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IGBT Gate Dielectric Patents: Top Companies & Filing Trends 2026

IGBT Gate Dielectric Patents: Top Companies & Filing Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/igbt-gate-dielectric-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Semiconductors & Microelectronics
IGBT Gate Dielectric Patents: Where Filing Has Concentrated and Where It Hasn't

A patent landscape review of IGBT gate dielectric technology: 261 records in scope, filing trends since 2015, assignee concentration, IPC composition, and the most-cited prior art.

261
Published Records
28%
Top-5 Share of All Records
-33%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth = 2021 (18 records) → 2024 (12); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 261 records in scope (CR5), not the ranked leaders only.

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Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What the IGBT gate dielectric filing record shows

IGBT gate dielectric technology covers the gate insulation and gate insulator structures that govern switching behaviour, threshold stability and reliability in insulated-gate bipolar transistors. The scope here draws on 261 published records filed or published between 2015 and the 2026 data cut-off, tagged against IPC classes centred on H01L and H10D. Filing activity rose through the late 2010s, peaked in 2019, and has since eased back — a pattern consistent with a technology whose core claim space filled early and is now being worked at the margins.

Assignee concentration is moderate rather than extreme: the leading company holds a visible lead, but the field also carries a long tail of single- and few-filing entrants. That combination matters for freedom-to-operate work — the core is claimed, but there is room to find gaps rather than assuming the whole space is blocked.

Filing activity and assignee concentration, 2015–2026
  1. 1SUZHOU ORIENTAL SEMICONDUCTOR CO LTD20
  2. 2DENSO CORP14
  3. 3WOLFSPEED INC14
  4. 4MITSUBISHI ELECTRIC CORP12
  5. 5UNIV OF ELECTRONICS SCI & TECH OF CHINA12
  6. 6ROHM CO LTD12
  7. 7HITACHI ENERGY LTD12
  8. 8ALPHA & OMEGA SEMICONDUCTOR INC11
  9. 9INFINEON TECHNOLOGIES AG11
  10. 10TOYOTA JIDOSHA KK9
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on IGBT Gate Dielectric Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend, technology composition and where applications are filed

Three views of the same 261 records: how filing has moved over time, which IPC subclasses carry the work, and which receiving offices see the most applications.

A 2019 peak followed by a pullback

Filing rose from 14 records in 2017 to a peak of 37 in 2019, then declined; the 2021-to-2024 window is down 33% (18 to 12 records). Because publication lags filing by roughly 18 months, 2025 and 2026 figures are still filling in and should not be read as a continuation of decline.

A 2019 peak followed by a pullback010203040142017201837201920202021202220232024202522026Most recent year is partial — publication lag means later filings are not yet visible.

Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.

H01L dominates; secondary classes are thin

H01L covers 92.7% of the 261 records and H10D covers 41.8%, confirming this is squarely a semiconductor-device filing area. Beyond those two, coverage drops sharply — H10P at 8.8% and H10W at 6.1% — with smaller adjacent classes like H03K, A61K, F02P and G01R appearing in only a handful of records each.

H01L dominates; secondary classes are thinH01L · Semiconductor devices24292.7%H10D · Semiconductor devices (general)10941.8%H10P238.8%H10W166.1%H03K · Pulse technique & logic circui…41.5%A61K · Medicinal preparations20.8%F02P · Ignition systems20.8%G01R · Electric & magnetic measurement10.4%Other10.4%

Shares are the percentage of the 261 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on IGBT Gate Dielectric Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative filing and most-cited prior art

Representative record
TW201526236A2015-07-01

TW201526236A — Semiconductor Device

豐田自動車股份有限公司

This filing, assigned to Toyota, addresses a compact IGBT structure where the diode's forward voltage is designed to resist variation with gate potential. It specifies a trench gate insulating film and gate electrode running along the boundary between an anode region and an upper IGBT structure, with a crystal-defect region extending across the drift region beneath both the cathode and collector regions, sized according to a stated relationship to substrate thickness.Abstract condensed from the original filing for readability.

TW201526236A — patent drawing 1TW201526236A — patent drawing 2
View full record
Most-cited records in this scope
#Publication no.Patent titleCitations
1US20120181575A1Semiconductor Device and a Reverse Conducting IGBT91
2US20080012040A1Semiconductor Devices69
3US20140299915A1Semiconductor device53
4US20110101375A1Power Semiconductor Devices Having Selectively Doped JFET Regions and Related Methods of Forming Such Devices53
5US20100301335A1High Voltage Insulated Gate Bipolar Transistors with Minority Carrier Diverter48
6JP2015118991ASemiconductor device47
7US6417554B1Latch free IGBT with schottky gate47
8JP2014197702AInsulated gate semiconductor device42
9US9275915B2Circuit device having a semiconductor component41
10US20140264433A1Dual-gate trench IGBT with buried floating p-type shield37

Citation counts favour older records that have had more time to accumulate citations inside this corpus; treat them as a signal of influence on the field, not of current filing activity.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on IGBT Gate Dielectric Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

Reading the concentration and composition figures

The ranking and the IPC breakdown point to the same conclusion from two angles: a claimed core surrounded by thinner, more accessible branches.

Concentration
27.6%
of 261 records held by the top 5 assignees

Leadership is real but not dominant

The leading assignee holds 20 records against a fifth-place figure of 12 and a tenth-place figure of 9 — a gradual taper, not a cliff. Combined with 86 ranked companies overall, this points to a field where the leader has an edge in volume but nowhere near a monopoly on claim space.

Top 10 combined: 48.7% of all records
Filing momentum
37 (2019)
peak-year record count

Activity has cooled from its 2019 high

Filing climbed from 14 records in 2017 to 37 in 2019, then eased; the 2021-to-2024 span is down 33%. Given the roughly 18-month lag between filing and publication, the most recent years understate true activity and should not be read as confirmation of a continued slide.

2021: 18 records → 2024: 12 records
Technology mix
8.8%
of records tagged to H10P

Secondary classes are comparatively open

H01L and H10D together anchor the field, appearing in 92.7% and 41.8% of records respectively. H10P and H10W, at 8.8% and 6.1%, carry far less filing weight — these are the branches worth checking first for room to file a distinct claim rather than compete inside the dominant classes.

H10P: 23 records · H10W: 16 records
Geography
85
records filed at the USPTO

Filing is spread across major offices, led by the US and China

The United States leads with 85 records, followed by China at 60 and Japan at 49; Europe, WIPO and India each see smaller but non-trivial volumes. That spread suggests IGBT gate dielectric protection is being pursued as a multi-jurisdiction strategy rather than concentrated in a single home market.

Europe (EPO): 24 · WIPO: 17 · India: 10
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Co-filing is limited and clustered
AssigneeCo-assigneeShared families
Toyota Motor CorporationToyota Central R&D Labs, Inc.5
Wolfspeed, Inc.ZHANG QINGCHUN3
Wolfspeed, Inc.RYU SEI HYUNG2
Toshiba CorporationToshiba Electronic Devices & Storage Corporation2
Toyota Motor CorporationDenso Corporation1
Toyota Motor CorporationShinya Iwasaki1
Toyota Motor CorporationSatoru Kameyama1
Toyota Motor CorporationKAMEYAMA SATORU1

Only 9 co-assignee pairs appear across the dataset, the strongest linking Toyota with its research affiliate on 5 records — a sign that most work here is filed by single entities rather than through joint development.

Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on IGBT Gate Dielectric Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Turning this landscape into a filing decision

The figures above describe where filing has happened. The next step is testing a specific claim idea against that map.

Check freedom-to-operate before drafting

With the top 5 assignees holding 27.6% of the 261 records in scope, a targeted novelty and infringement check against the leading filers costs less than discovering a blocking claim after filing.

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Scope claims toward the thinner IPC branches

H10P and H10W each cover under 9% of records against H01L's 92.7% — a starting point for identifying claim language that sits outside the most crowded subclass.

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Track the leaders' recent filings directly

Assignee concentration is moderate, not absolute; watching the ranked leaders' newest publications is a faster signal than waiting for aggregate trend data to catch up.

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Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on IGBT Gate Dielectric Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about IGBT gate dielectric patents

Answers are grounded in the same dataset. Derived from a Patsnap search on IGBT Gate Dielectric Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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