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Knowledge Graph for Manufacturing SOP — 2026

Knowledge Graph for Manufacturing SOP — 2026
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2026 Patent Landscape

Knowledge Graph for Manufacturing SOP Technology 2026

Patent records spanning 2000–2026 reveal four converging technical clusters — from ontology schema generation to LLM-augmented graph completion — reshaping how manufacturing SOPs are authored and executed. Chinese filings accelerated sharply from 2021, with two records dated 2026.

~35
patent documents retrieved in this dataset
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10+
filings from top assignee (Istari Digital) in this dataset
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2000–2026
coverage span of records in this dataset
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4
core technology clusters identified in this dataset
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Published byPatSnap Insights Team··9 min readVerified by PatSnap Eureka Data
Technology Overview

Semantic Graphs Redefining Manufacturing Procedural Knowledge

Knowledge graphs for manufacturing SOPs occupy the intersection of four technical sub-domains visible in this dataset: ontology-based semantic modelling of process entities, NLP and LLM integration for procedural knowledge extraction, industrial communication standard alignment (OPC UA, AutomationML), and graph completion via embeddings to infer missing procedural links at runtime.

The core mechanism shared across retrieved patents is the construction of a structured graph in which nodes represent process entities — operations, equipment, materials, parameters, and standards — while edges encode semantic relationships such as sequencing, dependency, conformance, and causality. This graph is queried or traversed to generate, validate, or recommend SOPs rather than relying on static paper or PDF documents.

Top Assignees by Filing Count — Knowledge Graph Manufacturing SOP (Dataset Snapshot)
Top assignees by filing count: Istari Digital 10, Siemens 7, IBM 2, Xi’an Jiaotong University 2, Robert Bosch 1Horizontal bar chart showing filing counts per top assignee in the knowledge graph manufacturing SOP dataset snapshot. Source: PatSnap Eureka retrieved records.Istari Digital10Siemens Aktiengesellschaft7IBM2Xi’an Jiaotong University2↗ Click bars to explore

Publication dates in this dataset span from 2000 to 2026, revealing three distinct maturity phases: a foundational phase (2000–2013) establishing networked knowledge for concurrent engineering, a development phase (2014–2021) focused on ontology-driven interoperability, and a convergence phase (2022–2026) in which LLM-augmented knowledge graph construction and graph completion are becoming dominant.

In this dataset, approximately 35 patent documents were retrieved across targeted searches. Istari Digital, Inc. holds the highest filing count in this dataset with at least 10 records, followed by Siemens Aktiengesellschaft with at least 7, reflecting concentrated IP activity around digital engineering ecosystems and ontology-driven program generation respectively.

PatSnap Eureka Data derived from targeted patent searches in PatSnap Eureka; approximately 35 records retrieved — not a comprehensive industry census.Explore the data ↗
Patent Analytics

Filing Trends and Technology Cluster Distribution

Analysis of the retrieved records reveals filing concentration across four technology clusters and a notable geographic shift toward CN-jurisdiction filings from 2021 onward, with US filings remaining the largest single jurisdiction in this dataset.

Jurisdiction Distribution — Knowledge Graph SOP Patents (Dataset Snapshot)

In this dataset, US-jurisdiction filings account for approximately 18 of ~35 retrieved records, making it the dominant jurisdiction, followed by CN with ~8 and EP with ~3.

Jurisdiction distribution: US 18, CN 8, EP 3, KR 3, JP 2, DE 1Horizontal bar chart showing patent record counts by jurisdiction in the knowledge graph manufacturing SOP dataset snapshot. Source: PatSnap Eureka retrieved records.United States (US)18China (CN)8EP / KR (3 each)3Japan (JP)2DE / ES / MX (1 each)1↗ Click bars to explore

Technology Cluster Patent Count — Knowledge Graph SOP (Dataset Snapshot)

In this dataset, Cluster 3 (Knowledge Graph Construction, Completion & LLM Integration) and Cluster 2 (Ontology Schema & Program Automation) hold the highest patent counts, reflecting concentrated recent filing activity in LLM-graph hybrid approaches.

Technology cluster distribution: Cluster 3 LLM+KG 6 patents, Cluster 2 Ontology Programs 5, Cluster 4 IT/OT 3, Cluster 1 NLP Workflow 3Horizontal bar chart showing patent record counts by technology cluster in the knowledge graph manufacturing SOP dataset snapshot. Source: PatSnap Eureka retrieved records.C3: KG Construction & LLM6C2: Ontology & Program Automation5C4: IT/OT Tech Management3C1: NLP Workflow Extraction3↗ Click bars to explore
PatSnap Eureka Cluster patent counts are approximate groupings based on retrieved records in PatSnap Eureka; they do not represent a full industry census.Explore the data ↗
Application Domains

Where Knowledge Graph SOP Technology Is Being Deployed

Retrieved patent and literature records identify five application domains where knowledge graph-based SOP technology is being actively developed and deployed, spanning shop floor maintenance, aerospace, process industries, digital engineering certification, and industrial communication standards.

Human-Machine-Object KG · OPC UA

Shop Floor Operations & Maintenance

Yokogawa Electric’s 2013 US patent digitises paper-based task procedures for field operators of industrial plant assets. Chongqing University’s 2023 CN patent constructs a ternary fusion knowledge graph integrating human expertise (operation manuals, maintenance handbooks), machine-sensed data, and physical IoT data to support SOP-driven operational maintenance decisions on production lines.

In-situ Operations
MBSE · Digital Engineering · V&V

Aerospace & Defense Manufacturing

Boeing’s 2012 US patent integrates engineering definition, process specification standards, and work instructions as a single authoritative reusable dataset. Istari Digital’s patent family (US, 2023–2025; WO, 2024) covers an interconnected digital engineering and certification ecosystem for regulated aerospace and defense industries, automating V&V requirement checking without human input.

Digital Engineering
Flow-Diagram Planning · Semantic Config

Process Industry & Energy

Siemens’ 2021 US patent applies automated configuration planning for process plants (chemical, energy) using flow-diagram-encoded requirements and archive-based standard planning solutions, with a CN equivalent filed in 2023. General Electric’s 2013 US patent applies semantic modelling for workscope recommendation for industrial gas turbines, representing early knowledge-graph-adjacent SOP automation in the energy sector.

Process Automation
OPC UA · AutomationML · LLM

Industrial Communication Standards

The Korea Electronics Technology Institute’s 2020 KR patent covers advanced operation methods for industrial process equipment using AutomationML-to-OPC UA standard conversion. Chongqing University of Posts and Telecommunications’ 2026 CN patent builds a layered industrial knowledge graph with a RAG pipeline to automatically convert unstructured procedural text into standardized OPC UA XML models deployable on production systems.

Machine Communication
PatSnap Eureka Application domain examples are drawn from patent records retrieved in PatSnap Eureka; coverage is limited to the retrieved dataset.Explore insights ↗
Key Assignees

Leading Patent Assignees in Knowledge Graph Manufacturing SOP — Dataset Snapshot

In this dataset, Istari Digital, Inc. holds the highest filing count with at least 10 records (US and WO, 2023–2025), and Siemens Aktiengesellschaft follows with at least 7 records in retrieved records spanning US, EP, CN, and MX jurisdictions from 2007 to 2025. Multiple industrial giants and Chinese university assignees also appear, indicating a contested technology space.

Top Assignees by Filing Count in Retrieved Records (Dataset Snapshot)

Top assignees by filing count: Istari Digital 10, Siemens Aktiengesellschaft 7, IBM 2, Xi’an Jiaotong University 2, Robert Bosch GmbH 1Horizontal bar chart of top assignees by filing count in the knowledge graph manufacturing SOP dataset snapshot.Istari Digital, Inc.10Siemens Aktiengesellschaft7International Business Machines2Xi’an Jiaotong University2Robert Bosch GmbH1↗ Click bars to explore
Digital Engineering Ecosystem · MBSE · V&V Automation

Istari Digital, Inc.

Istari Digital holds the highest filing count in this dataset with at least 10 patent records covering the interconnected digital engineering and certification ecosystem (US and WO, 2023–2025). Their portfolio spans model-based systems engineering (MBSE) tools, simulation engines, CAD/PLM/supply chain integration, and automated verification and validation (V&V) of SOP and engineering requirements without human input — targeting regulated aerospace and defense manufacturing. Active and pending filings appear across US (2023, 2024, 2025) and WO (2024) jurisdictions.

United States
Ontology Schema Generation · Process Planning · Requirements KG

Siemens Aktiengesellschaft

Siemens holds at least 7 patent records in retrieved records spanning US, EP, CN, MX, and DE jurisdictions from 2007 to 2025, making it the most geographically distributed portfolio in this dataset. Key technology areas include ontology schema generation for engineering program automation (US 2022, EP 2022, US 2025), automated process system planning for chemical and energy plants (US 2021, US 2023), computer-implemented design knowledge graphs for requirement completeness (EP 2025), and early industrial plant documentation interlinking (MX 2007). This portfolio spans the full SOP lifecycle from requirements through execution.

Germany — DE
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Additional named assignees in this dataset include Robert Bosch GmbH (DE, 2025 graph completion), IBM (US, 2022 NLP workflow), Mitsubishi Electric (US, 2021–2023), Chongqing University institutions (CN, 2023–2026), and Boeing (US, 2012). Access the full dataset breakdown in PatSnap Eureka.
Robert Bosch GmbH filings Chinese university accelerating CN filings + more
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PatSnap Eureka Assignee filing counts are derived from approximately 35 patent records retrieved in PatSnap Eureka and represent a dataset snapshot only.Explore players ↗
Emerging Directions

Frontier Technologies Shaping SOP Knowledge Graphs in 2026

Five clear emerging directions are visible in records dated 2023–2026 in this dataset, centered on LLM-graph hybrid architectures, embedding-based graph completion, OPC UA auto-construction, and automated V&V ecosystems.

LLM + Knowledge Graph Hybrid Architectures for SOP Generation

The 2026 filings from Chongqing University of Posts and Telecommunications (OPC UA auto-construction) and Beijing Institute of Mechanical Science National Innovation (MBSE-based concept design) explicitly integrate Retrieval-Augmented Generation (RAG), large language models, and knowledge graphs. This architecture — where the knowledge graph provides verified, structured procedural knowledge and the LLM provides natural language parsing and generation — represents the frontier for automated SOP authoring at scale. These are the most recent filed records in this dataset.

Graph Completion and Embedding-Based SOP Inference

Robert Bosch’s 2025 DE patent on completing a manufacturing knowledge graph via entity, attribute, and relationship embeddings signals a shift from static SOP encoding to dynamic graph inference. Missing process steps or relationships can be inferred from the graph’s learned embedding space, enabling adaptive procedural reasoning without manual graph maintenance. This approach specifically targets the graph maintenance problem that limits practical deployment of manufacturing knowledge graphs.

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The fifth emerging direction — Istari Digital’s automated digital engineering ecosystem for human-input-free V&V — covers the most advanced pending filings (WO 2024, US 2025) in this dataset and is expanding into regulated aerospace and defense manufacturing.
Automated V&V ecosystemDigital engineering SOP chains+ more
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PatSnap Eureka Emerging directions are derived from patent records dated 2023–2026 in the PatSnap Eureka retrieved dataset.Explore emerging trends ↗
Technology Comparison

Ontology-Driven SOP Automation vs. LLM-Augmented Knowledge Graph Approaches

Click any row to explore further.

DimensionOntology-Driven SOP AutomationLLM-Augmented Knowledge Graph
Primary MechanismOntology schemas encoding relationships between programming blocks, variables, and KPIs; machine-executable engineering programs generated from schemaLarge language models (LLMs) combined with knowledge graphs and Retrieval-Augmented Generation (RAG) to parse unstructured procedural text and generate structured SOP representations
Key Patent ExampleSiemens — Method and system for generating engineering programs for an industrial domain (US, 2022; EP, 2022; US, 2025)Chongqing Univ. of Posts and Telecom — OPC UA information model auto-construction using knowledge graph and LLMs (CN, 2026)
Input RequirementsPre-defined ontology schema; structured KPI definitions; existing programming block libraryUnstructured procedural text documents; device ontology layer; semantic knowledge layer; RAG pipeline configuration
OutputMachine-executable engineering programs for technical installations; automated configuration of industrial systemsStandardized OPC UA XML models deployable on production systems; SysML models auto-generated from complex design requirements
Filing JurisdictionsUS, EP (Siemens multi-jurisdiction portfolio spanning MX, CN, DE)CN primary (2026 filings); DE for graph completion variant (Bosch, 2025)
Maturity PhaseDevelopment Phase (2014–2021) through Convergence Phase (2022–2025); Siemens patents active from 2022 onwardConvergence Phase (2022–2026); most recent records in this dataset (2026)
Key Limitation AddressedHuman bottleneck in engineering program authoring; interoperability across manufacturing system layersInability to process unstructured procedural documents; missing procedural links inferred via graph embeddings
Representative AssigneesSiemens Aktiengesellschaft (Germany/US/EP)Chongqing Univ. of Posts and Telecom (CN); Beijing Inst. of Mechanical Science (CN); Robert Bosch GmbH (DE)
PatSnap Eureka Comparison is based on patent records retrieved in PatSnap Eureka; it reflects dataset coverage only and is not a comprehensive technology assessment.Compare in Eureka ↗
Frequently asked questions

Frequently Asked Questions — Knowledge Graph for Manufacturing SOP

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Data and insights on this page are based on a limited patent and literature dataset and are for reference only. Figures may not represent the complete technology landscape.

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