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Laser Diode Epi/Wafer Scale-Up Patent Snapshot 2026

Laser Diode Epi/Wafer Scale-Up Patent Snapshot 2026
Evidence Snapshot
Laser Diode Epi/Wafer Scale-Up Patent Snapshot in 2026

The laser diode epitaxial and wafer scale-up space is dominated by Japanese electronics majors, with NEC Corp holding the top position among the hundred largest filers. Filing activity peaked in 2019 and has since eased, placing the field in a decline phase with Japan remaining the primary jurisdiction by a wide margin.

38
Patent families in scope
43%
Top visible applicants share
-56%
3-yr filing growth (lag-adj.)
Japan
Leading jurisdiction
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Published byPatsnap Insights Team··7 min readVerified by Patsnap Eureka data
Overview

Japanese incumbents command a concentrated field

NEC Corp leads all filers with 110 patent records, followed closely by Toshiba at 88 and Panasonic Holdings at 72. The top five applicants together account for 43% of the combined total across the ranked applicants visible in this query, signaling a moderately concentrated visible assignee structure.

The lead is meaningful but not insurmountable: the gap between first-ranked NEC Corp and fifth-ranked Hitachi is roughly two-to-one, and a second tier of Japanese firms — Mitsubishi Electric, Ricoh, Fujitsu, Rohm, and Furukawa Electric — clusters between 25 and 50 patent records each, maintaining competitive relevance.

Leading applicants
#ApplicantPatent recordsShare
1NEC Corporation110
2Toshiba Corporation88
3Panasonic Holdings Corporation72
4Sharp Corporation60
5Hitachi, Ltd.59
6Mitsubishi Electric Corporation50
7Ricoh Company, Ltd.32
8Fujitsu Limited29
9Rohm Co., Ltd.27
10Furukawa Electric Co., Ltd.25
#ApplicantPatent recordsShare
11Sony Group Corporation23
12Sanyo Electric Co., Ltd.17
13II-VI Delaware Inc.16
14NIPPON TELEGRAPH & TELEPHONE CORP13
15Nichia Corporation13
16Canon Inc.12
17Fujifilm Business Innovation Corp.10
18Seiko Epson Corporation9
19ELECTRONICS & TELECOMM RES INST9
20Samsung Electronics Co., Ltd.8
↗ Hover a row · click a company to ask Eureka

The incumbents’ entrenched positions imply that core laser-diode epitaxy and wafer-process claims are well-covered. New entrants or challengers are more likely to find traction in adjacent or application-specific sub-classes rather than competing head-on in the visible H01S branch.

Patent publication typically lags filing by 18 to 24 months, so activity from 2024 onward is under-represented in this corpus and should not be interpreted as an absence of current R&D. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

A 2019 peak followed by a sustained pullback, with laser emission firmly dominant

Two charts together reveal both the temporal arc of innovation activity and the technical concentration of the field across IPC branches.

Annual filing trend

Annual filings rose sharply to a peak of 11 records in 2019, then declined steadily through 2023 and have registered near-zero counts in 2024–2026. The recent-window growth of -56% confirms this is a genuine structural pullback from the 2019 high, not a publication-lag artifact — though the 2024–2026 bars will fill in partially as pending applications publish.

Annual filing trendAnnual values from 2017 to 2026, peaking at 11 in 2019.120171201811201972020720215202252023120240202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

H01S (Lasers and stimulated emission) is visible in the IPC mix with 980 patent records, followed by H01L (Semiconductor devices) at 210 and G02B (Optical elements and systems) at 116. The steep falloff beyond the top two classes illustrates how tightly the corpus is anchored in core laser physics and semiconductor process, with optical integration and data-storage branches occupying a secondary tier.

Technology compositionH01S · Lasers & stimulated emission leads with 980; H01L · Semiconductor devices 210.H01S · Lasers & stimulat…980H01L · Semiconductor dev…210G02B · Optical elements …116G11B · Information stora…52H10P52G02F · Optical control &…22H04B · Transmission (gen…20H04N · Pictorial communi…10↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20040008746A1Published 2004-01-15

High power semiconductor laser diode and method fo…

II-VI DELAWARE, INC.

Semiconductor laser diodes, particularly high power ridge waveguide laser diodes, are often used in opto-electronics as so-called pump laser diodes for fiber amplifiers in optical communication lines. To provide the desired high power output and stability of such a laser diode and avoid degradation during use, the present invention concerns an improved… (excerpt from the patent abstract)

High power semiconductor laser diode and method fo… — patent drawingHigh power semiconductor laser diode and method fo… — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1Laser diode/lens assembly247
2Method of manufacturing a nitride semiconductor la…223
3Assembly structure for an optical integrated circu…179
4Optimized laser energy conversion through automati…139
5Fiber grating coupled light source capable of tuna…128
6High brightness, vertical cavity semiconductor las…125
7Coupled cavity high power semiconductor laser118
8Nitride semiconductor laser and method of fabricat…109

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · NEC Corp

NEC Corp

NEC Corp holds 110 patent records, the largest position in the corpus. Its technology emphasis is concentrated in H01S 5 (semiconductor laser devices within the stimulated-emission class) at 114 records, with H01L 21 (semiconductor fabrication processes) as a secondary focus at 18 records, and H10P 14 contributing a smaller third pillar. This broad coverage of both the laser physics and the underlying semiconductor process suggests NEC built an integrated IP position spanning device design through wafer-level manufacturing.

patent records: 110
Challenger · Toshiba

Toshiba

Toshiba follows with 88 patent records and mirrors NEC’s structural emphasis: H01S 5 at 87 records is its visible class, with H01L 21 at 12 and H01L 27 (integrated semiconductor circuits) at 6 records rounding out its profile. The near-complete overlap of Toshiba’s technical focus with NEC’s indicates that the two leaders competed directly across the same core claim space, with Toshiba also showing some interest in integrated-circuit-level semiconductor architectures.

patent records: 88
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Panasonic Holdings CorpSharp KK+ more
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Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
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Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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