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HEA Recycling & Remelting Patent Landscape 2026

HEA Recycling & Remelting Patent Landscape 2026
Competitive Landscape
HEA Recycling & Remelting Patent Landscape in 2026

The HEA recycling and remelting field is still expanding on a multi-year basis, with recent three-year filings well above the prior three-year window, though annual volume has eased from its 2023 peak. Activity is dominated by academic and research institutions concentrated in China, with no single commercial incumbent commanding a large share of output.

61
Patent families in scope
21%
Top-5 share of top-100 filers
+83%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatsnap Insights Team··7 min readVerified by Patsnap Eureka data
Overview

Academic institutions lead a nascent, China-anchored field

Harbin Institute of Technology and a Russian federal university each hold 4 patent records at the top of the ranking, followed closely by University of Science and Technology Beijing, Lanzhou University of Technology, and National Tsing Hua University at 3 records each — a cluster that reflects the field’s academic rather than industrial character.

The top five filers account for 21% of the combined output of the hundred largest filers, indicating a relatively diffuse competitive structure with no dominant bloc. The tier gap between the top filers and the broader field is narrow, meaning entry by new applicants does not face an entrenched leader with overwhelming portfolio depth.

Leading applicants
#ApplicantPatent recordsShare
1Harbin Institute of Technology4
2Federal State Autonomous Educational Institution (Russian University)4
3UNIV OF SCI & TECH BEIJING3
4Lanzhou University of Technology3
5National Tsing Hua University3
6Indian Institute of Technology2
7Indian Institute of Technology Kharagpur2
8Sandu Andrei Victor2
9Hebei University of Technology2
10Jiangsu University OF SCI & TECH IND TECH RES INST OF ZH…2
#ApplicantPatent recordsShare
11Chen Ruikai2
12Baltatu Madalina Simona2
13CEZ Research Centre2
14Charles University2
15Xinjiang University2
16Indian Institute of Technology Jodhpur2
17Harbin Engineering University2
18Codescu Mirela Maria2
19Zhejiang University of Technology1
20Shenzhen EPT Battery Co., Ltd.1
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The positions of leaders such as Harbin Institute of Technology and University of Science and Technology Beijing imply that fundamental alloy-composition and processing know-how is being established primarily in Chinese universities, creating a knowledge base that commercial actors will need to license or match as the technology matures.

Filing counts for 20242025 are understated due to standard patent publication lags of 18–24 months; the apparent slowdown in those years should not be read as a real decline in activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

A 2023 activity surge and alloy-composition dominance define the landscape

Two charts together show that filing activity accelerated sharply in 2023 and that alloy-composition classes absorb most of the technical output, with coating, powder metallurgy, and refining branches occupying secondary positions.

Annual filing trend

Filings were sparse before 2019, jumped to 10 records that year, moderated in 2020–2022, then surged to 19 records in 2023 — the field’s peak year to date. The 2024 and 2025 figures are understated by publication lag and do not represent a real decline.

Annual filing trendAnnual values from 2017 to 2026, peaking at 19 in 2023.2201712018102019220206202162022192023820246202512026↗ Hover for values · click a bar to ask Eureka

Technology composition

C22C (Alloys) is the dominant branch, reflecting that most work addresses alloy design and composition during recycling and remelting. C23C (Coating and surface deposition) and B22F (Powder metallurgy) form a secondary tier, while C22B (Metal extraction and refining) and B33Y (Additive manufacturing) appear at lower densities, signalling under-explored process routes.

Technology compositionC22C · Alloys leads with 65; C23C · Coating & surface deposition 19.C22C · Alloys65C23C · Coating & surface…19B22F · Powder metallurgy14C22F · Non-ferrous metal…12C22B · Metal extraction …10B33Y · Additive manufact…4C21D · Heat treatment of…3A61F · Implants & prosth…2↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20220307114A1Published 2022-09-29

High entropy alloy, method of preparation and use …

City University Of Hong Kong

A high entropy alloy includes at least five elements selected from Cobalt, Nickel, Titanium, Zirconium, and Hafnium, wherein two of the five elements have a total atomic percentage of 100−x, and the remainder elements have a total atomic percentage of x, where 0<x<100. A method of producing the high entropy alloy. A component for use in a mechanical… (excerpt from the patent abstract)

High entropy alloy, method of preparation and use … — patent drawingHigh entropy alloy, method of preparation and use … — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1一种高熵合金双联工艺制备方法42
2一种具有超弹性的TiZrHfNbAl高熵合金及其制备方法25
3一种原位合成低压冷喷涂CuNiCoFeCrAl<sub>2.8</sub>高熵合金涂层的制备方法24
4一种具有梯度组合结构的耐蚀耐磨涂层及其制备方法18
5一种高熵合金粉芯丝材电弧熔覆加工工艺16
6一种进一步提高高熵合金涂层耐磨性的方法14
7一种轻质高强耐蚀高熵合金及其制备方法14
8一种原位合成低压冷喷涂NiCoCrAlCu高熵合金涂层的制备方法13

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the competitive structure means for R&D investment

The field’s academic concentration, modest portfolio sizes, and multi-jurisdiction spread offer both opportunity and risk for industrial entrants. The four cards below synthesise the key strategic reads.

Growth

Growth stage, easing from a 2023 peak

The field is classified as Growth: recent three-year filings sit 83% above the prior three-year window, confirming multi-year expansion. However, annual volume peaked in 2023 at 19 records and has eased since, with 2024–2025 figures further understated by publication lag. For R&D planners, this signals a window to establish foundational IP before the field reaches maturity and freedom-to-operate tightens.

Growth · 83% recent uplift
Concentration

Diffuse, academic-led structure with no industrial bloc

The top five filers hold 21% of the hundred largest filers’ combined output, a relatively low share that indicates no single player controls the field. All leading applicants are universities or research institutes, not commercial manufacturers. This creates a licensing-friendly environment but also means that industrialisation know-how is not yet patent-protected at scale.

Low concentration
Collaboration

One confirmed cross-institutional pair: CEZ Research Centre and Charles University

The evidence shows a single co-filing pair: the research centre (CEZ Research Centre, Czech Republic) and Charles University, which have co-filed 2 patent records together. This is the only detected collaboration in the corpus, underscoring that the field remains largely siloed by institution. Partnerships bridging materials-science universities and process-engineering groups represent an open structural gap.

1 active co-filer pair
Geography

China overwhelmingly leads; Russia, India, and Taiwan are secondary nodes

China accounts for 46 of the patent records in scope, establishing it as the primary jurisdiction for both filing and likely commercialisation activity. India follows with 8 records, Russia with 4, and the Czech Republic, Romania, Taiwan, and the United States with 2 each. The near-absence of filings in major manufacturing jurisdictions such as Japan, South Korea, and Germany suggests limited corporate engagement from those industrial bases so far.

China-dominant
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Top collaboration links
ApplicantCollaboratorCo-filings
CEZ Research CentreCharles University2

Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: Patsnap Eureka. Insights are derived from applicant ranking, lifecycle, collaboration, and jurisdiction evidence in the corpus.Explore insights →
Leaders

Top players concentrate on alloy-composition IP with new-entrant momentum

All momentum-tracked leaders entered the field recently, consistent with the field’s early-growth character. Their technical focus is concentrated in C22C alloy classes, with some diversification into non-ferrous metal treatment and powder metallurgy.

Leader · Harbin Institute of Technology

Harbin Institute of Technology

Harbin Institute of Technology holds 4 patent records, the joint-highest count in the ranking. Its technical focus spans C22C 30 (multi-principal alloys), C22C 1 (alloy preparation), and C22F 1 (non-ferrous metal treatment), indicating breadth across composition and downstream processing. Momentum trend is flagged as a new entrant, consistent with recent activity concentrated in the near-term window.

4 patent records
Challenger · Federal State Autonomous Educational Institution (Russian university)

Federal State Autonomous Educational Institution

The Russian federal university co-leads with 4 patent records and focuses on C22C 30 (multi-principal alloys), C22C 1, and C21D 8 (heat treatment), suggesting an interest in thermo-mechanical processing during remelting cycles. Like its peers, it is classified as a new entrant, meaning its filings are concentrated in the most recent period examined.

4 patent records
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University of Science and Technology BeijingNational Tsing Hua University+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
Harbin Institute of Technology2▲ new entrant
Indian Institute of Technology Jodhpur4▲ new entrant
Federal State Autonomous Educational Institution (Russian University)4▲ new entrant
CEZ Research Centre2▲ new entrant
Hebei University of Technology2▲ new entrant
Charles University2▲ new entrant
Source: Patsnap Eureka. Player counts are patent records; momentum and technology emphasis are drawn from applicant-level evidence in the corpus.Explore players →
Adjacent Branches

Under-served routes in refining, heat treatment, and additive manufacturing

Several IPC branches adjacent to the dominant alloy-composition class carry low patent-record counts relative to their potential relevance to HEA recycling and remelting workflows. These are observations of relative sparsity and should be assessed against technical feasibility and freedom-to-operate before treating them as investment targets.

C22B · Metal extraction & refining

With 10 patent records and a 7% share of the corpus, C22B (metal extraction and refining) is under-represented given that scrap pre-treatment, impurity removal, and selective leaching are central to any industrial HEA recycling loop. The sparse coverage suggests that hydrometallurgical and pyrometallurgical routes specific to HEA scrap streams have not yet been systematically protected. An entrant with process-chemistry expertise in multi-element separation could establish differentiated IP here with a realistic path through existing refining literature and pilot-scale demonstration.

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B33Y · Additive manufacturing (3D printing)

Only 4 patent records fall under B33Y (additive manufacturing), a 3% share, despite growing industrial interest in using recycled HEA powder feedstocks for laser powder-bed fusion and directed-energy deposition. The intersection of remelted HEA powder characterisation, flowability control, and build-parameter optimisation is technically distinct from bulk alloy work and largely unaddressed in this corpus. Organisations already active in metal AM who are developing circular feedstock strategies would find minimal blocking IP in this branch at present.

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C21D · Heat treatment of metalsA61F · Implants & prostheses (biomedical HEA)+ more
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Source: Patsnap Eureka. Branch sparsity is assessed relative to the corpus at the patent-record level; commercial opportunity requires independent technical and market validation.Explore emerging →
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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