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Laser Diode Wafer Test & Binning Patent Snapshot

Laser Diode Wafer Test & Binning Patent Snapshot
Evidence Snapshot
Laser Diode Wafer Test & Binning Patent Snapshot in 2026

The laser diode wafer test and binning patent space is a nascent, tightly contested field with 6 patent families in scope and a highly fragmented applicant structure at the top. Filing activity is in a growth stage, with the United States as the dominant jurisdiction and H01S (Lasers & stimulated emission) accounting for the overwhelming share of technical coverage.

6
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
United States
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

A nascent field with a flat-top ranking and US-centric filing

No single applicant has pulled ahead: Ricoh, NeoPhotonics, Jabil, Cutting Edge Optronics, TRW, and Furukawa Electric each hold the top position with identical patent-record counts, signalling that competitive differentiation through patent volume alone is not yet a meaningful lever.

The top five filers account for 25% of the ranked applicants visible in this query’ combined total, indicating a highly fragmented field rather than a concentrated oligopoly. There is no meaningful tier gap at the top; the ranking is essentially flat across the leading names.

Leading applicants
#ApplicantPatent recordsShare
1Ricoh Co Ltd5
2NeoPhotonics Corporation5
3Jabil Inc5
4Cutting Edge Optronics5
5TRW Inc5
6Furukawa Electric Co Ltd5
7Polaroid Corporation4
8Yama Capital LLC4
9Sony Group Corporation4
10Renishaw plc3
#ApplicantPatent recordsShare
11Canon Inc3
12Laserfront Technologies3
13Rohm Co Ltd3
14Thorlabs Quantum Electronics Inc2
15Fujitsu Ltd2
16NECSEL Intellectual Property Inc2
17Panasonic Holdings Corporation2
18TSUNAMI PHOTONICS LIMITED B & D CENTURY COURT 100 …2
19Novalux Acquisition Corp2
20Sharp Fukuyama Laser Co Ltd2
↗ Hover a row · click a company to ask Eureka

This flat-top structure suggests that the field is early-stage and that no incumbent has yet established a visible IP position. For an R&D team, this implies that a focused, well-scoped filing program could establish a defensible position relatively quickly.

The most recent 18–24 months of filing data are subject to publication lag and are likely under-counted; apparent activity in 20242025 should be read as a minimum, not a ceiling. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Growing activity concentrated in laser physics, with sparse test-specific coverage

The annual filing trend reveals sparse but accelerating activity, while the technology composition chart exposes a large gap between the core laser physics branch and the dedicated testing and measurement branches.

Annual filing trend

Filing volume was minimal from 2017 through 2022 (at most one record per year), then picked up in 2024. The lifecycle evidence classifies the field as Growth, with annual filings still rising; 2024–2025 figures are understated by publication lag and should be treated as a floor.

Annual filing trendAnnual values from 2017 to 2026, peaking at 2 in 2024.02017120180201912020020211202202023220241202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

H01S (Lasers & stimulated emission) is visible in the branch mix, reflecting that most patents address laser device performance rather than dedicated wafer test or binning methodology. H01L (Semiconductor devices) is the second branch, followed at much lower frequency by G01M (Testing machine & structure balance), G01N (Material analysis & testing), and G01R (Electric & magnetic measurement) — the branches most directly relevant to test and binning workflows.

Technology compositionH01S · Lasers & stimulated emission leads with 92; H01L · Semiconductor devices 17.H01S · Lasers & stimulat…92H01L · Semiconductor dev…17G01M · Testing machine &…6G01N · Material analysis…6H10P5H10W4G01R · Electric & magnet…3G02B · Optical elements …3↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
WO2010113066A1Published 2010-10-07

A method of monitoring the performance of a semico…

Koninklijke Philips Electronics N.V.

The invention describes a method of monitoring the performance of a semiconductor laser diode arrangement (10) comprising at least one semiconductor laser diode module (11) comprising a plurality of semiconductor laser diodes (D), which method comprises the steps of driving a semiconductor laser diode module (11) at a specific current value, monitoring the… (excerpt from the patent abstract)

A method of monitoring the performance of a semico… — patent drawingA method of monitoring the performance of a semico… — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1Smart laser diode array assembly and operating met…113
2Light source apparatus and optical communication m…100
3Surface-emission laser diode operable in the wavel…89
4Surface-emission laser diode operable in the wavel…64
5Tap output collimator63
6Surface-emission laser diode operable in the wavel…62
7Semiconductor laser control apparatus and image fo…36
8Smart laser diode array assembly35

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Ricoh Co Ltd

Ricoh Co Ltd

Ricoh’s patent-record portfolio in this space concentrates on H01S 5 (semiconductor lasers and stimulated emission) with secondary coverage in optical elements (G02B 6) and a single record in H01S 3. This reflects a laser-performance orientation rather than dedicated wafer test methodology. Applicant momentum data is not available in evidence for trajectory assessment.

patent records: 5
Challenger · Cutting Edge Optronics

Cutting Edge Optronics

Cutting Edge Optronics holds coverage across both H01S 3 and H01S 5, the two sub-classes of the laser physics branch, making it one of the broadest technically scoped filers at the top tier. Like Ricoh, its records are oriented toward laser device performance. Applicant momentum data is not available in evidence.

patent records: 5
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
NeoPhotonics CorpFurukawa Electric Co Ltd+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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