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HVDC Modular Multilevel Converter Patents: Top Companies & Trends 2026

HVDC Modular Multilevel Converter Patents: Top Companies & Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/high-voltage-direct-current-modular-multilevel-converter-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Smart Grid & Power Systems
Modular Multilevel Converter Patents for HVDC: Who Leads and Where the Claim Space Is Still Open
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4,483
Published Records
26%
Top-5 Share of All Records
-9%
Filing Growth 2021→2024
CN
Leading Jurisdiction

Filing growth compares 2021 (314 records) with 2024 (285) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 4,483 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this landscape covers

Modular Multilevel Converter (MMC) technology underpins most modern high-voltage direct current (HVDC) transmission schemes, replacing the two-level and thyristor-based topologies of earlier HVDC generations with stacks of series-connected converter cells. This landscape covers 4,483 published records filed or published between 2015 and mid-2026, searched on modular multilevel converter terminology across titles, abstracts and claims. It maps who is filing, what parts of the converter stack they are claiming, and which jurisdictions are absorbing the volume.

The dataset spans grid operators, converter equipment manufacturers, and university research groups, with filings concentrated in China's receiving office by a wide margin over the US, European and PCT routes. Because publication lags filing by roughly 18 months, the most recent one to two years in any trend understate actual filing activity.

Filing volume and technology composition, 2015-2026
  1. 1SIEMENS ENERGY GLOBAL GMBH & CO KG287
  2. 2STATE GRID CORPORATION OF CHINA286
  3. 3HITACHI ENERGY LTD252
  4. 4NORTH CHINA ELECTRIC POWER UNIV197
  5. 5ABB (SCHWEIZ) AG147
  6. 6SOUTHEAST UNIV146
  7. 7SIEMENS AG131
  8. 8ELECTRIC POWER RES INST CHINA SOUTHERN POWER GRID CO LTD118
  9. 9HYOSUNG HEAVY IND CORP115
  10. 10ZHEJIANG UNIV104
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on High-Voltage Direct Current: Modular Multilevel Converter Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Numbers

Filing trends and technology composition

Filing volumes, IPC composition, and receiving-office distribution for the 4,483 records in scope. Because a single record can carry several IPC subclasses, composition shares add up to more than 100% of the record total.

Filings rose to a 2020 peak, then settled into a lower plateau

Filings climbed from 376 in 2017 to a peak of 421 in 2020, then eased to 314 by 2021 and 285 by 2024 – a -9% move over that three-year span. 2024 is the last year in this dataset that can be treated as complete; 2025 and 2026 figures will continue to fill in as publication catches up with filing.

Filings rose to a 2020 peak, then settled into a lower plateau0125250375500376201720182019421202020212022202320242025412026Most recent year is partial — publication lag means later filings are not yet visible.

Power conversion claims dominate; grid integration is the clear second axis

H02M (power conversion) appears in 74.8% of the 4,483 records, confirming that converter-cell and topology claims are the primary battleground. H02J (power supply and grid systems) follows at 36.9%, while protective circuitry (H02H, 7.5%), measurement (G01R, 5.8%) and control software (G06F, 5.1%) are present but far less contested – control-side and protection-side claims occupy noticeably less filed space than the core power-conversion hardware.

Power conversion claims dominate; grid integration is the clear second axisH02M · Power conversion (AC/DC etc.)3,35374.8%H02J · Power supply & grid systems1,65636.9%H02H · Protective circuit arrangements3387.5%G01R · Electric & magnetic measurement2605.8%G06F · Electric digital data processi…2295.1%H02P · Control of motors & generators1152.6%H05K · Printed circuits & assemblies882.0%B60L · Electric vehicle propulsion671.5%Other64914.5%

Shares are the percentage of the 4,483 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on High-Voltage Direct Current: Modular Multilevel Converter Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative filing and most-cited prior art

Representative Filing
AU2014314061A12016-04-14

Parallel modular multilevel converters and protection system (AU2014314061A1, ABB Technology)

ABB TECHNOLOGY AG

The filing describes a converter arrangement combining at least two modular multilevel converters, each built from converter branches of series-connected cells with capacitors and semiconductor switches. Branches from separate converters connect via shared branch connection points, and the arrangement includes a protection scheme for the parallel configuration.Abstract text is reproduced from the published filing and may be truncated.

View full filing
Most-cited records in the MMC / HVDC corpus
#Publication no.Patent titleCitations
1US5933339AModular static power converter connected in a multi-level, multi-phase, multi-circuit configuration207
2US20130030239A1Magnetic stimulation having a freely selectable pulse shape153
3US20150124506A1Modular converter with multilevel submodules115
4JP2011182517APower converter109
5CN101795057A无需辅助直流电源的三相模块化多电平换流器启动方法104
6US20140129195A1Real time dynamic physics simulation device of flexible DC transmission system93
7JP2012044839APower converter92
8US6798677B2Modular power converter90
9CN103197241A柔性直流输电MMC换流阀运行试验装置及试验方法89
10CN101854061A一种三相模块化多电平换流器环流抑制方法88

Citation counts favour older records that have had more time to accumulate citations within the searched corpus; treat them as a signal of influence rather than of current technical importance.

Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on High-Voltage Direct Current: Modular Multilevel Converter Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the filing pattern means for strategy

Four read-throughs from the concentration, composition and geographic figures above, aimed at where to file, who to watch and what to leave alone.

Concentration
26.1% / 39.8%
top 5 / top 10 share of all 4,483 records

Leadership is concentrated but not closed

The top 5 assignees account for 26.1% of all records and the top 10 for 39.8%, leaving roughly 60% of filings spread across the rest of a 100-company ranked field. That is a meaningful lead cluster, not a monopoly – new entrants are still filing at volume alongside the incumbents.

Ranked field: 100 companies, counted in records
Composition
74.8%
of records classified under H02M

The converter-cell topology is the crowded zone

Three-quarters of records touch H02M power conversion, meaning core cell topology, switching arrangement and branch configuration claims sit on dense prior art. Adjacent classes – H02H protection at 7.5%, G06F control logic at 5.1%, B60L EV propulsion at 1.5% – carry far fewer filings relative to the same 4,483-record base.

Class shares sum above 100% because records carry multiple IPC codes
Trend
-9%
change in filings, 2021 to 2024

Volume has plateaued after its 2020 peak

Filings peaked at 421 in 2020 and eased to 285 by 2024, a -9% move over that three-year window. That is a cooling from peak intensity, not a retreat from the technology – HVDC deployment continues, and 2025-2026 figures will rise as publication catches up with recent filing.

Peak year: 2020 at 421 records
Geography
2,109
records at China's receiving office

Filing volume is heavily weighted toward China

China's receiving office accounts for 2,109 records, well ahead of the United States (576), the EPO (552), WIPO/PCT (347), India (187) and Germany (153). Strategies built only around US and European filing will miss the bulk of where MMC claim activity is actually being staked out.

Receiving offices: CN, US, EP, WIPO, IN, DE
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on High-Voltage Direct Current: Modular Multilevel Converter Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Go deeper on a specific question

The figures above describe the field as a whole. For a specific claim, competitor set or filing gap, Patsnap Eureka can trace the same dataset down to individual claims and citations.

Check freedom-to-operate before filing

Run a specific converter-cell or branch-connection design through the most-cited prior art and the leading assignees' active claims to see what is already blocked.

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Track a specific competitor's filing pattern

Follow how a named assignee's filings move across IPC classes and receiving offices year over year, rather than reading the aggregate trend.

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Identify under-claimed branches for a new filing

Compare thinly-filed IPC subclasses like control software or protection circuitry against the dense H02M core to find where a first claim has more room.

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Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on High-Voltage Direct Current: Modular Multilevel Converter Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about MMC patent activity

Answers are grounded in the same dataset. Derived from a Patsnap search on High-Voltage Direct Current: Modular Multilevel Converter Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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