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GFRP Defect Detection & Cure AI/ML Patent Snapshot

GFRP Defect Detection & Cure AI/ML Patent Snapshot
Evidence Snapshot
GFRP Defect Detection & Cure AI/ML Patent Snapshot in 2026

The application of AI and ML to glass-fibre-reinforced polymer (GFRP) defect detection and cure monitoring is a nascent, highly fragmented field with activity concentrated almost entirely in China. Filing volume remained near zero through 2023 before a sharp uptick in 2024–2025, signalling early-stage formation rather than an established competitive front.

9
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
China
Leading jurisdiction
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Published byPatsnap Insights Team··5 min readVerified by Patsnap Eureka data
Overview

A fragmented field with no dominant player — all leading filers hold a single patent record each

The corpus spans 9 patent families, with no single applicant holding more than 1 patent record. Nanjing Forestry University, Hunan University of Science and Technology, Jiangxi Investment Group, Graphic Era Deemed to be University, and Fuzhou University each hold 1 patent record — together accounting for 45% of the top hundred filers’ combined total.

There is effectively no tier gap: every ranked applicant sits at the same count, which makes this one of the most diffuse competitive structures observable. No incumbent has accumulated a blocking portfolio, and no single organization has established a recognisable lead.

Leading applicants
#ApplicantPatent recordsShare
1Nanjing Forestry University1
2HUNAN UNIV OF SCI & TECH1
3Jiangxi Investment Group Co., Ltd.1
4Graphic Era Deemed to be University1
5Fuzhou University1
6Guizhou Ganxing Coal Industry Co., Ltd.1
#ApplicantPatent recordsShare
7Qingdao Lanmeng Industry Co., Ltd.1
8Shanghai Jiaqi Intelligent Technology Co., Ltd.1
9Zhenjiang Shenlong Electrical Pipe Fittings Co., Ltd.1
10Shenzhen University1
11CHINA HELICOPTER RES & DEV INST1
↗ Hover a row · click a company to ask Eureka

The flat ranking implies that first-movers who build even a modest, coherent patent portfolio in the near term could establish a durable positional advantage. The absence of consolidation also suggests that collaboration or licensing barriers are low.

The most recent filing years (20242025) are subject to publication lag and likely under-count actual activity; the true recent-period volume may be higher than the trend currently shows. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Activity surged in 2025 after years of near-zero filings; AI computing dominates the technology mix

Two charts together reveal both the timing of market entry and the technical approach: filing volume shows when interest crystallised, while the IPC branch breakdown shows how applicants are framing their inventions.

Annual filing trend

Filings were zero from 2017 through 2021, a single record appeared in 2022, and then 2 records were filed in 2024 followed by 6 in 2025. Because 2024–2025 filings are still working through examination and publication pipelines, the 2025 bar is likely a floor, not a ceiling. The pattern indicates that the field transitioned from a conceptual curiosity to active patenting only around 2024.

Annual filing trendAnnual values from 2017 to 2026, peaking at 6 in 2025.02017020180201902020020211202202023220246202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

G06N (Computing based on AI models) leads with 8 patent records, followed closely by G06F (Electric digital data processing) with 7 — confirming that algorithmic and computational framing is visible in. Physical measurement branches G01D (Measuring, general and recording) and G01N (Material analysis and testing) each appear in 2 records, reflecting a minority of filings that anchor the AI methods to physical sensing. G16C (Computational chemistry), F03D (Wind motors), G06V (Image/video recognition), and power-system branches each appear in 1 record, indicating scattered application-domain coverage.

Technology compositionG06N · Computing based on AI models leads with 8; G06F · Electric digital data processing 7.G06N · Computing based o…8G06F · Electric digital …7G01D · Measuring (genera…2G01N · Material analysis…2G16C · Computational che…2F03D · Wind motors (wind…1G06Q · Business, commerc…1G06V · Image/video recog…1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
CN120629376APublished 2025-09-12

基于自适应小波包分解与深度学习的锚杆锚索无损检测法

湖南科技大学

本发明属于岩土工程无损检测技术领域,具体涉及基于自适应小波包分解与深度学习的锚杆锚索无损检测法,尤其适用于复杂工况下的多缺陷识别与高精度定位。该方法通过激励锚杆锚索,采集锚杆锚索的应力波信号,对信号进行预处理,使用动态优化小波基与分解层数,实现信号的高分辨率时频分析,并且结合时频图卷积神经网络与多源特征融合,显著提升复杂噪声环境下的缺陷检测精度,同时还支持钢质、GFRP等多种材质的自适应检测,具备工程推广应用价值。 (excerpt from the patent abstract)

基于自适应小波包分解与深度学习的锚杆锚索无损检测法 — patent drawing基于自适应小波包分解与深度学习的锚杆锚索无损检测法 — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1一种基于神经网络的GFRP耐久性评估方法2
2A system and method for multi-objective optimizati…1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Nanjing Forestry University

Nanjing Forestry University

Nanjing Forestry University holds 1 patent record and is flagged as a new entrant in the recent filing period. Its technical focus centres on G06F digital data processing sub-classes (G06F 111, G06F 113, G06F 30), indicating a simulation and computational-design orientation rather than physical sensing. Fuzhou University shares the same IPC profile, making these two institutions the closest technical peers in the corpus.

patent records: 1
Challenger · China Helicopter Research and Development Institute

China Helicopter Research and Development Institute

China Helicopter Research and Development Institute holds 1 patent record and is also a new entrant in the recent period. Its IPC focus spans G06F 113, G06F 119, and G06F 30 — structural simulation and optimisation sub-classes — suggesting GFRP AI work motivated by aerospace composite certification or structural-health-monitoring requirements. The defence/aerospace origin distinguishes it from the university-driven majority of filers.

patent records: 1
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Shenzhen UniversityShanghai Jiaqi Intelligent Technology Co., Ltd.+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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