Laser Induced Plasma Micro Machining Patents 2026
Laser Induced Plasma Micromachining Patents 2026
LIPMM harnesses plasma at a pulsed laser’s focal point within a dielectric fluid to machine materials at micro- and nanoscale with reduced heat-affected zones. From Caterpillar’s 2004 gas-phase filings to MIT’s 2024 melt-ejection patents, the field spans two decades of IP.
What Is Laser Induced Plasma Micromachining?
Laser Induced Plasma Micromachining (LIPMM) is a non-contact precision process that focuses a pulsed laser into a dielectric fluid, generating a localized plasma whose mechanical shock and thermochemical action removes material from an adjacent workpiece. The result is dramatically reduced heat-affected zones compared to conventional laser ablation, making it well suited for hard and brittle materials.
The core LIPMM architecture, as described across multiple Northwestern University patents in this dataset, consistently involves five elements: a dielectric fluid supply device, a pulsed laser emitter, a processor-controlled delivery system, a focal-point plasma generation zone, and a workpiece positioned at the plasma boundary. The dielectric fluid serves the dual role of plasma confinement medium and coolant.
Beyond the canonical dielectric-fluid configuration, this dataset identifies several evolving sub-domains: gas-phase LIPMM using ambient atmosphere plasma (Caterpillar Inc.), magnetically controlled MC-LIPMM with external magnetic field shaping (Chinese Academy of Sciences, 2021), overflow-water-assisted femtosecond OF-LIPMM for microchannel fabrication (2023 literature), and laser-induced plasma soft X-ray machining achieving lateral resolution exceeding 100 nm on quartz substrates.
In this dataset, 7 distinct patent assignees file across 3 jurisdictions — US, EP, and CN. Northwestern University and Caterpillar Inc. each hold 3 filings in retrieved records, while MIT, Beihang University, and Purdue Research Foundation each contribute 2 active filings in this dataset. China has emerged as the most active recent filing jurisdiction, with active CN patents from 2021–2025.
Filing Trends and Technology Cluster Distribution
The LIPMM patent dataset spans two decades from 2004 to 2025, with a clear generational structure: early Caterpillar gas-phase filings, a Northwestern University dielectric-fluid consolidation phase, and a recent surge of active Chinese institution and MIT filings.
LIPMM Patents by Technology Cluster (Dataset Snapshot)
Dielectric-fluid plasma confinement accounts for the largest single cluster in this dataset with 3 filings, followed by gas-phase ambient plasma (3) and hybrid/enhanced configurations (3), while LAMPE melt-ejection represents the most recent frontier with 2 active filings in retrieved records.
↗ Click bars to exploreLIPMM Filing Activity by Generational Phase (Dataset Snapshot)
In this dataset, filing activity clusters into three generational phases: 3 filings in the 2004–2008 foundational phase (Caterpillar), 5 filings in the 2011–2016 academic consolidation phase, and 7 filings in the 2020–2025 refinement and hybridization phase — indicating accelerating recent activity in retrieved records.
↗ Click bars to exploreKey Application Domains for LIPMM Technology
LIPMM and adjacent plasma micromachining patents in this dataset address four principal application areas: MEMS/semiconductor fabrication, biomedical implant surface preparation, automotive and industrial components, and microfluidics. Each domain is represented by named institutional filings and literature studies.
MEMS and Semiconductor Fabrication
Northwestern University’s LIPMM patents explicitly address hard and brittle material machining including single-crystal silicon relevant to solid-state electronics. MIT’s 2024 LAMPE patents are designed for MEMS laminate stack fabrication combining melt-ejection with electro-polishing burr removal. The Corporation for National Research Initiatives’ multi-tool system (2011–2014, US) covers MEMS, NEMS, photonics, and 3D integration across nanometer-to-millimeter dimensions.
Semiconductor / MEMSBiomedical Implant Surface Preparation
Beihang University (Beijing University of Aeronautics and Astronautics) filed two patents in 2021 and 2023 (CN jurisdiction) describing a laser system that combines polishing and micro-structuring of additively manufactured metal bone implants in a single system. The system uses ns/fs pulse switching and multi-physics online monitoring for functional surface preparation. Both patents are listed as active in retrieved records.
Biomedical DevicesAutomotive and Industrial Components
Caterpillar Inc.’s earliest filings (2004–2005, US; 2004–2008, EP) target hard material machining in ambient industrial environments using sub-picosecond pulses (≤1 ps, ≥50–100 µJ) consistent with fuel injector nozzles and engine components requiring sub-millimeter feature resolution. Purdue Research Foundation’s laser-assisted micro-milling system (2014, US) targets ceramics, high-temperature alloys, and composites common in aerospace and heavy industry. All Caterpillar patents in this dataset are currently inactive.
Industrial ManufacturingMicrofluidics and Lab-on-Chip
A 2023 literature study on overflow-water-assisted femtosecond LIPMM (OF-LIPMM) demonstrated that dynamic liquid flow produces measurably better HAZ suppression, higher aspect ratios, and more uniform microchannels versus static-water and direct-writing methods. Literature in this dataset also references plasma-assisted laser processing as a rapid prototyping tool for polymeric microfluidic channels, noting solutions via solvent bonding for surface defect challenges. This domain is growing as point-of-care diagnostics demand faster microfabrication cycles.
MicrofluidicsKey Patent Assignees in LIPMM — Retrieved Records Snapshot
In retrieved records, Northwestern University and Caterpillar Inc. each hold 3 filings, representing the two largest filing counts in this dataset. Recent active filings are concentrated among MIT, Beihang University, and the Chinese Academy of Sciences, signaling a geographic shift toward US academic and Chinese institutional filers in this dataset.
LIPMM Patent Filings by Assignee in Retrieved Records (Dataset Snapshot)
↗ Click bars to exploreNorthwestern University
Northwestern University holds 3 LIPMM filings in this dataset spanning 2015–2020 (US jurisdiction), all covering the dielectric-fluid-immersion architecture with a five-element system including plasma confinement and processor-controlled delivery. One 2016 filing acknowledges NSF support (award CMMI-0969776) and Korea’s KIMM institute co-development. The 2020 US continuation patent is the only active dielectric-fluid LIPMM system patent in this dataset; the 2015 and 2016 filings are listed as inactive.
United StatesMassachusetts Institute of Technology
MIT holds 2 active filings in this dataset from 2024, covering both US and CA jurisdictions, describing the Laser-Assisted Material Phase-Change and Expulsion (LAMPE) micromachining process. LAMPE tunes pulsed laser parameters to melt rather than vaporize material, ejects liquid-phase material, and integrates electro-polishing for burr removal with MEMS multi-lamina stack assembly (MALL process). Both 2024 patents are listed as active in retrieved records, representing the most recent frontier IP in this dataset.
United States — US / Canada — CAFour Convergent Directions in LIPMM Innovation (2021–2025)
The most recent filings and literature in this dataset (2021–2025) signal four convergent directions for LIPMM: magnetic field plasma control, overflow-water dynamic media, melt-ejection phase-change machining, and coaxial real-time process monitoring.
Magnetic Field Plasma Control (MC-LIPMM)
The 2021 Chinese Academy of Sciences patent introduces a rotating machining head with integrated magnetic-field shaping to improve plasma stability and control bubble behavior during LIPMM of silicon substrates. A 2021 academic study on single-crystal silicon supports this approach, demonstrating improved surface integrity and geometrical consistency. This MC-LIPMM direction is likely to advance into multi-material hard substrate machining applications.
Overflow-Water Dynamic Media (OF-LIPMM)
A 2023 literature study demonstrates that dynamic overflow-water conditions during femtosecond LIPMM produce measurably superior HAZ suppression, higher aspect ratios, and more uniform microchannels compared to static-water immersion and direct-writing methods. This OF-LIPMM direction is expected to influence next-generation LIPMM system design for microfluidic and optical component fabrication. The study is categorized under Academic Literature in PatSnap Eureka retrieved records.
LIPMM Dielectric-Fluid vs. Gas-Phase Ambient Plasma: Key Differences
Click any row to explore further.
| Dimension | Dielectric-Fluid LIPMM (Northwestern University) | Gas-Phase Ambient Plasma (Caterpillar Inc.) |
|---|---|---|
| Plasma Generation Medium | Dielectric fluid (typically water or oil) immersing the workpiece or delivered onto surface | Ambient gas atmosphere surrounding the workpiece; no liquid medium required |
| Laser Pulse Parameters | Pulsed laser focused into fluid at focal point; specific pulse parameters per system design | Sub-picosecond pulses (≤1 ps), pulse energy ≥50–100 µJ to ionize ambient gas molecules |
| HAZ Suppression | High — fluid acts as coolant and plasma confinement medium, limiting thermal damage to substrate | Lower than fluid-immersion variants; less HAZ suppression without liquid cooling |
| Operating Environment | Requires fluid delivery system; workpiece must be compatible with immersion in dielectric fluid | Compatible with dry industrial environments and open-air workstation configurations |
| Patent Status (this dataset) | 2020 US continuation is the sole active dielectric-fluid LIPMM patent in this dataset; 2015 and 2016 filings inactive | All 3 Caterpillar filings (2004–2008, US and EP) are listed as inactive in this dataset |
| Key Filing Jurisdictions | US (3 filings, 2015–2020) | US (2 filings, 2004–2005) and EP (1 filing, 2004; 1 filing, 2008) |
| Primary Application Focus | Hard and brittle materials; single-crystal silicon; MEMS/semiconductor; optical devices | Hard material machining in ambient industrial environments; consistent with automotive/fuel injector components |
| Government / External Support | NSF award CMMI-0969776 and Korea’s KIMM institute acknowledged in 2016 filing | No external funding acknowledged in dataset records |
Frequently Asked Questions: Laser Induced Plasma Micromachining
In LIPMM, a pulsed laser is focused into a dielectric fluid (typically water or oil) adjacent to the workpiece, generating a localized plasma at the focal point. This plasma — not the photon beam itself — removes material from the workpiece surface through mechanical shock and thermochemical action, resulting in dramatically reduced heat-affected zones compared to conventional laser ablation.
Gas-phase LIPMM, as described in Caterpillar Inc.’s patents (2004–2008), uses ultra-short laser pulses (≤1 ps, ≥50–100 µJ) directed at the target in ambient atmosphere to ionize surrounding gas molecules and form a plasma. It does not require a dielectric fluid, making it more compatible with dry industrial environments, but it offers less HAZ suppression than fluid-immersion variants.
In this dataset, the most active current filers are MIT (2 active filings, 2024), Beihang University (2 active CN filings, 2021–2023), the Corporation for National Research Initiatives (2 active US filings), Purdue Research Foundation (2 active US filings, 2014–2016), and the Ningbo Institute of Materials Technology, Chinese Academy of Sciences (1 active CN filing, 2021). All Caterpillar filings are inactive, and Northwestern University’s 2020 US continuation is its sole active patent in this dataset.
LAMPE (Laser-Assisted Material Phase-Change and Expulsion) is a variant described in MIT’s 2024 US and CA patents. Unlike conventional LIPMM which uses plasma as the machining agent, LAMPE tunes pulsed laser parameters to melt (not vaporize) material and eject it in liquid phase. Post-process electro-polishing removes burrs, and the process is designed for integration with MEMS multi-lamina stack assembly (the MALL process).
According to this dataset, the main application domains are: MEMS/NEMS and semiconductor fabrication (Northwestern University, MIT, Corporation for National Research Initiatives), biomedical implant surface preparation (Beihang University, 2021–2023 CN patents), automotive and industrial components (Caterpillar Inc., Purdue Research Foundation), and microfluidic channel fabrication (referenced in 2023 literature on OF-LIPMM and polymer microfluidic prototyping).
US jurisdiction dominates foundational and mid-generation LIPMM IP, with Northwestern University, Caterpillar Inc., Corporation for National Research Initiatives, MIT, and Purdue all filing in the US. The EP filing by Caterpillar (2004/2008) is the only European jurisdiction entry in this dataset. China is the most active recent jurisdiction, with the Chinese Academy of Sciences and Beihang University producing active CN patents from 2021–2023, and Xi’an Zhongke filing a monitoring system patent in 2025.
Data and insights on this page are based on a limited patent and literature dataset and are for reference only. Figures may not represent the complete technology landscape.