Interposer & Silicon Bridge Patents: Leaders and Filing Trends 2026
Interposer and silicon bridge integration patents: who holds the claims and where the field is still open
51.8% concentration. The top 5 assignees alone account for 1,975 of the 3,812 records in scope — a field where claim space near the leaders is already dense. Annual filings ran from 202 records in 2017 to a peak of 451 in 2023, before easing to 350 by 2024 — the last year the dataset treats as complete. The dip to 49 in 2026 reflects the publication lag rather than a real drop in filing activity.
- 1INTEL CORP27.4%
- 2SEMICON ENERGY LAB CO LTD9.3%
- 3SAMSUNG ELECTRONICS CO LTD7.7%
- 4TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD4.6%
- 5INTERNATIONAL BUSINESS MACHINE CORPORATION2.8%
See the full interposer and silicon bridge integration analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about interposer and silicon bridge patents
Who holds the most patents on silicon interposer technology?
The dataset ranks 100 assignees by record count, and filing activity is heavily concentrated at the top: the leading assignee holds 1,046 records, well ahead of the fifth-place company at 108. The top 5 assignees combined account for 51.8% of all 3,812 records in scope, and the top 10 extend that to 60.8%. Below that tier, record counts drop off quickly, with the 10th-ranked assignee holding only 42 records, so the remaining share is spread thinly across many smaller filers.
Is patent filing activity in interposer and silicon bridge integration slowing down?
Filings rose from 202 records in 2017 to a peak of 451 in 2023, then eased to 350 in 2024 — a -13% change from the 400 records filed in 2021. 2024 is the most recent year the dataset treats as complete, because publication typically lags actual filing by around 18 months. Figures for 2025 and 2026 will fill in over time, so the lower counts shown for those years should not be read as a real decline yet.
What is the difference between a silicon interposer and an embedded silicon bridge in patent claims?
Both terms appear in this dataset’s search scope alongside interposer routing, and both address die-to-die signal routing in advanced packages, but they represent distinct architectural approaches that patent examiners and drafters treat separately. Silicon interposer claims typically center on a full-wafer or full-die substrate layer carrying through silicon vias and redistribution routing beneath multiple dies. Embedded bridge claims instead focus on a smaller silicon element embedded locally within a package substrate to connect adjacent dies, which changes how claims address assembly stack height and coefficient of expansion matching.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Interposer and Silicon Bridge Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.