This dataset contains 251 published records filed between 2017 and the 2026 data cut-off, drawn from a search combining glass core substrate, through-glass via and glass interposer terms with specific process challenges like via taper profile, crack propagation and metallization adhesion. The true count for the field overall will be somewhat larger since no single search string captures every relevant filing. Treat 251 as the scope of this particular landscape rather than a global total.

The ranking behind this page covers 43 assignees counted by patent family, with a clear leader-plus-long-tail structure: the top five combined hold 67.7% of all 251 records, and the top ten hold 82.5%. That means most of the foundational claim space is concentrated in a small number of portfolios, with a long tail of single- or few-filing entrants behind them. The full ranking, including exact company names and counts, is rendered in the table above.

Filing volume grew substantially through the middle of the dataset, rising from 18 filings in 2021 to 41 in 2024, a +128% increase over that span and the field’s peak year so far. The apparent drop in 2025 and 2026 is a publication-lag artefact, not a real slowdown — patents typically publish about 18 months after filing, so the most recent one to two years always look artificially low until later data catches up. 2024 is the last year that can reasonably be treated as complete.