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High-Entropy Materials Patents: Who Leads, Where the Gaps Are 2026

High-Entropy Materials Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/high-entropy-materials-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Advanced Materials
High-Entropy Materials Patents: A Concentrated Field With a Long Filing Gap
  • One filer holds 17 of 32 records in scope and the top five combined account for 90.6% of the field — this is a landscape with a dominant leader, not a crowded one.
  • Filing peaked in 2020 at 8 records then fell; the 2021→2024 span shows a -100% change, though 2025 onward is still filling in as publications lag filing.
  • Computing overlaps materials science more than metallurgy does G06F and G16C classes cover 40.6% and 37.5% of records respectively, ahead of C22C alloys at 12.5%.
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32
Published Records
91%
Top-5 Share of All Records
-100%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (3 records) with 2024 (0) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 32 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This review covers 32 published patent records matching high-entropy and multi-principal-element alloy claims combined with material-property, synthesis-condition, or structure-property terms. The scope is deliberately narrow: it captures filings where alloy composition work is paired with characterization, prediction, or interface data rather than alloy chemistry alone. That intersection is why the dataset skews toward computational classes as much as metallurgical ones.

Coverage runs from 2015 through the 2026-08-31 cut-off. Because publication typically lags filing by around 18 months, records from 2025 and 2026 understate actual filing activity for those years and should not be read as a slowdown.

Filing activity and technology composition, 2015–2026
  1. 1Tata Consultancy Services Limited17
  2. 2Ohio State Innovation Foundation4
  3. 3Khalifa University of Science and Technology3
  4. 4STEINGRIMSSON BALDUR ANDREW3
  5. 5Battelle Energy Alliance, LLC2
  6. 6Panasonic Intellectual Property Management Co., Ltd.1
  7. 7University of Virginia Patent Foundation1
  8. 8Harbin Engineering University1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on High-Entropy Materials Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The data

Filing trend and technology composition

Two views of the same 32 records: how filing activity has moved year over year, and which IPC subclasses the claims actually sit in.

A single peak year, then a drop-off that predates the publication lag

Filing rose to a peak of 8 records in 2020, then declined; the 2021-to-2024 span — the most recent window that can be treated as complete — shows a -100% change. Years after 2024 are still filling in as publications catch up to filing dates, so they should not be read as confirming or reversing that decline.

A single peak year, then a drop-off that predates the publication lag024680201720182019820202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Computation and prediction classes outweigh alloy-composition classes

G06F (electric digital data processing) appears in 40.6% of the 32 records and G16C (computational chemistry) in 37.5%, both ahead of C22C (alloys) at 12.5% and B22F (powder metallurgy) at 9.4%. Because records can carry multiple IPC classes, these shares add up to more than 100% of the record total — the pattern to read is that most filings pair an alloy system with a modelling or prediction layer, not that alloy chemistry itself is under-represented.

Computation and prediction classes outweigh alloy-composition classesG06F · Electric digital data processi…1340.6%G16C · Computational chemistry1237.5%G06N · Computing based on AI models825.0%B23K · Welding, soldering & brazing412.5%C22C · Alloys412.5%B01J · Chemical/physical processes & …39.4%B22F · Powder metallurgy39.4%A61Q · Cosmetics use26.3%Other2268.8%

Shares are the percentage of the 32 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on High-Entropy Materials Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key patents

Most-cited records in this dataset

Representative filing
US20200066376A12020-02-27

Systems and methods for predicting structure and properties of atomic elements and alloy materials (US20200066376A1)

TATA CONSULTANCY SERVICES LIMITED

Metallic alloy development has traditionally relied on experimental or theoretical equilibrium phase diagrams. Synthesis, processing and mechanical testing of samples demand heavy investment in time, money and equipment, and conventional Calphad-type calculations alone do not resolve local structure and related property prediction well. This filing describes simulation systems combining molecular dynamics with accelerated Monte Carlo techniques to predict structure evolution and material properties.Filed by Tata Consultancy Services Limited, published 2020-02-27.

US20200066376A1 — patent drawing 1US20200066376A1 — patent drawing 2
View full record
Highest-citation records in scope
#Publication no.Patent titleCitations
1US20200257933A1Machine Learning to Accelerate Alloy Design187
2US20220067249A1Machine Learning to Accelerate Design of Energetic Materials80
3US20200066376A1Systems and methods for predicting structure and properties of atomic elements and alloy materials29
4EP3614389A2Systems and methods for predicting structure and properties of atomic elements and alloy materials thereof13
5US20210202116A1Nuclear fuel elements including protective structures, and related methods12
6US11915105B2Machine learning to accelerate alloy design8
7US20220374721A1Systems and methods for design of application specific functional materials5
8US11562807B2Systems and methods for predicting structure and properties of atomic elements and alloy materials5
9WO2021051078A1Methods for and devices prepared from shape material alloy welding4
10EP4071657A1Systems and methods for design of application specific functional materials3

Citation counts inside a searched corpus favour older filings; read this as a signal of influence on later work, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on High-Entropy Materials Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-outs from the ranking, the trend, and the citation table.

Concentration
90.6%
of 32 records held by the top 5 assignees

This is a leader-and-tail field, not a crowded one

With 8 assignees accounting for all 32 records in scope, and one filer alone holding 17, most of the claim space that exists has already been staked by a small group. A new entrant is negotiating around a handful of portfolios, not hundreds of scattered filers.

Ranking covers 8 assignees, the full set returned for this scope.
Filing momentum
-100%
change from 2021 to 2024

Activity has not sustained its 2020 peak

Filing reached 8 records in 2020 and then fell; the 2021-to-2024 window, the most recent period that can be treated as complete, shows a full reversal. Filings from 2025 onward are still arriving as the publication lag closes, so this should not yet be read as the field's final trajectory.

Peak year: 2020 at 8 records.
Technology mix
40.6%
of records classed under G06F

Prediction and computation classes lead alloy-composition classes

G06F and G16C together outpace C22C and B22F, meaning the densest claim activity is in modelling, machine learning and computational chemistry applied to alloy design rather than in alloy composition itself. That leaves composition-only claims comparatively less crowded.

Class shares sum above 100% because records carry multiple IPC codes.
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on High-Entropy Materials Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claim space

Eight assignees account for the entire dataset, with filing weight concentrated at the top rather than spread evenly.

Leader
17
records held

One filer dominates the ranked set

The leading assignee holds 17 of the 32 records in scope — more than half the field by itself. That scale suggests a portfolio built around a core method (prediction and simulation approaches feature heavily in this filer's most-cited records) rather than a single alloy composition.

Leader: 17 records; fifth place: 2 records.
Momentum
0
records in the latest year across tracked assignees

No assignee is currently accelerating

Recent-year momentum data shows the tracked assignees, including the leading filer, at 0 new records in the latest year, with a -100% year-on-year change recorded for one filer. Given the publication lag, this reads as a gap in visible activity rather than confirmed withdrawal from the field.

Momentum measured against the most recent tracked year.
Long tail
3
records held by the remaining assignees combined

The tail is thin, not absent

Beyond the top five, the remaining assignees in the ranked set hold small single-digit counts each. That leaves room for a new filer to establish a position without displacing an incumbent outright, provided the claims target an under-served branch rather than the leader's core method.

Top 8 combined account for 100.0% of the 32 records in scope.
🔍
Under-claimed branches worth checking before you draft
These sub-areas sit at the edges of the current filing density and warrant a freedom-to-operate check rather than an assumption of open space.
Powder metallurgy processing of HEAsCosmetic-use alloy interfacesWelding/brazing of multi-principal-element alloysCatalytic-surface HEA characterizationNuclear-fuel protective HEA structures
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Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Tata Consultancy Services Limited0
Ohio State Innovation Foundation0
Khalifa University of Science and Technology0
STEINGRIMSSON BALDUR ANDREW0
Battelle Energy Alliance, LLC0
Panasonic Intellectual Property Management Co., Ltd.0-100%
University of Virginia Patent Foundation0
Harbin Engineering University0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on High-Entropy Materials Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this next

The dataset points to a field with a dominant filer, a stalled filing curve, and claim density that sits in computation more than in alloy chemistry.

Check freedom-to-operate against the top filer's method claims

With one assignee holding 17 of 32 records, most concentrated in prediction and simulation approaches, a new filing in that method space needs a clearance check before drafting rather than after.

Run a claims comparison in Eureka

Watch for the 2025–2026 records still arriving

Because publication lags filing by roughly 18 months, the apparent drop after 2021 is not yet the final picture. Re-check the trend once later years finish publishing before treating the field as inactive.

Set a filing alert in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on High-Entropy Materials Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Questions practitioners ask about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on High-Entropy Materials Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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