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Laser Beam-Shaping Metasurface Patent Snapshot

Laser Beam-Shaping Metasurface Patent Snapshot
Evidence Snapshot
Laser Beam-Shaping Metasurface Patent Snapshot in 2026

The laser beam-shaping metasurface patent space is small but concentrated, with SOS LAB Co., Ltd. holding the largest position and the top five filers collectively dominating the hundred-largest filers’ combined share. Activity has plateaued near its filing peak, suggesting the field is transitioning from early growth toward consolidation, with LiDAR sensing as the primary application driver.

32
Patent families in scope
47%
Top visible applicants share
+8%
3-yr filing growth (lag-adj.)
United States
Leading jurisdiction
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Published byPatSnap Insights Team··6 min readVerified by PatSnap Eureka data
Overview

SOS LAB leads a concentrated, still-maturing field

SOS LAB Co., Ltd. holds the top position with 6 patent families, followed by Meta Platforms Technologies LLC and Beijing University of Technology, each with 3 patent families. The field’s overall corpus stands at 32 patent families.

The top five filers account for 47% of the ranked applicants visible in this query’ combined total — a high concentration ratio for a corpus of this size, signalling that a small group of organizations has staked out most of the structured claiming activity so far.

Leading applicants
#ApplicantPatent familiesShare
1SOS LAB Co., Ltd.6
2Meta Platforms Technologies LLC3
3Beijing University of Technology3
4Zhejiang Eagle Semiconductor Technology Co., Ltd.2
5Bosch Car Multimedia Portugal SA2
6AMS OSRAM International GmbH2
7University of Minho2
8Zhejiang Berxel Photonics Co., Ltd.1
9Apple Inc.1
10Materion Corporation1
#ApplicantPatent familiesShare
11Semicon Devices (an Elbit Systems–Rafael Partnership)1
12University of Massachusetts1
13Hangzhou Najing Technology Co., Ltd.1
14Chen Wei-Ting1
15Lumentum Operations LLC1
16CTRL-Labs Corporation1
17Neurophos LLC1
18Tianfu Xinglonghu Laboratory1
19Nichia Corporation1
20Shenzhen Berxel Photonics Co., Ltd.1
↗ Hover a row · click a company to ask Eureka

SOS LAB’s emphasis on LiDAR positioning (G01S) alongside optical-element design (G02B) suggests that sensing-system integration, rather than pure photonics research, is the visible commercial motive among leaders. Meta Platforms Technologies and Beijing University of Technology anchor a second tier with laser and optical-system coverage.

Filing counts for 2024 and 2025 should be treated as provisional; patent applications typically take 18–24 months from filing to public disclosure, so recent totals will rise as publications catch up. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope.Explore deeper in Eureka →
Trends & Structure

Filing activity plateaued after a 2019 surge; LiDAR and optics dominate the technology mix

Two charts frame the field’s trajectory: annual filing volume since 2017 and the distribution of IPC technology classes across the corpus.

Annual filing trend

Filing activity jumped sharply in 2019 (8 families), then eased to low single digits through 2022, before recovering to 5–7 families per year in 2023–2025. The lifecycle evidence indicates annual volume has plateaued near its peak rather than continuing to climb. Data for 2024–2025 remain subject to publication lag and will likely revise upward.

Annual filing trendAnnual values from 2017 to 2026, peaking at 8 in 2019.02017020188201922020220211202252023720247202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

H01S (Lasers and stimulated emission) and G02B (Optical elements and systems) are the two visible IPC classes, reflecting the field’s foundation in laser-source engineering and beam-manipulating optic design. G01S (Radar, sonar, and positioning — principally LiDAR) ranks third, confirming that autonomous-sensing applications are the primary end-use context. F21K (LED and non-electric light sources), G06F (digital data processing), and several metrology and navigation classes appear at lower counts, pointing to adjacent but underserved application areas.

Technology compositionH01S · Lasers & stimulated emission leads with 27; G02B · Optical elements & systems 24.H01S · Lasers & stimulat…27G02B · Optical elements …24G01S · Radar, sonar & po…10F21K · Light sources (no…6G06F · Electric digital …3F21Y · Light-source form…2G01B · Measuring length …2G01C · Distance, navigat…2↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20250164669A1Published 2025-05-22

Laser diode beam correction, combining, and coupli…

University Of Massachusetts

The present disclosure provides systems and methods for coupling light in imaging systems. One such system comprises a metalens doublet structure having a first substrate; a first metalens structure provided at a surface of the first substrate and comprising a plurality of first scatterers; and a second metalens structure provided at a second substrate or… (excerpt from the patent abstract)

Laser diode beam correction, combining, and coupli… — patent drawingLaser diode beam correction, combining, and coupli… — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1Lidar device26
2Lidar device13
3LiDAR device9
4Lidar device8
5底部发射垂直腔面发射激光器8
6一种集成BIC超构表面激光器的折射率传感芯片2
7Laser diode beam correction, combining, and coupli…2
8Programmable Structured Light Generator, Photoelec…1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · SOS LAB Co., Ltd.

SOS LAB Co., Ltd.

SOS LAB Co., Ltd. holds 6 patent families — the largest position in the corpus — with technology emphasis concentrated in G01S (LiDAR radar and positioning, subclasses 17 and 7) and G02B (optical elements). The applicant momentum data flags SOS LAB as a new entrant in the recent filing window, indicating its portfolio was built rapidly rather than accumulated over many years. This suggests an IP-first commercialization strategy timed to the LiDAR market’s growth.

families: 6
Challenger · Meta Platforms Technologies LLC

Meta Platforms Technologies LLC

Meta Platforms Technologies LLC holds 3 patent families, with focus spread across F21K (LED light sources), G02B (optical elements, subclass 27), and H01S (lasers). This mix points to AR/VR headset illumination and structured-light applications rather than automotive sensing. No momentum trend entry appears for Meta in the recent-window data, suggesting its filing activity predates the most recent period tracked.

families: 3
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Beijing University of TechnologyAMS OSRAM International GmbH+ more
Unlock full assignee analysis →
Source: PatSnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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