounds), D01D (filament spinning — relevant to nanofiber sensing layers) and G06F (digital processing, likely signal conditioning) each hold single-digit counts, and H01L and B05D trail further still.
Shares are the percentage of the 83 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about gas sensor advanced materials and every answer comes back with the patent numbers behind it.
Try EurekaAn environmental sensor may include a heat source that heats a metal oxide sensing material. Electrodes may be formed in the metal oxide sensing material that measure the resistance of the metal oxide sensing material to determine the concentration of various gases. The environmental sensor may include an infrared light source that emits infrared light at a given wavelength. An infrared detector and band-pass filter may be used to detect the concentration of a particular gas such as carbon dioxide. In order to reduce power consumption, a heater may act as both the heat source for the metal oxide sensing material and the infrared light source for the infrared detector.Filed by Apple, this record pairs a resistive metal oxide sensing element with a shared heater/IR-source architecture aimed at consumer-device power budgets.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20160334359A1 | Member for Gas Sensor, Having a Metal Oxide Semiconductor Tube Wall with Micropores and Macropores, Gas Senso… | 48 |
| 2 | EP2778667A1 | Multi-temperature CMOS gas sensor | 36 |
| 3 | US20160041116A1 | Composite metal oxide materials including polycrystalline nanofibers, microparticles, and nanoparticles, gas … | 30 |
| 4 | US20090058431A1 | Etch resistant gas sensor | 26 |
| 5 | US20170160221A1 | Methods for detecting and quantifying gas species analytes using differential gas species diffusion | 23 |
| 6 | KR1020160037149A | Composite metal oxide sensing materials composed of polycrystalline nanofibers, nanoparticles and micropartic… | 20 |
| 7 | US8555701B1 | Enhanced metal oxide gas sensor | 18 |
| 8 | US20170131252A1 | Micro heater, micro sensor and micro sensor manufacturing method | 14 |
| 9 | US20160370336A1 | Micro Heater and Micro Sensor | 14 |
| 10 | US20210109049A1 | Gas sensing assembly and method | 13 |
Citation counts accumulate over time, so older filings are structurally favoured — read this table as a map of influential prior art, not of current filing activity.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Three patterns stand out once the raw counts are read against filing dates and classification codes.
The jump to 21 filings in 2019 followed by a drop to 2 at the 2022 midpoint suggests a concentrated push — possibly tied to a specific material breakthrough or product cycle — rather than a market building steadily toward today. Anyone benchmarking 'how active is this space right now' should weight recent years, not the historical peak.
Every record in this corpus sits in G01N, with C01G and H05B as the largest secondary clusters. That means the differentiation between filings happens inside G01N sub-groups and in how heater/drive circuitry (H05B) is integrated — not across IPC subclasses.
The two most-cited records both claim physical sensing-layer structure — a micropore/macropore tube wall and a composite nanofiber/microparticle/nanoparticle material — rather than circuit or software layers. New entrants should expect prior art searches in this area to surface these structural claims first.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to gas sensor advanced materials, with the prior art for and against each one.
83 families is a small enough corpus that individual assignees and even named inventors show up clearly in the co-filing data, but recent-year activity has gone flat across the named organisations tracked here.
United States filings (45) outnumber the next office — European Patent Office (19) — by more than two to one, with Germany, Austria, South Korea and WIPO/PCT each contributing single-digit counts. That skew suggests this is a US-prosecution-first field for most applicants, with Europe as the standard secondary filing route.
The strongest co-filing links — Savoy Steve M with Mitchell Daniel R, Mann Chris W and John Jeremy J, each pairing appearing three times — point to a tight inventor group filing repeatedly together rather than a large corporate team.
Every assignee tracked for recent-year momentum in this dataset — spanning materials specialists, a semiconductor major and a national research institute — shows zero filings in the latest year. That is consistent with the broader 2019-peak-then-decline pattern rather than any single company pulling back.
| Assignee | Recent year | YoY |
|---|---|---|
| Point Engineering Co., Ltd. | 0 | — |
| STMicroelectronics S.r.l. (Italy) | 0 | — |
| Sensirion AG | 0 | — |
| Korea Advanced Institute of Science and Technology (KAIST) | 0 | — |
| MATRIX SENSORS INC | 0 | — |
| CELLMOBILITY INC | 0 | — |
| Applied Nanotech Holdings, Inc. | 0 | — |
| SAVOY STEVE M | 0 | — |
The counts and rankings here are a starting point for freedom-to-operate and whitespace work, not a substitute for it.
The highest-cited records claim physical sensing-layer architecture — pore structure, composite nanofiber materials. Any new metal oxide sensing design should be checked against these before circuit-level differentiation is considered.
Explore prior art in EurekaZero recent-year filings across the named organisations here does not mean the technology is abandoned — it may mean activity has shifted to unpublished applications given the eighteen-month lag.
Monitor assignee activity in Eureka2D-material and MOF sensing composites carry far fewer direct claims than metal oxide layers in this corpus, which may indicate open claim space rather than a lack of technical interest.
Run a whitespace search in EurekaIn this landscape, advanced materials means the sensing layer itself is claimed as chemistry or structure — metal oxide semiconductor layers, two-dimensional materials such as graphene or transition metal dichalcogenides, or metal-organic framework (MOF) composites — rather than the sensor being treated as an undifferentiated black box in the claims. This distinction matters because a huge number of gas sensor patents claim packaging, circuitry or calibration methods without ever specifying the sensing material, and those records fall outside this corpus by design. If you are doing freedom-to-operate work, confirm which category your design falls into before relying on counts from either type of search.
The data shows filings rising from 6 in 2017 to 21 in 2019 before falling sharply, with only 2 records at the 2022 midpoint. The evidence here does not identify a specific cause, but the pattern is typical of a technology wave where an initial cluster of applicants stakes out claims around a new material class and then filing slows once the obvious claim territory is occupied. It is worth noting the 2025-2026 counts are also artificially low because of the roughly eighteen-month lag between filing and publication, so the true recent trend is likely higher than shown.
The corpus includes both established electronics companies and specialist materials and sensor firms, alongside a tightly linked group of individual co-inventors who file together repeatedly. Recent-year momentum data shows the named assignees tracked here — including a semiconductor major and a national research institute — all recorded zero filings in the latest year, suggesting the sector's filing activity is either dispersed across many smaller applicants or has shifted to publications not yet visible in this cut-off. Checking the assignee ranking table directly, rather than relying on any single company name, gives the fuller picture.
Relative to the dense claim coverage on metal oxide sensing layers — which anchor both of the top two most-cited records in this corpus — branches like 2D-material chemiresistive layers, MOF-based sensing composites and nanofiber sensing architectures carry comparatively few direct claims. That does not guarantee freedom to operate, since a thin count can also mean a technology is early rather than open, but it does mean these branches deserve a closer prior-art look before assuming they are blocked the way metal oxide claims are.
That application, filed by Apple and dated 2018-03-01, describes an environmental sensor combining a metal oxide sensing material heated by a shared heat source, with electrodes measuring resistance change to determine gas concentration, alongside an infrared light source and band-pass filter for detecting gases like carbon dioxide. Its notable feature is using the same heater as both the heat source for the metal oxide layer and the light source for the infrared detector, aimed at cutting power consumption in a consumer device context. It is one representative record among 83 in this corpus and should be read alongside the higher-cited structural patents rather than in isolation.
Go past this page: query the whole gas sensor advanced materials corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.