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GFRP Progressive-Damage Modeling Patent Snapshot 2026

GFRP Progressive-Damage Modeling Patent Snapshot 2026
Evidence Snapshot
GFRP Progressive-Damage Modeling Patent Snapshot in 2026

The GFRP progressive-damage modeling patent field is in a Growth stage, with filing activity accelerating sharply from a near-zero base and China accounting for the dominant share of documented output. The competitive structure is fragmented — no single applicant has pulled away from the pack — and digital simulation (G06F) is the overwhelmingly dominant technical route.

37
Patent families in scope
14%
Top visible applicants share
+500%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

A fragmented field led by a cluster of tied filers, concentrated in China

China, and Reva University each hold 2 patent records — a five-way tie at the top of the ranking with no single visible assignee having broken away.

The top five filers together account for 14% of the combined output of the ranked applicants visible in this query, confirming a low-concentration, widely distributed visible assignee structure with no meaningful tier gap between the leader and the mid-field.

Leading applicants
#ApplicantPatent recordsShare
1Nanjing Forestry University2
2Jilin Chongtong Chengfei New Material Co., Ltd.2
3SAIC Motor Corporation2
4Kalinga Institute of Industrial Technology2
5Ocean University of China2
6Reva University2
7Zhongyuan Urban Construction Co., Ltd.1
8Zhejiang University of Technology1
9Dr. Dipak Shriramji Bajaj1
10Mr. Rohit Sahu1
#ApplicantPatent recordsShare
11China Ship Scientific Research Center1
12China State Shipbuilding Corporation Limited1
13Dr. Rittin Abraham Kurien1
14Scott System Inc.1
15Xunfang Technology (Shanghai) Co., Ltd.1
16Mr. G. M. Pradeep1
17V. Ravi Raj1
18Dr. I. Ameeth Basha1
19Xinjiang Chengfei New Material Co., Ltd.1
20China Railway 14th Bureau Group Construction Engineering Co., Ltd.1
↗ Hover a row · click a company to ask Eureka

This fragmentation signals that the field has not yet consolidated around a visible methodology or a visible industrial player; entry barriers based on patent position alone are currently low, and the choice of modeling approach (FEM-based simulation vs. materials processing vs. structural application) still varies across filers.

Filing counts for 2025 and 2026 are understated due to patent publication lag and should not be read as a plateau; the underlying growth trend visible through 2024 is likely continuing. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Rapid multi-year growth and a simulation-heavy technology mix

Two structural facts define this field: annual filings have grown at a remarkable pace from a negligible base, and digital data processing is visible in the technology classification mix by a wide margin over materials and structural branches.

Annual filing trend

From a single filing in 2017, annual volume climbed to 10 records in 2024 — representing 500% growth over the recent window. The 2025 and 2026 data are understated by publication lag and should not be interpreted as a slowdown; the field remains in a growth trajectory consistent with its lifecycle classification.

Annual filing trendAnnual values from 2017 to 2026, peaking at 10 in 2024.120170201812019120202202152022920231020248202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

G06F (Electric digital data processing) is the visible IPC class with 31 patent records, reflecting that progressive-damage modeling is pursued primarily as a computational simulation problem. B29C (Shaping of plastics, 12 records) is the second-largest branch, covering manufacturing process integration. Structural branches E04C and E04B, layered-product branch B32B, and AI-methods branch G06N each appear at low single-digit counts, indicating emerging but sparse coverage of application-domain and data-driven approaches.

Technology compositionG06F · Electric digital data processing leads with 31; B29C · Shaping of plastics 12.G06F · Electric digital …31B29C · Shaping of plastics12E04C · Structural buildi…5E04B · Building structur…4B32B · Layered products …3G01N · Material analysis…3G06N · Computing based o…3G06T · Image data proces…3↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US6116181APublished 2000-09-12

Boat hull with wood grain finish

KALAMARAS; Michael P.

A wood grain printed film showing strakes, rails, screws, plugs and caulk is affixed to the outside of fiberglass hulls to provide the appearance of a wood hull boat. The film is adhered to the gel coat by cross-linking to provide a unitary, rigid, resilient structure with impact and abrasion resistance for protecting the gel coat and the watertight… (excerpt from the patent abstract)

Boat hull with wood grain finish — patent drawingBoat hull with wood grain finish — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1Method of making an object retention liner for con…101
2一种玻璃纤维增强塑料注塑工艺参数多目标优化方法39
3Boat hull with wood grain finish14
4GFRP吸力桶基础负压贯入过程的安全评价方法5
5一种粘接法兰模具与叶片蒙皮一体灌注成型的方法4
6一种耐腐蚀的海上风电FRP-钢复合塔筒结构多目标优化设计方法3
7一种基于BIM的大曲面装配式GRC单元式幕墙施工优化方法3
8一种复合材料仿真的方法及装置2

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Nanjing Forestry University

Nanjing Forestry University

Nanjing Forestry University holds 2 patent records and is classified as a new entrant in the momentum data. Its technology focus is concentrated in G06F (digital data processing and FEM simulation sub-classes G06F 111, G06F 113, G06F 30), indicating a research program centered on computational damage modeling rather than materials processing or end-use structural design.

patent records: 2
Challenger · Kalinga Institute of Industrial Technology

Kalinga Institute of Industrial Technology

Kalinga Institute of Industrial Technology (a deemed university) holds 2 patent records and is also a new entrant. Unlike the simulation-visible Chinese leaders, its technology emphasis spans E04C 3 (structural building components) and B29C 70 (shaping of plastics/composites), positioning it at the intersection of structural application and manufacturing process — a differentiated route from the visible G06F corridor.

patent records: 2
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
SAIC MotorOcean University of China+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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