High-Bandwidth Memory (HBM) Patent Landscape 2026
High-Bandwidth Memory (HBM) Patent Landscape in 2026
The HBM patent field is in a growth phase, with Samsung Electronics and TSMC commanding a dominant share of the largest filers and filing activity up substantially on a multi-year basis. The corpus is highly concentrated at the top, yet a widening set of fabless designers, packaging specialists, and memory vendors are staking out positions across device, assembly, and interface sub-domains.
Samsung and TSMC lead a highly concentrated field
Samsung Electronics ranks first with 2,214 patent families, followed closely by TSMC at 1,752 and Intel at 1,001. Together, the top five filers account for 67% of the combined output of the hundred largest filers — a concentration level that signals deep, durable incumbency at the leading tier.
A sharp tier gap separates the top three from the rest: Micron (553 families) and AMD (212 families) form a second tier, while SK Hynix (173), Semicon Energy Lab (133), MediaTek (116), iCometrue (111), and Advanced Semiconductor Engineering (110) cluster in a third tier well below the leaders.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Samsung Electronics Co., Ltd. | 2,214 | |
| 2 | Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) | 1,752 | |
| 3 | Intel Corporation | 1,001 | |
| 4 | Micron Technology, Inc. | 553 | |
| 5 | Advanced Micro Devices, Inc. (AMD) | 212 | |
| 6 | SK Hynix Inc. | 173 | |
| 7 | Semiconductor Energy Laboratory Co., Ltd. | 133 | |
| 8 | MediaTek Inc. | 116 | |
| 9 | iCometrue Co., Ltd. | 111 | |
| 10 | Advanced Semiconductor Engineering, Inc. (ASE) | 110 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | Xilinx, Inc. | 102 | |
| 12 | Altera Corporation | 91 | |
| 13 | Rambus Inc. | 90 | |
| 14 | Adeia Semiconductor Bonding Technologies Inc. | 87 | |
| 15 | Qualcomm Incorporated | 86 | |
| 16 | IBM Corporation | 83 | |
| 17 | Kepler Computing Inc. | 81 | |
| 18 | Changxin Memory Technologies, Inc. | 75 | |
| 19 | Siliconware Precision Industries Co., Ltd. (SPIL) | 58 | |
| 20 | Tahoe Research Ltd. | 57 |
Samsung’s and TSMC’s scale implies broad freedom-to-operate concerns for new entrants in packaging and interconnect; Intel’s position spans both device and interface layers, making it a multi-front competitor. The dominance of foundry and memory incumbents reflects the capital-intensive nature of 3D stacking and hybrid bonding central to HBM architecture.
Filing counts for the most recent 18–24 months are understated due to standard patent-publication lag; the apparent moderation in 2023–2025 data should not be interpreted as a slowdown. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Sustained multi-year growth with semiconductor device IP at the core
The filing trend and technology composition together reveal a field expanding rapidly across device, memory, and packaging layers, with the dominant IPC class anchoring well over half the activity.
Annual filing trend
Annual filings grew from 360 in 2017 to a recorded high of 1,375 in 2022, then registered 1,178 in 2023 and 1,351 in 2024 before dropping to 895 in 2025 and a nominal 14 in 2026 — both recent years are substantially under-counted due to publication lag and should not be read as a trend reversal. The 43% multi-year recent growth figure confirms the field is still expanding.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01L (Semiconductor devices) dominates with 6,883 records, reflecting the centrality of 3D stacking, die bonding, and interposer design. G11C (Static & digital memories) at 2,783 and H10B (Memory device manufacture) at 1,349 represent the memory-cell and process layers. G06F (Electric digital data processing) at 1,238 captures host-interface and controller IP, while all remaining branches each contribute under 3% of total records.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Multi-rank high bandwidth memory (HBM) memory
Certain aspects of the present disclosure provide techniques for relate to electronic devices that are configured to implement multi-rank high bandwidth memory (HBM) memory. In one aspect, an electronic device includes a chip that includes an interface circuit. The interface circuit is connected to first exterior pads. The first exterior pads have a first… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | In-memory lightweight coherency | 461 |
| 2 | Methods for bonding wafers using a metal interlayer | 445 |
| 3 | Package Structures and Methods of Making the Same | 356 |
| 4 | High performance, high bandwidth memory bus archit… | 326 |
| 5 | Conductive barrier direct hybrid bonding | 293 |
| 6 | Conductive barrier direct hybrid bonding | 277 |
| 7 | Three dimensional integrated circuit integration u… | 272 |
| 8 | Semiconductor interposer integration | 238 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the competitive structure means for R&D investment
Four structural dimensions — maturity, concentration, collaboration patterns, and geography — define the strategic landscape for any organization considering HBM-related R&D.
Active growth phase with rising annual volume
The field is classified as Growth, with annual filings still rising on a multi-year basis and a 43% recent-window growth rate. Publication lag understates the two most recent years, so the underlying trajectory is likely steeper than raw counts suggest. Early architectural patents (e.g., memory bus architecture, 3D integration) are already heavily cited, indicating that core IP layers are maturing even as peripheral and application-layer filings accelerate.
Lifecycle: GrowthTop five filers hold two-thirds of the largest-filer pool
The top five applicants — Samsung, TSMC, Intel, Micron, and AMD — together represent 67% of the combined output of the hundred largest filers. This degree of concentration means entrants face a dense prior-art landscape in core packaging and device classes. The practical implication is that differentiation must come from application-layer IP (host interfaces, AI accelerator integration, thermal management) or niche process innovations where incumbents are less active.
Highly concentratedTSMC–iCometrue and AMD–ATI are the most active co-filing pairs
The most frequent co-applicant relationship is between TSMC and iCometrue (7 joint filings), reflecting a foundry–design-house partnership in advanced packaging. AMD and ATI Technologies co-filed on 5 families, consistent with their corporate relationship. Samsung and Hanyang University co-filed on 2 families, and Samsung also appeared with Dongwoo Fine-Chem on 1 family and Graz University of Technology on 1 family, indicating selective academic and materials-supplier collaboration. Overall, co-filing activity is sparse relative to the corpus size, suggesting most IP is developed in-house.
Sparse co-filingUS filings dominate; Asia-Pacific and Europe trail significantly
The United States accounts for 6,669 patent records — by far the largest single jurisdiction — consistent with the US being the primary filing destination for semiconductor IP. Europe (EPO) at 525, WIPO (PCT) at 421, China at 400, and Taiwan at 274 form a secondary tier. South Korea, the home jurisdiction of Samsung and SK Hynix, shows only 39 records in this corpus, suggesting that Korean-origin filers prioritize US protection. China’s 400 records signal growing domestic activity, partly reflected in the presence of Changxin Memory and Yangtze Memory in the applicant list.
US-centric filingGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) | Global Unichip Corporation | 7 |
| Advanced Micro Devices, Inc. (AMD) | ATI Technologies ULC | 5 |
| Samsung Electronics Co., Ltd. | Hanyang University Industry-Academic Cooperation Foundation | 2 |
| Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) | TSMC Arizona Corporation | 2 |
| Samsung Electronics Co., Ltd. | Dongwoo Fine-Chem Co., Ltd. | 1 |
| Samsung Electronics Co., Ltd. | GRAZ UNIVERSITY OF TECHNOLOGY | 1 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
Samsung and TSMC lead on volume; MediaTek is the fastest-growing challenger
The top two filers are separated by only 462 patent families but differ in technology emphasis: Samsung spans device and memory layers while TSMC is concentrated entirely in semiconductor device and assembly classes.
Samsung Electronics
Samsung leads with 2,214 patent families and a recent-period filing trend of +86%, indicating accelerating investment. Technology focus is spread across multi-die assemblies (H01L 25), device packaging (H01L 23), and static memory cells (G11C 11), reflecting full-stack HBM capability from DRAM cell through package integration. The +86% recent trend is the strongest absolute-volume acceleration among the major incumbents.
families: 2214MediaTek
MediaTek holds 116 patent families but posted a +186% recent-period filing surge — the highest growth rate among tracked applicants — signaling a deliberate strategic push into HBM-related IP, likely tied to AI and high-performance mobile/data-center SoC development. Its technology focus is concentrated in semiconductor device assembly (H01L 25, H01L 23), consistent with a fabless firm building interface and integration expertise rather than memory cell IP.
families: 116| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| Samsung Electronics Co., Ltd. | 1,138 | ▲ +86% |
| Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) | 890 | ▲ +57% |
| Intel Corporation | 370 | ▼ -11% |
| Micron Technology, Inc. | 177 | ▬ +4% |
| Advanced Micro Devices, Inc. (AMD) | 94 | ▲ +47% |
| SK Hynix Inc. | 48 | ▼ -11% |
| Semiconductor Energy Laboratory Co., Ltd. | 45 | ▼ -37% |
| MediaTek Inc. | 63 | ▲ +186% |
Under-served branches adjacent to the HBM core
Five IPC branches each account for roughly 1–2% of total records in the corpus, placing them well below the dominant H01L and G11C classes. Each has plausible technical relevance to HBM evolution and relatively sparse prior art.
G02B · Optical elements & systems
With 222 records and a 2% share, optical elements represent one of the sparser adjacent branches. The technical relevance is direct: co-packaged optics and optical interconnects are an emerging approach to extending HBM bandwidth beyond the limits of electrical TSV interfaces. The entry path for an organization with photonics IP would be to combine existing G02B assets with HBM integration claims, an area where players such as Celestial AI and Ayar Labs appear in the applicant list but hold small positions.
Search this in Eureka →H05K · Printed circuits & assemblies
H05K accounts for 237 records and a 2% share, making it sparse relative to the device-layer dominant classes. Printed circuit and substrate assembly IP is technically adjacent to HBM interposer and package substrate design — a layer that becomes increasingly critical as HBM generations require tighter signal-integrity and thermal management at the board level. The relatively low filing density suggests that substrate-level HBM integration remains under-patented compared to die-level work.
Search this in Eureka →How leading applicants differ by technology route
Strength of each leader across the main technology routes.
| Player | H01L 25 · Semiconductor devices | H01L 23 · Semiconductor devices | H01L 21 · Semiconductor devices | G11C 11 · Static & digital memories | G11C 5 · Static & digital memories |
|---|---|---|---|---|---|
| Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) | Strong · 1,765 | Strong · 1,739 | Strong · 1,325 | Absent | Absent |
| Samsung Electronics Co., Ltd. | Strong · 1,572 | Strong · 1,392 | Moderate · 397 | Moderate · 582 | Emerging · 181 |
| Intel Corporation | Strong · 735 | Strong · 646 | Moderate · 196 | Moderate · 339 | Moderate · 160 |
| Micron Technology, Inc. | Strong · 319 | Strong · 220 | Moderate · 97 | Strong · 188 | Strong · 173 |
| SK Hynix Inc. | Strong · 122 | Strong · 66 | Absent | Moderate · 43 | Moderate · 44 |
| Advanced Semiconductor Engineering, Inc. (ASE) | Strong · 110 | Strong · 104 | Strong · 61 | Absent | Absent |
| iCometrue Co., Ltd. | Strong · 93 | Strong · 88 | Absent | Strong · 52 | Absent |
Frequently asked questions
The analysis covers 8,356 patent families. This corpus total is distinct from the patent-record counts used for jurisdiction and IPC branch breakdowns, where a single family can appear in multiple offices or classes.
Samsung Electronics leads with 2,214 patent families, ahead of TSMC at 1,752 and Intel at 1,001. Samsung’s recent-period filing trend of +86% indicates its lead is actively widening.
Yes. The field is in a Growth lifecycle stage, with a 43% recent-window growth rate. Annual filings rose from 360 in 2017 to 1,375 in 2022. Data for 2023–2025 is understated due to publication lag and should not be interpreted as a slowdown.
The United States is the primary jurisdiction, with 6,669 patent records. Europe (EPO) at 525, WIPO (PCT) at 421, China at 400, and Taiwan at 274 form the next tier.
The most-cited work in scope includes titles on in-memory lightweight coherency (461 citations), wafer bonding with metal interlayers (445 citations), package structures and fabrication methods (356 citations), high-performance memory bus architecture (326 citations), and conductive barrier direct hybrid bonding (cited in two separate records at 293 and 277 citations).
Among tracked applicants, MediaTek shows the highest recent-period growth at +186%, followed by Samsung at +86% and TSMC at +57%. Intel and SK Hynix both show a -11% recent trend, while Semiconductor Energy Laboratory shows -37%.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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