High Frequency & RF Wafer Probing Patents: Leaders & Trends 2026
High Frequency and RF Wafer Probing Patents: Who Leads and Where Filings Are Headed
Concentrated at the top. The five leading assignees hold 103 of 186 records in scope (55.4%), and the leading ten hold 71.0% — a field where a handful of players occupy most of the claim space. Annual filings peaked so far at 17 in 2018, then eased before climbing again — 2021's 2 filings became 2024's 5, a +150% three-year rise. 2024 is the most recent year that can be read as complete; 2025 and 2026 will fill in as publications catch up.
- 1MITSUBISHI ELECTRIC CORP28
- 2MPI CORP28
- 3BRILLIANT LIGHT POWER INC17
- 4HUGHES AIRCRAFT CO17
- 5NEWTEC CY NV13
See the full high frequency and rf wafer probing analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
How many patents exist for high frequency and RF wafer probing?
This dataset identifies 186 published records between 2015 and mid-2026 that combine RF probing or high-frequency probe language with impedance matching, de-embedding, calibration substrates, crosstalk between probes, ground-signal-ground layouts, or loss compensation. That figure reflects one specific search scope, so a broader or narrower query on the same technology could return a different count. It should be read as the population this landscape is built on, not as an absolute count of every probing-related patent worldwide.
Who are the leading patent holders in RF wafer probing?
The leading assignee holds 28 of the 186 records in scope, and the top five combined account for 55.4% of all records. Filing counts drop sharply after that: by tenth place the count is down to 4 records, out of 52 companies that appear across the full ranking. That pattern points to one or two dominant filers alongside a long tail of occasional entrants rather than an evenly distributed field.
Is patent filing activity in RF wafer probing growing or shrinking?
Filings peaked so far at 17 in 2018, dipped afterward, and have since climbed again — 2021’s 2 filings grew to 2024’s 5, a +150% increase over that three-year span. 2024 is the most recent year with a largely complete count, because publication typically lags filing by around 18 months. The 2025–2026 figures in any chart should be read as still filling in rather than as a genuine slowdown.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on High Frequency and RF Wafer Probing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.