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Hexagonal Boron Nitride Patents: Leaders, Trends & White Space 2026

Hexagonal Boron Nitride Patents: Leaders, Trends & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/hexagonal-boron-nitride-technology-landscape-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Advanced Materials & Metallurgy · Patent Landscape
Hexagonal boron nitride patents: who holds the claim space and where it is still open
  • Filing has cooled since 2021. The peak year was 2021 at 11 filings; by the 2022 midpoint volume had dropped to 4, and the trend has stayed flat-to-declining since.
  • Japan outfiles the US and China combined. 73 Japanese receiving-office filings against 53 in the US and 35 in China put the deepest claim density in Japanese-origin portfolios.
  • No single assignee is filing in the latest year. Every major historical assignee in the momentum data shows zero filings in the most recent year, consistent with a field that has moved from build-out to consolidation.
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237
Published Records
31%
Top-5 Share of All Records
-27%
3-Yr Growth (lag-adjusted)
JP
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the hexagonal boron nitride patent record shows

Hexagonal boron nitride (h-BN) sits at the intersection of ceramics chemistry and semiconductor process engineering: it is claimed both as a bulk refractory material and as a 2D dielectric layer grown or exfoliated for electronics. The 237 families in this dataset span from bulk synthesis and hard-boron-nitride process patents through to nanosheet exfoliation and thin-film deposition for substrates. The IPC spread — concentrated in C01B (non-metallic elements and inorganic compounds) and C23C (coating and surface deposition), with a smaller but active C30B crystal-growth cluster — tracks that split between commodity-material claims and electronics-grade film claims.

Filing activity is not accelerating. Volume rose from single digits in 2017 to a peak of 11 families in 2021, then fell back toward the 2022 midpoint of 4 and has stayed subdued since. Because publication typically lags filing by around 18 months, the final one or two years in any trend understate true activity, but the shape of the decline from 2021 predates that lag window and looks like a genuine slowdown in new filing rather than a reporting artefact.

Filing trend and IPC composition, 2017–2026
  1. 1NAT INST FOR MATERIALS SCI24
  2. 2MITSUBISHI HEAVY IND LTD17
  3. 3SUMITOMO ELECTRIC INDUSTRIES LTD14
  4. 4NORTH CAROLINA STATE UNIV10
  5. 5NAT RES COUNCIL OF CANADA9
  6. 6NORTHERN ILLINOIS UNIVERSITY7
  7. 7GENERAL MOTORS LLC6
  8. 8SHIN ETSU CHEMICAL CO LTD6
  9. 9M WATANABE CO LTD6
  10. 10NIHON SHINKU GIJUTSU KK5
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Hexagonal Boron Nitride Technology Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The data

Filing trend and technology composition

Two views of the same 237-family dataset: filings by year, and where those filings sit across the IPC subclasses that define bulk material, coating, semiconductor and nanotechnology claims.

Filings by year, 2017-2026

Filings climbed from 8 in 2017 to a peak of 11 in 2021, then declined toward 4 at the 2022 midpoint and have not recovered; 2026 is a partial year.

Filings by year, 2017-202603691282017201820192020112021202220232024202522026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass composition

C01B (193 records) and C23C (115) dominate, confirming that most claims are anchored in inorganic-compound chemistry and coating/deposition process rather than device-level integration; H01L (56) and B82Y (25) mark the smaller semiconductor and nanotech-specific slice.

IPC subclass compositionC01B · Non-metallic elements & inorga…19381.4%C23C · Coating & surface deposition11548.5%C04B · Ceramics, cement & refractories6427.0%H01L · Semiconductor devices5623.6%C30B · Crystal growth5121.5%H10P3012.7%B82Y · Nanotechnology applications2510.5%B01J · Chemical/physical processes & …229.3%Other14762.0%

Shares are the percentage of the 237 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Hexagonal Boron Nitride Technology Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key patents

The most-cited prior art in this corpus

Representative filing
US20210363010A12021-11-25

Method for preparing multi-layer hexagonal boron nitride film

SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY

The disclosure covers preparing a multi-layer hexagonal boron nitride film by placing a boron-containing solid catalyst on a substrate, annealing it to a melt, then feeding nitrogen-containing and protecting gases so the nitrogen reacts with the melted catalyst to form the h-BN film directly on the substrate surface.Filed by Shanghai Institute of Microsystem and Information Technology, published 2021-11-25 as US20210363010A1.

US20210363010A1 — patent drawing 1US20210363010A1 — patent drawing 2
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Highest-citation records
#Publication no.Patent titleCitations
1US6958175B2Film forming method and film forming device243
2US5316804AProcess for the synthesis of hard boron nitride97
3US20110045223A1Method for Exfoliation of Hexagonal Boron Nitride72
4WO2014169382A1Boron nitride nanotubes and process for production thereof39
5US6194067B1Carbonaceous particles and carbonaceous fibers both coated with boron nitride, and lithium secondary cells pr…39
6US20020000556A1Hexagonal boron nitride film with low dielectric constant, layer dielectric film and method of production the…29
7US20190276310A1Method for preparing hexagonal boron nitride by templating28
8CN103232027A一种三维氮化硼泡沫及其制备方法27
9US6383465B1Cubic boron nitride and its gas phase synthesis method27
10JP2008266101ABoron nitride nanotube and method for manufacturing the same26

Citation counts inside a searched corpus skew toward older filings simply because they have had more time to accumulate citations — read this as a map of influential prior art, not of current commercial importance.

Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Hexagonal Boron Nitride Technology Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three signals stand out once the raw counts are put next to each other: where claim density sits, where offices concentrate activity, and how recent momentum has shifted away from the historical leaders.

Claim density
193 of 237 records
cite C01B

Bulk-chemistry claims dominate the corpus

Non-metallic-element and inorganic-compound claims (C01B) appear in the large majority of records, with C23C coating claims a close second at 115. A new filing that only restates bulk synthesis or generic coating steps is filing into the densest part of the map.

Source: IPC subclass distribution
Geographic concentration
73 filings
Japan receiving office

Japan carries the deepest portfolio depth

Japan's 73 receiving-office filings outweigh the US (53) and China (35) individually, suggesting the most mature prosecution history — and the most crowded prior art — sits in Japanese-origin filings rather than in the US or Chinese corpora.

Source: Receiving office counts
Momentum
0 in latest year
across major historical assignees

The historical leaders have gone quiet

Every assignee tracked in the recent-momentum data — spanning Japanese, US and Canadian research and industrial filers — shows zero filings in the most recent year. That does not mean the field is dead; it means active filing has either shifted to newer entrants or is sitting in the 18-month publication lag.

Source: Recent-year momentum by assignee
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to hexagonal boron nitride technology landscape, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Hexagonal Boron Nitride Technology Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the portfolios, and where the gate sits

The assignee ranking is dominated by a mix of Japanese industrial and materials-science filers alongside a scatter of universities and single-filing entrants — a pattern consistent with a technology that had a defined build-out phase rather than one still in active land-grab.

Co-filing signal
10 pairs
co-assignee pairs

Co-assignee filing is a minority pattern

Only 10 co-assignee pairs appear across 237 families, and the strongest pairs are inventor-institution combinations rather than joint-venture structures — most of this corpus is filed by a single assignee of record.

Source: Co-assignee pair counts
Citation anchor
243 citations
US6958175B2

One film-forming patent anchors the citation graph

US6958175B2, a film-forming method and device patent, is cited far more than any other record in the set (243 times), well ahead of the next-most-cited synthesis patent at 97. Anything claiming film-forming process steps should be checked against it first.

Source: Most-cited records
Office spread
6 receiving offices
with meaningful volume

Filing is genuinely multi-jurisdictional

Beyond Japan, the US and China, meaningful volume also runs through the EPO (26), South Korea (17) and WIPO/PCT (13) routes, so a freedom-to-operate check confined to one or two offices will miss real prior art.

Source: Receiving office counts
🔍
Under-claimed sub-areas worth a closer look
Branches with comparatively thin representation relative to the bulk-chemistry and coating clusters that dominate the corpus.
BN nanotube fabrication scale-up2D h-BN dielectric integration with device stacksThermal-interface filler particle engineeringCatalyst-mediated multi-layer film growthNanosheet exfoliation yield control
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Recent-year filing momentum by assignee
AssigneeRecent yearYoY
National Institute for Materials Science (NIMS)0
Mitsubishi Heavy Industries, Ltd.0
Sumitomo Electric Industries, Ltd.0
North Carolina State University0
National Research Council Canada0
General Motors LLC0
Shin-Etsu Chemical Co., Ltd.0
SUGINO TAKASHI0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Hexagonal Boron Nitride Technology Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this analysis

The dataset points to specific next steps depending on whether the question is freedom-to-operate, whitespace scouting, or monitoring a specific assignee's activity.

Run a freedom-to-operate check against the citation anchors

Start with the highest-cited records, particularly the film-forming and hard-boron-nitride synthesis patents, before drafting new process claims.

Explore prior art in Eureka

Scope the under-claimed branches before filing

The gate chips above mark areas with thinner claim density than the bulk-chemistry cluster — worth a deeper novelty search before committing claim language.

Run a whitespace search in Eureka

Track assignees whose filing has gone quiet

Zero recent-year filings from the historical leaders could mean a pause, a shift to trade secret, or filings still in the publication pipeline — worth monitoring rather than assuming exit.

Set up assignee monitoring in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Hexagonal Boron Nitride Technology Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about hexagonal boron nitride patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Hexagonal Boron Nitride Technology Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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