Glass Core Substrate Patents: Top Companies & Filing Trends 2026
- +733% filing growth from 2021 to 2024, the field's most complete recent years, before publication lag understates 2025-2026.
- 57.7% of all 142 records in scope sit with just five assignees, with the leader alone holding 41 records.
- H01L and H10W classes cover the core, but printed-circuit integration (H05K) and optical routing (G02B) each still carry a meaningful share of filings.
Filing growth compares 2021 (3 records) with 2024 (25) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 142 records in scope (CR5), not by the ranked leaders only.
What glass core substrate patenting actually covers
Glass core substrates replace organic or ceramic cores in advanced packaging with a glass layer, chosen for its flatness, dimensional stability and tunable coefficient of thermal expansion. The claims in this dataset cluster around through-glass vias, warpage control and panel-level processing methods that make glass viable at production scale rather than only in lab demonstrations. Because glass behaves differently from organic laminate under thermal and mechanical stress, a large share of the filings are process and structure claims aimed at preventing crack propagation and maintaining surface flatness through assembly.
The search spans 2015 to the 2026 data cut-off, drawing on 142 published records held across 44 ranked assignees. Filing activity was low and sporadic through the late 2010s, then accelerated sharply from 2021 onward as chipmakers moved from feasibility work toward substrate designs meant to ship.
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Filing trend and technology composition
Two views of the same 142 records: how filing volume moved year over year, and which IPC subclasses the claims actually sit in.
From a trickle to a surge, then a lag-affected tail
Filings ran near single digits through the late 2010s, then rose from 3 in 2021 to a peak of 25 in 2024 – a +733% jump across that span. 2025 and 2026 show fewer published records, but that reflects the roughly 18-month gap between filing and publication, not a real slowdown.
Concentrated in semiconductor devices, spread across packaging formats
H01L accounts for 74.6% of the 142 records and H10W for 47.2%, confirming this is fundamentally a semiconductor-device packaging story. H05K (19.7%) and G02B (10.6%) show the same substrates being claimed for printed-circuit integration and optical routing, while C03C, H10B, H01Q and H10D each cover smaller, more specialised slices.
Shares are the percentage of the 142 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Glass Core Substrates for Advanced Packaging with Eureka
This page is one run against one query. Ask Eureka your own question about glass core substrates for advanced packaging and every answer comes back with the patent numbers behind it.
Try EurekaThe documents setting the citation baseline
Glass core substrate printed circuit board for warpage reduction
An electronic device comprises a first redistribution layer (RDL) including multiple sublayers of conductive traces formed in an organic material; a stiffening layer including one of a ceramic or glass, the stiffening layer including a first surface contacting a first surface of the first RDL and including a through layer via (TLV); and multiple integrated circuits (ICs) arranged on a second surface of the first RDL and including bonding pads, wherein the conductive traces of the first RDL provide electrical continuity between at least one bonding pad of the ICs and at least one TLV of the stiffening layer.Filed by Intel, published 2023-10-05. Structures the glass or ceramic layer as a stiffening element paired with a redistribution layer specifically to manage warpage.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20120048604A1 | Glass Interposer Panels And Methods For Making The Same | 164 |
| 2 | US20130175686A1 | Enhanced Flip Chip Package | 125 |
| 3 | US20130228918A1 | Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same | 97 |
| 4 | US8584354B2 | Method for making glass interposer panels | 88 |
| 5 | US20110147055A1 | Glass core substrate for integrated circuit devices and methods of making the same | 88 |
| 6 | US20140034374A1 | Glass interposer panels and methods for making the same | 57 |
| 7 | US9275934B2 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | 44 |
| 8 | WO2012027220A2 | Glass interposer panels and methods for making the same | 42 |
| 9 | US8207453B2 | Glass core substrate for integrated circuit devices and methods of making the same | 29 |
| 10 | US8716859B2 | Enhanced flip chip package | 23 |
Citation counts favour older filings simply because they have had more time to accumulate references inside this corpus – read them as markers of foundational influence, not as a ranking of current importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers mean for a filing decision
Three patterns worth acting on before drafting the next claim in this space.
The surge is real, but recent years understate it
Filings rose from 3 in 2021 to a peak of 25 in 2024. 2025 and 2026 show fewer published records purely because publication lags filing by about 18 months – treat 2024 as the last complete data point, not the field's high-water mark.
A small group holds the core claim space
The top five assignees combined account for 57.7% of all 142 records in scope, with the leader alone holding 41. The top ten extend that to 73.2%, leaving a long tail of single- or double-filing entrants competing for what remains.
Semiconductor-device claims dominate, but not exclusively
H01L and H10W between them anchor most filings, but nearly a fifth of records also carry H05K printed-circuit claims and over a tenth carry G02B optical claims – evidence that glass cores are being claimed for board-level and optical integration, not only chip packaging.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to glass core substrates for advanced packaging, with the prior art for and against each one.
A short leaderboard, then a long tail
44 assignees make up the entire ranked field, and volume drops fast after the leaders: from 41 records at the top to 6 by fifth place and 4 by tenth. That shape is typical of a technology still moving from a handful of pioneers toward broader industry adoption.
One assignee sets the pace by a wide margin
The leading assignee holds 41 of the 142 records in scope – more than the combined total of several mid-table competitors – reflecting years of sustained filing around warpage reduction and through-glass via structures.
Volume falls off quickly after the leaders
By fifth place, record counts have dropped to 6, and by tenth place to just 4. The gap between the leader and the rest of the ranked field is one of the sharpest signals in this dataset.
Co-invention clusters point to specific project teams
Only 10 co-assignee pairs appear across the dataset, and the strongest pairs share 6 filings each, all centred on the same small group of named inventors – a sign that key claims trace back to a handful of identifiable teams rather than diffuse authorship.
| Assignee | Recent year | YoY |
|---|---|---|
| Intel Corporation | 0 | — |
| Corning Incorporated | 0 | — |
| Toppan Holdings Inc. | 0 | — |
| Taiwan Semiconductor Manufacturing Co., Ltd. | 0 | -100% |
| TRAN QUAN A | 0 | — |
| SWAN JOHANNA M | 0 | — |
| SANKMAN ROBERT L | 0 | — |
| RAO VALLURI R | 0 | — |
Where to take this analysis
The dataset points to a field with a short list of established filers and several still-open technical branches.
Map claim boundaries before drafting
With 57.7% of records held by five assignees, a new filing in through-glass via or warpage-control claims needs a freedom-to-operate check against that concentrated set first.
Explore claim charts in EurekaTrack the 2024 peak as the real baseline
Because 2025-2026 filings are still publishing, any competitive monitoring should anchor to 2024 volumes rather than the apparently lower recent counts.
Set up filing alerts in EurekaTest the under-claimed branches
Optical routing and antenna-integration uses of glass interposers carry noticeably smaller IPC shares than the semiconductor-device core – worth a novelty search before assuming the space is crowded.
Run a white space search in EurekaCommon questions about glass core substrate patents
The ranked field covers 44 assignees, and it is led by one company holding 41 of the 142 records in scope, well ahead of the rest. The top five assignees combined account for 57.7% of all records, and the top ten reach 73.2%. Beyond that point, the field thins into a long tail of assignees with only one or two filings each, which is common in a packaging technology still consolidating around a few leaders.
It is growing. Filings rose from 3 in 2021 to a peak of 25 in 2024, a +733% increase over that span. The apparent drop in 2025 and 2026 is a publication-lag artefact, not a real slowdown – patent applications typically take around 18 months to publish, so the most recent one to two years in any filing trend will always look lower than they eventually turn out to be.
The claims concentrate on making glass viable as a packaging material at production scale: through-glass via formation, warpage control during assembly, panel-level processing methods, and prevention of crack propagation given glass's brittleness compared with organic laminate. IPC data shows 74.6% of the 142 records sit in H01L (semiconductor devices) and 47.2% in H10W, with smaller but meaningful shares in printed-circuit integration (H05K) and optical systems (G02B).
The smaller IPC categories point to it: glass composition tuning for coefficient-of-thermal-expansion matching (C03C, 5.6% of records), antenna integration (H01Q, 3.5%), and memory-device manufacture using glass cores (H10B, 4.2%) all carry far fewer filings than the semiconductor-device core claims. These branches are not necessarily easier to patent, but they carry less prior art density relative to the field's centre of gravity.
The most-cited record in this dataset is US20120048604A1, 'Glass Interposer Panels And Methods For Making The Same,' with 164 citations, followed by a cluster of early-2010s filings covering flip-chip packaging and three-dimensional integration with glass interposers. High citation counts here largely reflect age within the searched corpus – these are foundational early filings, not necessarily the most commercially active claims today.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.