Book a demo

Heat Pump Patents: Who Leads, Where Filings Are Flattening 2026

Heat Pump Patents: Who Leads, Where Filings Are Flattening 2026
https://www.patsnap.com/resources/blog/rd-blog/heat-pump-systems-and-technology-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · HVAC Systems
Heat Pump Patents: Filing Trends, Leading Assignees and Open Claim Space
  • Filing has plateaued, not grown. annual filings peaked at 124 in 2023 after sitting near 111 in 2022, with 2017 already at 118 — a decade of roughly flat output rather than a growth curve.
  • The core claim territory is narrow. F25B refrigeration and heat-pump claims account for 2,839 of 3,135 records, meaning most of the field's activity sits in one IPC subclass rather than spread across the eight tracked here.
  • Momentum has stalled at the top. Several of the most consistently active filers, including Carrier, Mitsubishi Electric and Daikin, show zero filings in the latest tracked year — a lag effect as much as a retreat.
Get a prior-art report on your approach
3,135
Published Records
18%
Top-5 Share of All Records
-4%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (116 records) with 2024 (111) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 3,135 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks patent families addressing heat pump systems and technology, filtered to records that combine heat pump terminology with technical claim language on coefficient of performance, defrost control, low ambient operation, variable speed compressors and refrigerant charge, and classified under F25B30, F24H4 and F25B13. The corpus spans 3,135 patent families published between 2015 and mid-2026, giving a decade-scale view of where claim activity has concentrated and where it has thinned out.

Because publication typically lags filing by around eighteen months, the most recent year in any trend line understates real activity — 2026's low count reflects a partial year and pending publications, not a sudden drop in filing.

Annual filing trend, 2017–2026
  1. 1CARRIER CORP208
  2. 2MITSUBISHI ELECTRIC CORP147
  3. 3PANASONIC HOLDINGS CORP105
  4. 4DAIKIN INDUSTRIES LTD57
  5. 5THE CHEMOURS CO FC LLC48
  6. 6RHEEM MFG CO41
  7. 7DENSO CORP40
  8. 8Jin Kum Soo38
  9. 9TRANE INTERNATIONAL INC34
  10. 10WONG LEE WA34
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Heat Pump Systems and Technology covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The numbers

Filing trend and technology composition

Two views matter here: how filing volume has moved year over year, and how that volume splits across the IPC subclasses that touch heat pump technology.

A decade of flat-to-declining output

Filings ran at 118 in 2017, climbed to a peak of 124 in 2023, and sat at 111 at the 2022 midpoint — a pattern of plateau rather than sustained growth. Combined with the falling 2024–2026 counts (expected given publication lag), the underlying signal is a mature filing base rather than an expanding one.

A decade of flat-to-declining output03875113150118201720182019202020212022124202320242025102026Most recent year is partial — publication lag means later filings are not yet visible.

Concentration in refrigeration and heat-pump claims

F25B (refrigeration and heat pumps) carries 2,839 of the 3,135 records — well ahead of F24H fluid heaters (685), F24D domestic heating (522) and F24F air conditioning (460). Smaller counts in F28D heat exchangers (158), C09K materials (129) and B60H vehicle heating (77) mark adjacent areas with comparatively light claim density.

Concentration in refrigeration and heat-pump claimsF25B · Refrigeration & heat pumps2,83990.6%F24H · Fluid heaters & water heaters68521.9%F24D · Domestic heating systems52216.7%F24F · Air conditioning & ventilation46014.7%F25D · Refrigerators & cooling2237.1%F28D · Heat-exchange apparatus1585.0%C09K · Materials for misc. applicatio…1294.1%B60H · Vehicle heating & A/C772.5%Other97431.1%

Shares are the percentage of the 3,135 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Heat Pump Systems and Technology covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on Heat Pump Systems and Technology with Eureka

This page is one run against one query. Ask Eureka your own question about heat pump systems and technology and every answer comes back with the patent numbers behind it.

Try Eureka
Key Patents

Most-cited prior art in this corpus

Representative filing
US8756943B22014-06-24

Refrigerant charge management in a heat pump water heater — NORDYNE, LLC

NORDYNE, LLC

Heat pumps that heat or cool a space and that also heat water, refrigerant management systems for such heat pumps, methods of managing refrigerant charge, and methods for heating and cooling a space and heating water. Various embodiments deliver refrigerant gas to a heat exchanger that is not needed for transferring heat, drive liquid refrigerant out of that heat exchanger, isolate that heat exchanger against additional refrigerant flowing into it, and operate the heat pump while the heat exchanger is isolated.Filed as US8756943B2, granted 2014-06-24.

US8756943B2 — patent drawing 1US8756943B2 — patent drawing 2
View full record
Highest-citation records
#Publication no.Patent titleCitations
1US20100122545A1Tetrafluoropropene compositions and uses thereof253
2US6138466ASystem for cooling electric vehicle batteries240
3US4420947AHeat pump air conditioning system186
4US5758514AGeothermal heat pump system178
5US5056329AHeat pump systems177
6US7313926B2High efficiency absorption heat pump and methods of use158
7US4720981ACooling of air conditioning control electronics145
8US5927088ABoosted air source heat pump142
9US5224357AModular tube bundle heat exchanger and geothermal heat pump system137
10US4882908ADemand defrost control method and apparatus135

Citation counts are drawn from a searched corpus and skew toward older, more-cited records; treat them as a measure of influence rather than current relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Heat Pump Systems and Technology covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Run it yourself

Put your own technology through the same analysis

 
Where to run it
Fastest

Eureka on the web

When you want the answer in the next five minutes.

The agent works the prompt against patents and technical literature, citing every source.

Run your analysis now →
For builders

MCP server & REST API

When it has to run inside your own pipeline.

Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.

Browse MCP servers →
Insights

What the data says about the field

Three patterns stand out once filing volume, IPC composition and citation activity are read together.

Filing momentum
124 in 2023
peak filing year

Growth has plateaued

Filing volume sat at 118 in 2017 and peaked at only 124 in 2023, with 111 at the 2022 midpoint. That is a flat trend line across nearly a decade, not the acceleration typical of an emerging technology.

Trend data, 2017–2026
Claim concentration
2,839 of 3,135
records in F25B

One subclass dominates

F25B refrigeration and heat-pump claims account for the large majority of records. Adjacent subclasses such as B60H vehicle heating (77) and C09K materials (129) carry far lighter claim density, suggesting where prior art is thinner.

IPC composition
Geographic filing
922 US filings
leading receiving office

US and Europe lead intake

The United States (922) and the EPO (498) receive the largest share of filings, with Japan (399), WIPO/PCT (272), China (223) and Canada (176) following. Filing strategy in this field still runs primarily through US and European offices.

Receiving office counts
Citation signal
253 citations
top-cited record

Older filings still anchor the art

The most-cited record in this corpus dates to refrigerant chemistry rather than system architecture, a reminder that citation leaders in a searched corpus tend to be older filings rather than the newest technical approaches.

Most-cited records
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to heat pump systems and technology, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Heat Pump Systems and Technology covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where activity has stalled

Filing activity concentrates among a small group of established HVAC and refrigerant manufacturers, several of which show no filings in the most recent tracked year — consistent with publication lag rather than an actual pullback.

Assignee activity
0 in latest year
for several top filers

Momentum has cooled across leaders

Carrier, Mitsubishi Electric, Panasonic and Daikin each show zero filings in the latest tracked year, with Carrier and Rheem-affiliated filers registering a -100% year-on-year change. Given the roughly eighteen-month publication lag, this reads as pending disclosures rather than abandonment.

Recent-year momentum
Co-filing patterns
10 co-assignee pairs
identified in corpus

Co-assignment is limited but tight where it exists

Only ten co-assignee pairs appear across the corpus. The strongest pairing, an individual inventor-assignee combination, appears 36 times, well ahead of corporate pairings such as Daikin's domestic and European entities at 10 co-filings.

Co-assignee pairs
Individual filers
36 co-filings
strongest pair in dataset

Named-inventor assignees are active

The strongest co-assignee relationship in the dataset pairs an individual inventor with a matching entity, a pattern distinct from the corporate co-filing seen among larger manufacturers such as Denso and its research affiliate.

Co-assignee pairs
🔍
Under-claimed branches worth scouting
Sub-areas where filing density is comparatively light relative to the core refrigeration claim base.
Vehicle-integrated heat pump thermal loopsLow-ambient defrost control algorithmsVariable-speed compressor materials pairingHeat exchanger geometry for CO2 refrigerantsRefrigerant-material co-claims (C09K crossover)
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Carrier Corporation0-100%
Mitsubishi Electric Corporation0
Panasonic Corporation0
Daikin Industries, Ltd.0
Rheem Manufacturing Company0-100%
JIN KUM SOO0
Denso Corporation0-100%
Jin Kum Soo0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Heat Pump Systems and Technology covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The filing trend and IPC composition point to specific next steps depending on whether the goal is freedom-to-operate, portfolio strategy or new filing.

Check freedom-to-operate against the top-cited records

The highest-citation records in this corpus, several dating to the 1980s and 1990s, remain foundational prior art for system architecture and refrigerant chemistry claims. Any new filing in core heat pump cycles should be checked against these first.

Run a freedom-to-operate check in Eureka →

Watch for renewed filing from stalled leaders

Several top assignees show zero filings in the latest year, which publication lag makes ambiguous — it could mean paused R&D or simply pending disclosures. Tracking these assignees over the next two publication cycles will clarify which.

Set up assignee tracking in Eureka →

Explore the lighter-claimed adjacent subclasses

B60H vehicle heating and C09K materials carry far fewer records than the core F25B subclass, which may reflect genuine white space or simply narrower search terms. Either way, a targeted claim search in these subclasses is worth the time before filing.

Explore white space in Eureka →
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Heat Pump Systems and Technology covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about heat pump patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Heat Pump Systems and Technology covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Research Heat Pump Systems and Technology in depth with Eureka

Go past this page: query the whole heat pump systems and technology corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.

Try Eureka

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

Help us improve this page

Found incorrect or outdated information? Let us know and we'll get it fixed.