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HEA Standardization Patent Snapshot 2026

HEA Standardization Patent Snapshot 2026
Evidence Snapshot
HEA Standardization Patent Snapshot in 2026

The patent corpus for HEA standardization is extremely nascent, with only 3 patent families in scope spread across a small group of individual inventors and academic institutions. Activity is highly fragmented, with no single dominant route or corporate leader, and the field remains largely open to early-mover positioning.

3
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
China
Leading jurisdiction
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Published byPatSnap Insights Team··5 min readVerified by PatSnap Eureka data
Overview

A nascent field with no dominant applicant

The leading filer, Dr. Bommana Shravan Kumar, holds 1 patent record — the same count as every other applicant in the ranking. No single organization has established a meaningful lead in this space.

The top five filers collectively account for 83% of the combined total among the ranked applicants visible in this query, yet in absolute terms this reflects a very thin corpus. The apparent concentration is an artifact of the field’s early stage rather than a sign of entrenched incumbents.

Leading applicants
#ApplicantPatent recordsShare
1DR BOMMANA SHRAVAN KUMAR1
2MR G KEDARNATH1
3KUNMING UNIV OF SCI & TECH1
4DR VODNALA VEDA PRAKASH AP KCE ARMOOR1
5MRS NANDIGAMA UMADEVI AP ME KPRIT HYDERABAD1
6Institute of Metal Research, Chinese Academy of Sciences1
↗ Hover a row · click a company to ask Eureka

The absence of large corporate assignees and the presence of individual inventors and regional universities signals that HEA standardization, as a distinct patent category, has not yet attracted sustained institutional R&D investment. This leaves the assignee snapshot structurally open.

The most recent filings (20252026) are subject to normal publication lag and likely under-represent current activity; the true scope of recent filing may be higher than the corpus currently reflects. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly.Explore deeper in Eureka →
Trends & Structure

Sparse filing history with a broad but shallow technology mix

The annual filing trend reveals isolated activity rather than a sustained wave, and the technology composition spans six IPC classes with equal weight — indicating exploratory, multi-directional research rather than a converging technical consensus.

Annual filing trend

Filing was absent from 2017 through 2021, with a single record appearing in 2022, a gap in 2023–2024, and single records in both 2025 and 2026. The 2025–2026 data points are subject to publication lag and should not be read as a peak or trough. No sustained upward trend is established.

Annual filing trendAnnual values from 2017 to 2026, peaking at 1 in 2022.02017020180201902020020211202202023020241202512026↗ Hover for values · click a bar to ask Eureka

Technology composition

Six IPC branches each hold exactly one patent record: powder metallurgy (B22F), non-metallic elements and inorganic compounds (C01B), alloys (C22C), coating and surface deposition (C23C), nuclear reactors (G21C), and nuclear power plants (G21D). The even distribution confirms that no single technical route has yet attracted concentrated investment.

Technology compositionB22F · Powder metallurgy leads with 1; C01B · Non-metallic elements & inorganic compounds 1.B22F · Powder metallurgy1C01B · Non-metallic elem…1C22C · Alloys1C23C · Coating & surface…1G21C · Nuclear reactors1G21D · Nuclear power pla…1↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20260175294A1Published 2026-06-25

Laser cladding dual-phase high-entropy alloy coati…

Kunming University Of Science And Technology

A laser cladding dual-phase high-entropy alloy coating and a preparation method thereof are provided. The laser cladding dual-phase high-entropy alloy coating includes the following raw materials in atomic percentage: 9 to 16 percent (%) of aluminum (Al), 11 to 17% of chromium (Cr), 11 to 18% of iron (Fe), 13 to 20% of titanium (Ti), 10 to 15% of vanadium… (excerpt from the patent abstract)

Laser cladding dual-phase high-entropy alloy coati… — patent drawingLaser cladding dual-phase high-entropy alloy coati… — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1一种富Zr高熵合金及其制备方法4

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Dr. Bommana Shravan Kumar

Dr. Bommana Shravan Kumar

The top-ranked applicant by name in the corpus, with 1 patent record focused on non-metallic elements and inorganic compounds (C01B), nuclear reactors (G21C), and nuclear power plants (G21D). This technical orientation suggests HEA-related work directed at nuclear materials applications. No momentum data is available for this applicant beyond their single filing.

patent records: 1
Challenger · Institute of Metal Research, Chinese Academy of Sciences

Institute of Metal Research, Chinese Academy of Sciences

The most notable momentum signal in the corpus belongs to the Institute of Metal Research under the Chinese Academy of Sciences, flagged as a new entrant with 1 patent record in the recent period. Their technical focus is squarely on alloys (C22C 1 and C22C 30), which represents the most direct alignment with conventional HEA materials science. Their entry warrants monitoring as a potential indicator of broader institutional interest from China.

patent records: 1
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Kunming University of Science and TechnologyMrs. Nandigama Umadevi (AP ME KPRIT Hyderabad)+ more
Unlock full assignee analysis →
Source: PatSnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
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Frequently asked questions

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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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