IPD in RF Modules Patents: Who Leads, Where the Gaps Are 2026
Integrated Passive Devices in RF Modules: Patents, Leaders and Filing Trends
Concentrated at the top. The top 5 assignees hold 147 of 210 records in scope (70.0%), and the top 10 hold 176 (83.8%) — a long tail of single- or double-filing entrants fills the rest of the 42-company ranking. Publications rose to a peak of 6 in 2018 and the tracked growth window narrows sharply after: 2021 sat at 1 and 2024 at 0, a -100% move over that span. Because 2025 and 2026 are still publishing, this should be read as claim space that filled early and has not reopened with a fresh wave, rather than as a technology in active retreat right now.
- 1MITSUBISHI MATERIALS CORP84
- 2INTEL CORP35
- 3STMICROELECTRONICS (TOURS) SAS11
- 4TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD9
- 5SYCHIP8
See the full integrated passive devices in rf modules analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on IPD patents in RF modules
Who holds the most patents in integrated passive devices for RF modules?
The dataset’s leading assignee holds 84 of the 210 records in scope, well ahead of the fifth-place company at 8 and tenth place at 4. The top 5 assignees together account for 147 records, 70.0% of all records, and the top 10 account for 176, or 83.8%. This is a concentrated field: a handful of semiconductor and packaging majors set the baseline, and a long tail of 42 ranked companies in total split the remainder, mostly with one or two filings each.
Is patent filing in this space still growing?
No, not on the evidence available. Filing peaked at 6 records in 2018, and the tracked growth window shows a fall from 1 record in 2021 to 0 in 2024, a -100% change. Because patent publication lags filing by roughly 18 months, the 2025 and 2026 figures are still incomplete and should not be read as either a further decline or a rebound; 2024 is the most recent year solid enough to draw a conclusion from.
What technology areas do these patents actually claim?
H01L, covering semiconductor devices, appears on 74.3% of the 210 records, making it the dominant class by a wide margin. H01G capacitors follow at 32.4% and H10N solid-state devices at 28.1%, with ceramics (C04B), general semiconductor devices (H10D), H10P and H10W each in the high teens, and printed-circuit assembly (H05K) at 15.2%. Because records often carry multiple class tags, these figures add up past 100% and should be read as density across the field, not as mutually exclusive shares.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Integrated Passive Devices in RF Modules covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.