High-Entropy Alloy Mechanical Properties Patent Landscape
The field holds 1,043 patent families and is in a Growth stage, with multi-year activity up 67% and Chinese institutions dominating filings. Proterial Ltd is the sole industrial leader among a largely academic top tier, signaling that commercial exploitation still lags research output.
An academically dominated field with one clear industrial leader
Proterial Ltd holds the largest position with 45 patent families, followed by Kunming University of Science and Technology at 37 and Yanshan University at 24. The top five filers account for 19% of the combined output of the hundred largest filers, indicating a moderately dispersed field rather than a tight oligopoly.
The gap between the top industrial filer (Proterial Ltd) and the next-ranked academic institutions is relatively narrow in absolute terms, and the remainder of the top twenty is filled almost entirely by Chinese universities. This structure reflects a field where applied research is abundant but deep commercial IP accumulation by manufacturers is still early.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Proterial Ltd | 45 | |
| 2 | KUNMING UNIV OF SCI & TECH | 37 | |
| 3 | Yanshan University | 24 | |
| 4 | UNIV OF SCI & TECH BEIJING | 23 | |
| 5 | Xiangtan University | 20 | |
| 6 | Harbin Institute of Technology | 19 | |
| 7 | Tianjin University | 19 | |
| 8 | Dalian University of Technology | 18 | |
| 9 | Hefei University of Technology | 16 | |
| 10 | Taiyuan University of Technology | 15 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | POSTECH Academy-Industry Foundation | 15 | |
| 12 | Northwestern Polytechnical University | 14 | |
| 13 | Beijing Institute of Technology | 13 | |
| 14 | Central South University | 13 | |
| 15 | City University of Hong Kong | 13 | |
| 16 | Wuhan University OF SCI & TECH | 12 | |
| 17 | Jiangsu University | 12 | |
| 18 | Jiangsu University of Technology | 11 | |
| 19 | Institute of Metal Research, Chinese Academy of Sciences | 11 | |
| 20 | Northeastern University China | 10 |
Proterial Ltd’s industrial focus on alloy composition and powder metallurgy gives it a differentiated position relative to academic filers. The concentration of academic applicants suggests that the foundational IP layer is broadly accessible and that proprietary process or application patents represent the higher-value frontier.
Patent filings from the most recent 18–24 months are under-represented due to publication lag; the apparent plateau in 2024–2025 data should not be read as a slowdown. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Sustained growth with alloy composition at the core and emerging process routes alongside
The annual filing trend and technology composition together reveal a field that has grown substantially since 2017 and remains anchored in alloy design, while powder metallurgy, coatings, and additive manufacturing are establishing meaningful secondary branches.
Annual filing trend
Filings rose from 65 in 2017 to a peak of 156 in 2023, with 2022–2024 forming the highest sustained band. The 2025–2026 figures are materially under-counted due to publication lag and should not be interpreted as a reversal of the growth trend.
↗ Hover for values · click a bar to ask EurekaTechnology composition
C22C (Alloys) is the dominant branch, reflecting the foundational focus on alloy composition design. B22F (Powder metallurgy) and C23C (Coating and surface deposition) are the next largest branches, showing that near-net-shape fabrication and protective coating applications are already well-developed secondary axes. B33Y (Additive manufacturing) is a notable and growing tertiary branch, while heat treatment (C21D) and casting (B22D) remain comparatively sparse.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Fabrication of high-entropy alloy wire and multi-p…
In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | High-strength and ultra heat-resistant high entrop… | 302 |
| 2 | Precipitation Hardening High Entropy Alloy and Met… | 128 |
| 3 | AlCoCrFeNiTix高熵合金材料及其制备方法 | 107 |
| 4 | 一种难熔高熵合金/碳化钛复合材料及其制备方法 | 81 |
| 5 | Alloy member, manufacturing method of the alloy me… | 79 |
| 6 | Multi-Component Solid Solution Alloys having High … | 72 |
| 7 | Multi-material component and methods of making the… | 70 |
| 8 | High entropy alloy having TWIP/trip property and m… | 66 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the competitive structure means for R&D investment decisions
China-centric jurisdiction profile shapes where differentiated positions can still be built.
Growth stage with multi-year expansion intact
The lifecycle evidence classifies this field as Growth, with a 67% increase in filings over the recent window and annual volume reaching its highest sustained band in 2022–2024. The field has not yet shown the plateau or fragmentation patterns typical of maturity. Entrants can still stake claims in process and application sub-domains before the IP landscape hardens.
Growth stageDispersed top tier with a single industrial anchor
The top five filers hold 19% of the combined output of the hundred largest filers — a moderate concentration level. All but one of the top twenty applicants are universities or public research institutes, meaning the commercial IP layer is thin. This creates both a freedom-to-operate opportunity and a risk that academic prior art constrains narrow composition claims.
Moderate dispersionCollaboration is emerging but limited in scale
The most active co-filing pair is Harbin Institute of Technology and its Chongqing Research Institute with 2 joint families. Additional pairs include Kunming University of Science and Technology with Yunnan Xuecui Technology, Xiangtan University with Zhuzhou Cemented Carbide Group, and Northwestern Polytechnical University with both Guizhou University and Xi’an Rare Metal Materials Research Institute. Cross-sector university-industry collaboration remains nascent, presenting an opening for industrial players to anchor joint-development agreements.
Early-stage ecosystemChina-dominant filings with limited global protection
China accounts for the large majority of patent records in this landscape, with the United States as the next jurisdiction and Europe (EPO) third. India and WIPO (PCT) filings are present but modest. The narrow geographic spread of most families means that non-Chinese applicants face relatively open competitive territory in US and European prosecution, and that Chinese-originated inventions are often not protected outside their home market.
China-centricGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| Harbin Institute of Technology | Harbin Institute of Technology Chongqing Research Institute | 2 |
| Kunming University of Science and Technology | Yunnan Xuecui Technology Co., Ltd. | 1 |
| Xiangtan University | Zhuzhou Cemented Carbide Group Co., Ltd. | 1 |
| Northwestern Polytechnical University | Guizhou University | 1 |
| Northwestern Polytechnical University | Xi’an Rare Metal Materials Research Institute Co., Ltd. | 1 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
Proterial Ltd leads industrially; Kunming University of Science and Technology accelerates academically
The top two filers represent distinct strategic profiles: a Japanese industrial incumbent with a powder-metallurgy and alloy-composition focus, and a Chinese university with a broadening coating and alloy portfolio and strong recent momentum.
Proterial Ltd
Proterial Ltd leads with 45 patent families, the largest single block in this landscape. Its technology emphasis spans alloy composition (C22C 30), powder metallurgy (B22F 9 and B22F 1), making it the most industrially oriented filer in the top tier. Momentum data shows it as a new entrant in the recent filing window, suggesting a focused and relatively recent patent-building campaign rather than a long-established position.
families: 45Kunming University of Science and Technology
Kunming University of Science and Technology holds 37 patent families and is showing strong upward momentum at plus 55% in recent filings. Its portfolio spans alloy composition (C22C 30), coating and surface deposition (C23C 24), and broader alloy design (C22C 1), indicating a multidimensional research programme. As the leading Chinese academic filer it represents the benchmark for university-level IP output in this field.
families: 37| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| Kunming University of Science and Technology | 17 | ▲ +55% |
| Proterial Ltd | 1 | ▲ new entrant |
| Yanshan University | 2 | ▲ new entrant |
| University of Science and Technology Beijing | 10 | ▲ new entrant |
| Xiangtan University | 3 | ▲ new entrant |
| Dalian University of Technology | 10 | ▲ new entrant |
| Harbin Institute of Technology | 11 | ▲ new entrant |
| Northwestern Polytechnical University | 6 | ▼ -40% |
Under-served process and application routes adjacent to the alloy-composition core
Several IPC branches sit at the margins of the current filing concentration. Two in particular combine relative sparsity with plausible technical value and realistic entry paths for teams already active in high-entropy alloy research.
C21D · Heat treatment of metals
Heat treatment accounts for a comparatively small share of records relative to the alloy-composition core. Given that thermal processing routes — annealing, aging, thermomechanical treatment — are critical to achieving target mechanical properties in high-entropy alloys, this branch appears under-served relative to its technical importance. Teams with process-control expertise could stake differentiated positions here by linking specific heat-treatment protocols to measurable property outcomes.
Search this in Eureka →B33Y · Additive manufacturing (3D printing)
Additive manufacturing holds a modest share of records despite growing industrial interest in printing high-entropy alloy components with site-specific mechanical properties. The branch is sparse enough that early movers can still establish broad coverage of process-parameter and microstructure-property relationships. Entry paths are realistic for groups that already hold C22C composition IP and can couple it with printing process claims.
Search this in Eureka →How leading applicants differ by technology route emphasis
Route coverage across the main technology branches in the current evidence set.
| Player | C22C 30 · Alloys | C22C 1 · Alloys | B22F 9 · Powder metallurgy | B22F 3 · Powder metallurgy | C23C 24 · Coating & surface deposition |
|---|---|---|---|---|---|
| Kunming University of Science and Technology | Strong · 34 | Strong · 19 | Moderate · 8 | Emerging · 3 | Strong · 23 |
| Proterial Ltd | Strong · 32 | Absent | Strong · 28 | Strong · 26 | Absent |
| Yanshan University | Strong · 16 | Strong · 21 | Moderate · 8 | Strong · 14 | Absent |
| University of Science and Technology Beijing | Strong · 22 | Strong · 20 | Absent | Absent | Absent |
| Xiangtan University | Strong · 18 | Strong · 20 | Absent | Emerging · 3 | Absent |
| Dalian University of Technology | Strong · 18 | Strong · 17 | Absent | Absent | Absent |
| Hefei University of Technology | Strong · 17 | Strong · 18 | Absent | Absent | Absent |
Frequently asked questions
The landscape contains 1,043 patent families. China is the dominant filing jurisdiction, followed by the United States and Europe (EPO).
Proterial Ltd leads with 45 patent families, making it the only large industrial filer in a top tier otherwise composed of Chinese universities and research institutes.
The recent-window growth rate is 67% relative to the prior period. Annual filings rose from 65 in 2017 to a peak of 156 in 2023, with 2022–2024 representing the highest sustained band. The lifecycle stage is classified as Growth.
Alloy composition (C22C) is the dominant branch. Powder metallurgy (B22F) and coating and surface deposition (C23C) are well-developed secondary branches. Additive manufacturing (B33Y) is a growing tertiary area, while heat treatment (C21D) and casting (B22D) are comparatively sparse.
It is moderately dispersed. The top five filers hold 19% of the combined output of the hundred largest filers. The large number of Chinese universities spread across the ranking means no single entity dominates the overall field.
Heat treatment (C21D) and additive manufacturing (B33Y) are the two branches that combine relative filing sparsity with strong technical relevance to mechanical property engineering. Both have realistic entry paths for teams already active in alloy composition research.
Ready to map the high-entropy alloy IP landscape for your own R&D focus?
Join 18,000+ innovators using PatSnap Eureka to map any technology landscape: search 2B+ patents and papers, surface key assignees, and generate a report like this in minutes.
Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.