Immersion Cooling Patent Landscape 2026
Immersion Cooling Patent Landscape in 2026
Immersion cooling is a growth-stage field with 733 patent families in scope, led by a chemistries-and-fluids specialist (Chemours) alongside a cluster of Taiwanese ODMs and infrastructure firms. The field expanded strongly on a multi-year basis — recent-window growth of 119% over the prior period — though annual volume eased from its 2023 peak, with the most recent years further understated by publication lag.
Chemours leads a moderately concentrated field with strong ODM participation
The Chemours Co FC LLC holds the top position with 48 patent families, followed closely by Wiwynn Corp (43) and Munters Corp (39). The top five filers — Chemours, Wiwynn, Munters, Firmus Metal Tech Singapore, and Sumitomo Heavy Industries — together account for 25% of the hundred largest filers’ combined total, signaling moderate rather than extreme concentration.
A clear tier gap separates the top three from ranks four through ten, where family counts range from 18 to 32. Below rank ten, counts drop to the mid-teens, indicating a long tail of smaller participants and new entrants still building their portfolios.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | The Chemours Co FC LLC | 48 | |
| 2 | Wiwynn Corp | 43 | |
| 3 | Munters Corp | 39 | |
| 4 | Firmus Metal Tech Singapore Pte Ltd | 32 | |
| 5 | Sumitomo Heavy Industries Ltd | 30 | |
| 6 | Inventec Corp | 28 | |
| 7 | Fujitsu Ltd | 19 | |
| 8 | Wistron Corp | 18 | |
| 9 | Integra Mission Critical LLC | 18 | |
| 10 | Ebullient Inc | 18 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | IBM Corporation | 16 | |
| 12 | Microsoft Technology Licensing LLC | 16 | |
| 13 | Green Revolution Cooling | 15 | |
| 14 | Daikin Industries Ltd | 14 | |
| 15 | Quanta Computer Inc | 13 | |
| 16 | Inventec Pudong Tech Corporation | 13 | |
| 17 | OVH | 12 | |
| 18 | Samsung Electronics Co Ltd | 12 | |
| 19 | Sunonwealth Electric Machine Industry Co Ltd | 11 | |
| 20 | Amulaire Thermal Technology Inc | 11 |
The leaders’ positions reflect distinct strategic orientations: Chemours anchors in cooling fluids and refrigerants; Wiwynn, Munters, Firmus, and Inventec concentrate on server rack and heat-exchanger hardware; and Sumitomo Heavy Industries occupies a specialized cryogenic niche. This diversity at the top means no single firm controls the full system stack.
Filings from 2024 onward are subject to publication lag and will likely revise upward; treat those years as incomplete rather than indicative of a slowdown. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Multi-year growth remains positive; heat-exchange hardware and PCB assemblies dominate the technology mix
Two views of the corpus — annual filing volume over time and IPC class composition — reveal a field that scaled rapidly from 2017 and is still active, with hardware integration and fluid management as the dominant technical themes.
Annual filing trend
Filings climbed from 8 families in 2017 to a peak of 162 in 2023, a trajectory consistent with a growth-stage field responding to data-center heat-density pressure. The 2024 and 2025 figures (137 and 54 respectively) are materially understated by publication lag and should not be read as a real decline.
↗ Hover for values · click a bar to ask EurekaTechnology composition
F28D (heat-exchange apparatus) and H05K (printed circuits and assemblies) are the two dominant IPC branches, reflecting the dual hardware challenge of moving heat out of boards and chassis. F25B (refrigeration and heat pumps), G06F (digital data processing), and F28F (heat-exchanger details) form a secondary tier, while C09K (materials for miscellaneous applications) captures the cooling-fluid chemistry segment occupied primarily by Chemours.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Liquid immersion cooling system
Inner partitions disposed within a cooling tank have an open space to form arrayed housing parts, and at least one unit of electronic device housed in each of the housing parts. A lifting mechanism includes a tower having a guide and a driving source for raising and lowering an arm, a slide mechanism attached to the cooling tank, and a stopper for… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Microchannel heat sink assembly | 334 |
| 2 | Method of making microchanneled heat exchangers ut… | 279 |
| 3 | Liquid Submerged, Horizontal Computer Server Rack … | 233 |
| 4 | Liquid cooling apparatus and method for cooling bl… | 134 |
| 5 | Coupled, flux transformer heat pipes | 121 |
| 6 | Apparatus and methods for cooling and liquefying a… | 118 |
| 7 | Liquid immersion cooling apparatus for electronic … | 113 |
| 8 | Heat Pipe with Nanostructured Wick | 112 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the competitive structure means for R&D investment decisions
Four structural reads — maturity, concentration, collaboration, and geography — shape where an entrant or incumbent should focus resources.
Growth stage, past its 2023 peak on an annual basis but still expanding on a multi-year view
The lifecycle evidence classifies immersion cooling as a Growth-stage field. Recent three-year filing volume sits 119% above the prior three-year window, confirming genuine multi-year expansion. Annual volume did ease from its 2023 peak of 162 families, but publication lag makes 2024–2025 data incomplete. New entrants continue to appear among the top applicants, indicating the field has not yet consolidated.
Growth StageModerate top-five concentration leaves room for challengers
The top five filers account for 25% of the hundred largest filers’ combined total — meaningful but not dominant. The leader, Chemours, holds 48 patent families versus the second-ranked Wiwynn at 43, a narrow gap that means the top position is not yet entrenched. Below rank five, counts fall into the 18–32 range, creating a competitive mid-tier where targeted filings could alter rankings.
Moderate ConcentrationCo-filing is narrow and concentrated within corporate families
The most active co-filing relationship is between Inventec Corp and Inventec Pudong Tech Corporation, with 13 jointly filed families — effectively an intra-group collaboration. Sumitomo Heavy Industries co-files with Sumitomo SHI Cryogenics of America (3 families) and with Japan’s Defense Agency technical research head (1 family). Firmus Metal Tech Singapore and Firmus Technologies account for 2 joint families. Cross-company, cross-sector collaboration is sparse in this dataset, suggesting that supply-chain partnerships and academic licensing rather than co-filing are the ecosystem’s connective tissue.
Limited Cross-Sector Co-filingUS and Taiwan together account for the plurality of filings; Europe and PCT routes are secondary
The United States leads jurisdiction coverage, followed by Taiwan, Europe (EPO), and WIPO PCT. Japan and India appear as meaningful secondary markets. China, despite being a major data-center market, shows relatively modest patent-record coverage in this corpus, which may reflect filing strategy or search-scope differences. Singapore’s presence reflects Firmus Metal Tech’s home jurisdiction. Entrants targeting global freedom-to-operate should prioritize US, Taiwan, and EPO clearance.
US & Taiwan DominantGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| Inventec Corp | Inventec Pudong Tech Corporation | 13 |
| Sumitomo Heavy Industries Ltd | Sumitomo SHI Cryogenics of America Inc | 3 |
| Firmus Metal Tech Singapore Pte Ltd | Firmus Technologies Pte Ltd | 2 |
| Sumitomo Heavy Industries Ltd | Director General, Technical Research and Development Institute, Japan Defense Agency | 1 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
Chemours anchors in fluids; Wiwynn and Munters lead in hardware integration
The top two ranked applicants illustrate the field’s split between materials/chemistry and system hardware, with both showing strong recent momentum as new entrants to a rapidly scaling corpus.
The Chemours Co FC LLC
Chemours leads with 48 patent families, concentrated in C09K (materials for miscellaneous applications — cooling fluids), F25B (refrigeration and heat pumps), and B29B (plastics preparation). Its momentum trend is stable at +5% recent versus prior, suggesting a maturing but defended position in dielectric fluid chemistry rather than rapid expansion into hardware. Its lead is narrow relative to Wiwynn (43 families), and its focus on fluids means it does not compete directly with ODM hardware filers.
patent families: 48Wiwynn Corp
Wiwynn holds 43 patent families, focused on H05K (printed circuits and assemblies), F28D (heat-exchange apparatus), and G06F (digital data processing) — a classic server-rack hardware stack. Its momentum is classified as a new entrant in the recent window (33 of 43 families filed in the recent period), indicating aggressive, concentrated recent filing activity. As a contract server manufacturer spun off from Wistron, Wiwynn’s rapid build-up reflects hyperscaler customers pulling demand for validated immersion-cooling designs.
patent families: 43| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| The Chemours Co FC LLC | 20 | ▬ +5% |
| Wiwynn Corp | 33 | ▲ new entrant |
| Munters Corp | 35 | ▲ new entrant |
| Firmus Metal Tech Singapore Pte Ltd | 18 | ▲ +38% |
| Sumitomo Heavy Industries Ltd | 18 | ▲ new entrant |
| Inventec Corp | 12 | ▬ 0% |
| Wistron Corp | 14 | ▲ new entrant |
| Integra Mission Critical LLC | 18 | ▲ new entrant |
Under-served branches adjacent to the dominant hardware and fluids core
Several IPC branches appear in the corpus at lower share levels relative to the dominant F28D and H05K classes. These are observations of relative sparsity; where plausible technical value and a realistic entry path exist, they are noted as potentially worth watching.
H01L · Semiconductor Device-Level Thermal Packaging
H01L (semiconductor devices) accounts for 138 patent records — 5% of the IPC distribution — despite chip-level thermal management being a core driver of immersion cooling adoption. The gap between system-level (H05K) and device-level (H01L) filing density suggests that integration of immersion cooling directly into semiconductor packaging, rather than into server enclosures, remains relatively sparse. Firms with both packaging and thermal expertise — or semiconductor companies entering the cooling space — could find this branch worth examining, though the low count may partly reflect different filing classifications by chipmakers.
Search this in Eureka →C09K · Dielectric Cooling Fluid Formulation
C09K (materials for miscellaneous applications) holds 62 patent records — 2% of the IPC distribution — and is currently dominated by Chemours. As regulatory pressure on per- and polyfluoroalkyl substances (PFAS) intensifies, alternative dielectric fluid chemistries (synthetic esters, engineered hydrocarbons, ionic liquids) represent a technically adjacent space with limited incumbent coverage beyond the current leader. Entrants with specialty-chemicals capability may find the PFAS-alternative segment relatively open, though any opportunity assessment would require freedom-to-operate analysis beyond this dataset.
Search this in Eureka →How leaders differ by technology route
Strength of each leader across the main technology routes.
| Player | H05K 7 · Printed circuits & assemblies | F28D 15 · Heat-exchange apparatus | F28D 1 · Heat-exchange apparatus | G06F 1 · Electric digital data processing | H01L 23 · Semiconductor devices |
|---|---|---|---|---|---|
| Wiwynn Corp | Strong · 40 | Absent | Strong · 37 | Moderate · 18 | Absent |
| Munters Corp | Strong · 34 | Strong · 22 | Absent | Absent | Absent |
| Firmus Metal Tech Singapore Pte Ltd | Strong · 26 | Strong · 27 | Absent | Absent | Absent |
| Wistron Corp | Strong · 16 | Absent | Strong · 17 | Moderate · 8 | Absent |
| Daikin Industries Ltd | Strong · 13 | Strong · 14 | Absent | Strong · 13 | Absent |
| Green Revolution Cooling | Strong · 14 | Strong · 13 | Absent | Strong · 11 | Absent |
| Microsoft Technology Licensing LLC | Strong · 16 | Strong · 11 | Absent | Absent | Moderate · 8 |
Frequently asked questions
The corpus covers 733 patent families. This total reflects the scope of the PatSnap Eureka search on immersion cooling and is the baseline against which applicant rankings and trend data are measured.
The Chemours Co FC LLC leads with 48 patent families, concentrated in dielectric fluid chemistry (C09K) and refrigeration (F25B). Wiwynn Corp is second with 43 families, focused on server rack hardware (H05K, F28D).
The field is classified as Growth stage. Recent three-year filing volume is 119% above the prior three-year window, confirming multi-year expansion. Annual volume did ease from a 2023 peak of 162 families, but 2024 and 2025 data are materially understated by publication lag and should not be treated as a real decline.
The United States leads with the highest patent-record count, followed by Taiwan, Europe (EPO), and WIPO PCT. Japan and India are meaningful secondary markets. Firms seeking broad freedom-to-operate should prioritize clearance in the US, Taiwan, and EPO jurisdictions.
F28D (heat-exchange apparatus) and H05K (printed circuits and assemblies) are the two dominant IPC branches, reflecting the dual challenge of chassis-level and board-level heat removal. F25B (refrigeration and heat pumps), G06F (digital data processing), F28F (heat-exchanger details), and H01L (semiconductor devices) form a substantial secondary tier.
Co-filing activity is narrow. The most active co-filing pair is Inventec Corp and Inventec Pudong Tech Corporation, with 13 jointly filed families — an intra-group relationship. Sumitomo Heavy Industries co-files with Sumitomo SHI Cryogenics of America (3 families) and with Japan’s Defense Agency technical research head (1 family). Cross-company collaboration outside of corporate families is limited in this dataset.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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