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High-Entropy Alloy Phase Design Patents: Who Leads, Gaps 2026

High-Entropy Alloy Phase Design Patents: Who Leads, Gaps 2026
https://www.patsnap.com/resources/blog/rd-blog/high-entropy-alloy-phase-design-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Metals & Alloys
High-Entropy Alloy Phase Design Patents: Who Leads, Where the Gaps Are
  • 37.3% of all 67 records sit with the top five assignees, with a long tail of single- and double-filing entrants behind them.
  • Filings rose 60% from 2021 (5) to 2024 (8), the most recent year with a largely complete publication record.
  • C22C alloy composition covers 67.2% of records, while heat treatment, catalysis and implant applications each sit in single digits — the clearest white space in the field.
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67
Published Records
37%
Top-5 Share of All Records
+60%
Filing Growth 2021→2024
IN
Leading Jurisdiction

Filing growth compares 2021 (5 records) with 2024 (8) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 67 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

High-entropy alloys and multi-principal-element alloys are defined by having several elements in near-equal proportion rather than one dominant base metal, which changes how phases form and how mechanical properties develop. This landscape tracks patent filings claiming phase stability, solid solution strengthening, lattice distortion, CALPHAD prediction, sluggish diffusion and eutectic microstructure control across composition, processing and application claims.

The 67 records in scope run from 2015 through the 2026-07-31 data cut-off, filed through receiving offices led by India and the United States, with smaller volumes through the EPO, WIPO, South Korea and Canada. Because publication typically lags filing by around 18 months, the most recent filing years understate actual activity.

Records by IPC subclass and filing year
  1. 1PROTERIAL LTD9
  2. 2OERLIKON SURFACE SOLUTIONS AG PFAFFIKON6
  3. 3OHIO STATE INNOVATION FOUND4
  4. 4CITY UNIVERSITY OF HONG KONG3
  5. 5GEORGETOWN UNIV3
  6. 6SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION3
  7. 7NAT INST OF TECH WARANGAL3
  8. 8NAT RES COUNCIL OF CANADA3
  9. 9INDIAN INSTITUTE OF TECHNOLOGY2
  10. 10INDIAN INSTITUTE OF TECHNOLOGYKHARAGPUR2
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on High-Entropy Alloy Phase Design covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Filing Data

Filing trends and technology composition

The dataset covers 67 published records from 2015 through the 2026-07-31 cut-off, spanning alloy composition, powder processing, coatings, heat treatment and downstream applications such as implants.

Filing activity: a 2018 peak, then a rebuilding phase

Filings ran from 3 in 2017 to a peak of 12 in 2018, before settling into a steadier band. Between 2021 (5) and 2024 (8) — the most recent year that can be treated as complete, since publication lags filing by roughly 18 months — filings rose 60%. 2025 and 2026 figures will fill in as later-filed applications publish.

Filing activity: a 2018 peak, then a rebuilding phase03691232017122018201920202021202220232024202532026Most recent year is partial — publication lag means later filings are not yet visible.

Where the claims sit: alloy composition dominates

C22C (alloys) covers 67.2% of the 67 records, more than double the next largest class, B22F (powder metallurgy) at 29.9%. Coating (C23C), additive manufacturing (B33Y), heat treatment (C21D) and application-specific classes like implants (A61F) each cover a single-digit-to-low-teens share, marking the thinner, less-claimed branches of the field.

Where the claims sit: alloy composition dominatesC22C · Alloys4567.2%B22F · Powder metallurgy2029.9%C22F · Non-ferrous metal treatment1014.9%C23C · Coating & surface deposition811.9%B33Y · Additive manufacturing (3D pri…69.0%B01J · Chemical/physical processes & …57.5%C21D · Heat treatment of metals46.0%A61F · Implants & prostheses34.5%Other5074.6%

Shares are the percentage of the 67 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on High-Entropy Alloy Phase Design covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Filings

Most-cited records in this landscape

Representative Filing
US20200157663A12020-05-21

High entropy alloy structure and a method of preparing the same

CITY UNIVERSITY OF HONG KONG

A method for preparing a high entropy alloy (HEA) structure includes the steps of: preparing an alloy by arc melting raw materials comprising five or more elements; drop casting the melted alloy into a cooled mold to form a bulk alloy with eutectic microstructure therein; and subjecting the bulk alloy to an acidic condition to form a bulk porous structure with eutectic microstructure therein. A high entropy alloy structure is also provided as prepared by the method.Filed by City University of Hong Kong, 2020-05-21 · US20200157663A1 · 58 citations

US20200157663A1 — patent drawing 1US20200157663A1 — patent drawing 2
View full filing
Highest-citation records in the dataset
#Publication no.Patent titleCitations
1US20170314097A1High-strength and ultra heat-resistant high entropy alloy (HEA) matrix composites and method of preparing the…307
2US20190024198A1Precipitation Hardening High Entropy Alloy and Method of Manufacturing the Same131
3US20200157663A1High entropy alloy structure and a method of prepating the same58
4US20190226058A1Alloy member, process for producing said alloy member, and product including said alloy member53
5US20200308683A1Precipitation Strengthening AlCrFeNiV System High Entropy Alloy and Manufacturing Method Thereof49
6US20170232155A1Thermo-mechanical processing of high entropy alloys for biomedical applications36
7KR1020160126702AHigh strength tungsten alloy with low activation and manufacturing method for the same20
8KR1020150073270ARare earth element based high entropy bulk metallic glass15
9IN201931008558ARefractory metal based multi-component alloy for articulating surfaces in total joint arthroplasty11
10WO2020234484A1PVD coatings comprising multi-anion high entropy alloy oxy-nitrides10

Citation counts favour older filings within this searched corpus and should be read as a signal of influence, not of current commercial importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on High-Entropy Alloy Phase Design covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Signals

What the filing data signals

Three patterns stand out once the 67 records are broken down by assignee, technology class and citation weight: moderate concentration at the top, a rebuilding filing trend after a 2018 peak, and a technology mix still anchored in composition claims rather than downstream processing.

Concentration
56.7%
held by top 10 of 67 records

Filing sits with a handful of organisations, not one

The leading assignee holds 9 records; the tenth-ranked holds 2. Combined, the top ten account for 56.7% of the 67 records in scope, leaving roughly 43% spread across a long tail of smaller filers, including several with a single family.

Ranking covers 50 assignees, the full set returned by the data endpoint.
Momentum
+60%
2021 to 2024 filing growth

Growth resumed after the 2018 peak

Filings hit an early peak of 12 in 2018, then eased before climbing again: 5 in 2021 to 8 in 2024. That three-year, 60% rise is the most recent complete-year comparison available given typical 18-month publication lag.

2025–2026 counts will rise as later filings publish.
Technology mix
67.2%
of records in C22C (alloys)

Composition claims dominate over process and application

C22C alloy-composition claims cover more than two-thirds of the 67 records, well ahead of powder metallurgy (29.9%) and far ahead of heat treatment, coatings, additive manufacturing and implant-specific claims, all in single or low-double digits.

Shares sum above 100% because records can carry multiple IPC classes.
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Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to high-entropy alloy phase design, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on High-Entropy Alloy Phase Design covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the field is still open

Filing is led by a mix of industrial materials firms, national research organisations and universities, with concentration moderate enough that no single entity controls the field. Momentum data shows several established filers with no activity in the latest year, consistent with the broader publication lag rather than an actual pullback.

Leader
9
records held by the top assignee

A single leader, not a runaway one

The top-ranked assignee holds 9 of the 67 records in scope. That is a meaningful lead over the field but well short of dominating it, leaving room for competitors to build comparable portfolios.

Fifth place holds 3 records; tenth place holds 2.
Long tail
50
assignees in the ranking

A wide base of smaller filers

The ranking returned by the data endpoint covers 50 assignees, most holding only one or two families. This spread suggests the field is still open to new entrants building focused portfolios in specific alloy systems or processes.

Not a top-50 or top-100 cut — this is the full ranking returned.
Collaboration
4
co-assignee pairs identified

Co-filing is limited but present

Only 4 co-assignee pairs appear in the dataset, the strongest tied to a national research foundation working with individual named inventors. Most records are filed by a single assignee rather than through formal joint ventures.

Pattern suggests inventor-driven rather than institution-driven collaboration.
🔍
Under-claimed sub-areas worth a closer look
These branches carry the lowest IPC-share coverage in the dataset relative to the C22C composition core, suggesting less claim density per filing.
Post-solidification annealing schedules for phase suppressionBiocompatible HEA compositions for implantsCatalytic-surface HEA formulationsPorosity control via templating instead of acid-etchAdditive-manufacturing process parameters for eutectic control
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Proterial, Ltd.0
Oerlikon Surface Solutions AG, Pfäffikon0
Ohio State Innovation Foundation0-100%
City University of Hong Kong0
National Research Council of Canada0
Georgetown University0
Seoul National University R&DB Foundation0
NAT INST OF TECH WARANGAL0-100%
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on High-Entropy Alloy Phase Design covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Next Steps

Where to take this next

The public filing data shows where claim density sits and where it thins out. Turning that into a filing or freedom-to-operate decision requires drilling into specific claims and specific assignees.

Run a freedom-to-operate check on a specific alloy system

IPC-level shares show where composition claims are dense, but only a claim-by-claim read of the leading records will confirm whether a specific element combination or process step is actually blocked.

Check claim scope in Eureka

Track the assignees with renewed filing activity

Momentum figures show several established filers quiet in the latest year, likely a publication-lag effect. Monitoring their pipeline over the next few publication cycles will clarify who is actually still active.

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Build a first claim in an under-claimed branch

Heat treatment, catalytic and implant-specific applications carry the lowest IPC shares in this dataset. Drafting around a specific process-plus-outcome claim in one of these branches faces less prior art than a composition-only claim.

Draft and search claims in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on High-Entropy Alloy Phase Design covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Frequently asked questions

Answers are grounded in the same dataset. Derived from a Patsnap search on High-Entropy Alloy Phase Design covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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