Glass Core Substrate Patents: Who Leads, Where the Gaps Are 2026
- 67.7% of all activity sits with the top five assignees among 251 records in scope — this is a field with a small set of gatekeepers, not a fragmented one.
- +128% filing growth from 2021 to 2024, the last year with a complete publication picture, pointing to a technology moving from lab demonstration toward production tooling.
- H01L dominates at 57.8% of records, but C03C glass-composition claims (22.7%) and C03B glass-forming claims (4.4%) show the material side is comparatively lightly claimed.
Filing growth compares 2021 (18 records) with 2024 (41) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 251 records in scope (CR5), not by the ranked leaders only.
What the glass core substrate patent record shows
Glass core substrate technology sits at the intersection of semiconductor packaging and glass manufacturing: through-glass vias, interposer panels and the metallization and dimensional-stability work needed to make a brittle material behave like a reliable packaging core. The search underlying this page pulls 251 published records filed against terms spanning via taper profile, crack propagation, metallization adhesion, panel handling and laser-induced etching — the practical failure modes that separate a lab demonstration from a manufacturable panel.
Filing runs from 2017 through the current data cut-off, with growth concentrated in the years leading up to 2024, the most recent year with a complete publication picture given an approximate 18-month lag between filing and publication. Reading the newest one or two years as a slowdown would misread that lag rather than the technology.
Filing trends and technology composition
Two views of the same 251-record dataset: how filing volume has moved year over year, and how those records distribute across IPC subclasses. Because a single record can carry more than one classification, the subclass shares add up to well over 100% of the record total.
A three-year run-up into 2024
Filings moved from 11 in 2017 to a peak of 41 in 2024, including a +128% increase between 2021 (18) and 2024 (41). 2025 and 2026 figures are still filling in under normal publication lag and should not be read as a decline.
Semiconductor packaging dominates, glass processing is thinner
H01L (semiconductor devices) appears in 57.8% of records and H05K (printed circuits and assemblies) in 25.9%, confirming this is claimed primarily as a packaging technology. C03C (glass and enamel compositions) at 22.7% and C03B (glass manufacture and shaping) at just 4.4% mark the material-science side as comparatively open.
Shares are the percentage of the 251 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Glass Core Substrate Technology with Eureka
This page is one run against one query. Ask Eureka your own question about glass core substrate technology and every answer comes back with the patent numbers behind it.
Try EurekaThe most-cited records in this dataset
Dicing channels for glass interposers (US10090255B2)
The patent covers a semiconductor structure built around one or more redistribution layers connected to a glass interposer, with a channel cut through both the redistribution layers and the glass interposer core to form a dicing channel, which is then conformally filled with polymer material. It addresses a specific singulation problem: how to cleanly separate individual interposer dies from a glass panel without inducing the cracks that glass's brittleness makes likely along an unprotected cut line.Filed by GLOBALFOUNDRIES U.S. INC., published 2018-10-02.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20120106117A1 | Ultra-thin interposer assemblies with through vias | 229 |
| 2 | US20120048604A1 | Glass Interposer Panels And Methods For Making The Same | 165 |
| 3 | US20130119555A1 | Through-Package-Via (TPV) Structures On Inorganic Interposer And Methods For Fabricating Same | 108 |
| 4 | US20140048951A1 | Semiconductor assembly with dual connecting channels between interposer and coreless substrate | 96 |
| 5 | US8584354B2 | Method for making glass interposer panels | 88 |
| 6 | US20160111380A1 | New structure of microelectronic packages with edge protection by coating | 75 |
| 7 | US20170008122A1 | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same | 59 |
| 8 | US20140034374A1 | Glass interposer panels and methods for making the same | 57 |
| 9 | US20180068868A1 | Articles having holes with morphology attributes and methods for fabricating the same | 53 |
| 10 | US20150102852A1 | Stressed Substrates For Transient Electronic Systems | 47 |
Ranked by citation count within the searched corpus. Older records accumulate more citations by nature of being in circulation longer, so treat this as a signal of influence on subsequent filings rather than of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Three patterns worth acting on: where claim density already crowds the field, where the growth is coming from, and where citations point to the foundational filings everyone downstream has to work around.
A small group holds most of the claim space
With the leader alone at 80 records and the top five combined controlling 67.7% of all 251 records in scope, new entrants are filing into a field where the foundational interposer and via structures are already well covered by a handful of players.
Growth is recent and real, even if the last two years look thin
Filings rose from 18 in 2021 to 41 in 2024. 2025 and 2026 volumes will keep rising as publication catches up with the roughly 18-month lag typical of this dataset, so the apparent tail-off is an artefact of timing, not a cooling market.
Glass chemistry is claimed far less than the packaging around it
H01L and H05K packaging classes cover the bulk of filings, but C03C glass-composition claims sit at 22.7% and C03B glass-forming claims at only 4.4%. That gap suggests the material science underneath the packaging structures has more room for differentiated claims than the packaging layer itself.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to glass core substrate technology, with the prior art for and against each one.
Who is filing and where the activity has gone quiet
The ranking behind this page covers 43 companies, counted by patent family. It is not a top-50 or top-100 cut — it is the full set the data endpoint returns for this search.
One assignee holds close to a third of the field on its own
The top-ranked assignee accounts for 80 of the 251 records in scope, well ahead of the fifth-place holder at 13 and the tenth at 5 — a steep drop-off that marks this as a leader-plus-long-tail structure rather than an evenly spread field.
Several top filers show no output in the most recent year
Multiple of the highest-ranked assignees, including the leader, show zero filings in the latest year on record, and one shows a -100% year-on-year change. Given publication lag this likely reflects filings still working through the pipeline rather than an exit from the field.
Co-filing is limited and concentrated around one organisation
Only 10 co-assignee pairs appear in the dataset, and the strongest repeated pairings all involve the same lead organisation working with individual named inventors, suggesting most of the field files independently rather than through joint ventures.
| Assignee | Recent year | YoY |
|---|---|---|
| Corning Inc. | 0 | — |
| Intel Corp. | 0 | — |
| Electro Scientific Industries, Inc. | 0 | — |
| MOSAIC MICROSYSTEMS LLC | 0 | -100% |
| Georgia Tech Research Corporation | 0 | — |
| TOPPAN INC | 0 | — |
| Infineon Technologies Austria AG | 0 | -100% |
| Corning Optical Communications LLC | 0 | — |
Where to take this analysis
The dataset points to specific next steps depending on whether the goal is freedom-to-operate, white-space filing, or tracking a competitor's pipeline.
Map the leader's full claim scope
With one assignee holding 80 of 251 records, a freedom-to-operate review should start by mapping that portfolio's independent claims against the via-taper and metallization-adhesion terms in this search before drafting around them.
Explore assignee portfolios in EurekaTest claim language in the under-claimed material classes
C03C and C03B classes show materially lower claim density than the packaging classes above them, which is where a differentiated glass-composition or forming claim is more likely to clear prior art.
Run a white-space search in EurekaTrack the 2025–2026 filings as they publish
Because publication lags filing by around 18 months, the true 2025 and 2026 volumes are not yet visible. Set a recurring watch on this search string to catch new entrants and continuations as they surface.
Set up a monitoring alert in EurekaCommon questions about glass core substrate patents
This dataset contains 251 published records filed between 2017 and the 2026 data cut-off, drawn from a search combining glass core substrate, through-glass via and glass interposer terms with specific process challenges like via taper profile, crack propagation and metallization adhesion. The true count for the field overall will be somewhat larger since no single search string captures every relevant filing. Treat 251 as the scope of this particular landscape rather than a global total.
The ranking behind this page covers 43 assignees counted by patent family, with a clear leader-plus-long-tail structure: the top five combined hold 67.7% of all 251 records, and the top ten hold 82.5%. That means most of the foundational claim space is concentrated in a small number of portfolios, with a long tail of single- or few-filing entrants behind them. The full ranking, including exact company names and counts, is rendered in the table above.
Filing volume grew substantially through the middle of the dataset, rising from 18 filings in 2021 to 41 in 2024, a +128% increase over that span and the field's peak year so far. The apparent drop in 2025 and 2026 is a publication-lag artefact, not a real slowdown — patents typically publish about 18 months after filing, so the most recent one to two years always look artificially low until later data catches up. 2024 is the last year that can reasonably be treated as complete.
Semiconductor device claims under IPC class H01L appear in 57.8% of the 251 records, making packaging structure the dominant claim category, followed by printed circuit and assembly claims (H05K) at 25.9%. Glass composition claims (C03C) sit at 22.7% and glass manufacturing and shaping claims (C03B) at just 4.4%, indicating that the packaging architecture around the glass core is far more heavily claimed than the glass material and forming processes themselves. Because a record can carry multiple classifications, these shares add up to more than 100% of the record total and should not be read as mutually exclusive segments.
The clearest gaps sit in the material and process classes with comparatively low claim density relative to the packaging classes above them, notably glass composition tuning for via reliability, laser-induced etching process parameters, and panel-level dimensional stability control. These areas show real production relevance in the search terms used to build this dataset but far fewer records than the H01L and H05K packaging classes. A first claim in these branches would need to tie specific process parameters or material formulations to a measurable reliability outcome, such as via crack resistance under thermal cycling, rather than claiming the general structure that the leading assignees already cover.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.