HEA Techno-Economic Patent Snapshot 2026
The patent corpus for HEA techno-economic analysis is nascent, comprising only 6 patent families, with meaningful activity emerging only from 2023 onward. Yonsei University and the Council of Scientific and Industrial Research jointly dominate, each holding 2 patent families, reflecting an academic-led rather than industry-led field.
Academic institutions lead a highly concentrated, early-stage field
The top five filers account for all activity among the ranked applicants visible in this query, with Yonsei University and the Council of Scientific and Industrial Research each holding 2 patent families — together representing the clear leading tier.
The concentration is absolute: four applicants account for the entire corpus of 6 patent families, and the gap between the top two and the remaining two single-family filers is narrow in absolute terms but reflective of an immature, low-volume space.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Yonsei University (Industry-Academic Cooperation Foundation) | 2 | |
| 2 | COUNCIL OF SCI & IND RES | 2 | |
| 3 | Suntar Membrane Technology (Xiamen) Co., Ltd. | 1 | |
| 4 | HEBEI WUWEI AERO & POWER TECH | 1 |
The dominance of a South Korean university foundation and an Indian government research body signals that techno-economic work on high-entropy alloys remains largely in the academic and public-sector domain, with limited commercial player engagement to date.
Filings from 2024 and 2025 are subject to standard publication lag and may not yet fully reflect activity in those years; the 6-family corpus should be treated as a lower-bound snapshot. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Activity is brand-new and technically heterogeneous
All recorded filings fall within 2023–2025, pointing to a field that did not exist in patent databases before 2023. The technology mix spans alloy composition, polymer additives, separation processes, and solid-state devices — suggesting the ‘techno-economic’ framing captures methodological overlap across several material classes rather than a single coherent technology route.
Annual filing trend
Zero filings appear from 2017 through 2022; 2023 marks the first activity with 2 families, followed by 1 in 2024 and 3 in 2025. The 2025 figure is the highest single-year count but should be read cautiously given publication lag, and the 2026 figure of zero reflects incomplete publication rather than a halt.
↗ Hover for values · click a bar to ask EurekaTechnology composition
C22C (Alloys) is the largest branch with 3 records, followed by C08F (addition polymers), C08K (polymer additives), and H10N (solid-state devices) at 2 records each, and B01D (separation) and C21D (heat treatment of metals) at 1 each. The spread across unrelated IPC classes reflects applicant-level specialization rather than a unified research program.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Ion thermoelectric elastomer and thermoelectric el…
The present disclosure relates to an ion thermoelectric elastomer, which exhibit excellent thermal and air stability as well as excellent mechanical properties even under tensile stretching by adjusting poly(ethylene glycol) diacrylate (PEGDA), 2-hydroxyethyl acrylate (2-HEA), and an ion conductive dopant to a certain content range, and exhibit excellent… (excerpt from the patent abstract)
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Yonsei University
Yonsei University holds 2 patent families, both classified as new entrant filings. Their technical focus sits in C08F (addition polymers) and C08K (use of additives in polymers), a polymer-chemistry emphasis that appears distinct from alloy-centric interpretations of HEA techno-economic work.
patent families: 2Council of Scientific and Industrial Research
CSIR also holds 2 patent families and is classified as a new entrant. Their focus is concentrated in C22C (Alloys), specifically alloy composition subclasses, aligning more directly with high-entropy alloy material development. Filed in India, their work anchors the corpus’s only Indian jurisdiction record.
patent families: 2Frequently asked questions
The current corpus contains 6 patent families, with all activity recorded from 2023 onward. This is a very small and nascent dataset.
Yonsei University (via its industry foundation) and the Council of Scientific and Industrial Research each hold 2 patent families, making them co-leaders. Suntar Membrane Technology and Hebei Wuwei Aero & Power Technology each hold 1 family.
The United States leads with 3 patent records, followed by China with 2 and India with 1. No other jurisdictions appear in the current corpus.
C22C (Alloys) is the most represented class with 3 records. C08F (addition polymers), C08K (polymer additives), and H10N (solid-state devices) each appear with 2 records. B01D (separation) and C21D (heat treatment of metals) each have 1 record.
No co-applicant or co-assignment activity is recorded in this corpus. All four applicants have filed independently.
Zero filings were recorded from 2017 through 2022. Activity began in 2023 with 2 families, followed by 1 in 2024 and 3 in 2025. The field is in its earliest detectable patent phase, and figures for 2024–2025 may still be incomplete due to publication lag.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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