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Laser Lighting Thermal Management Patent Snapshot

Laser Lighting Thermal Management Patent Snapshot
Evidence Snapshot
Laser Lighting Thermal Management Patent Snapshot in 2026

This is a small, China-dominated field with 34 patent families in scope; Supervision Laser Tech (Suzhou) holds the lead position, and the competitive structure is fragmented below the top tier. Activity peaked around 2020 and has eased since, placing the field in a post-peak phase where strategic white space remains in active-cooling and positioning-integrated branches.

34
Patent families in scope
35%
Top visible applicants share
-40%
3-yr filing growth (lag-adj.)
China
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

Supervision Laser Tech leads a fragmented, China-centric field

Supervision Laser Tech Suzhou Co Ltd holds the top position with 5 patent records, ahead of a cluster of filers each holding 2–3 patent records, including EINS TECH, the Xinyi Xiyi Advanced Materials Research Institute of Industrial Technology, Sichuan Changhong Electric, and Beijing Zhongxing Xunda Tech.

The top five filers account for 35% of the combined total among the ranked applicants visible in this query, indicating moderate concentration at the very top but a long tail of single-record contributors — roughly half the ranked applicants hold only one patent record each.

Leading applicants
#ApplicantPatent recordsShare
1Supervision Laser Tech Suzhou Co Ltd5
2EINS TECH3
3Xinyi Xiyi Advanced Materials Research Institute of Industrial Technology3
4Sichuan Changhong Electric Co Ltd2
5Beijing Zhongxing Xunda Technology Co Ltd2
6NINGBO INST OF MATERIALS TECH & ENG CHINESE ACAD O…2
7Shenzhen SNS Quickpcb Co Ltd2
8Jing Lei Technology (Zhejiang Changxing) Co Ltd2
9Kyocera SLD Laser Inc.2
10Institute of Semiconductors, Chinese Academy of Sciences1
#ApplicantPatent recordsShare
11Guangzhou Aopuda Optoelectronics Technology Co Ltd1
12Xiamen University1
13Yunnan Open University1
14Shanghai Aviation Electric Co Ltd1
15Yangzhou Ciguang Optoelectronics Co Ltd1
16Guangmechatronics (Guangzhou) Technology Research Institute Co Ltd1
17Weifang Lanhuo Optoelectronics Technology Co Ltd1
18Wuxi Lumisource Technologies Co Ltd1
19FOSHAN ELECTRICAL & LIGHTING1
20HUAZHONG UNIV OF SCI & TECH1
↗ Hover a row · click a company to ask Eureka

Supervision Laser Tech’s lead, built on F21V (lighting device components) filings, reflects a product-engineering orientation focused on heat-dissipation integration within the luminaire itself. No single player has yet established an insurmountable position, leaving the assignee snapshot genuinely open.

Filing counts for 20232025 are likely under-represented due to standard patent-publication lag of 18–24 months; the apparent recent decline should not be read as a definitive drop in inventive activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Filing activity peaked in 2020; lighting-component IPC classes dominate the technology mix

The annual filing trend and IPC class breakdown together show a field that expanded quickly between 2018 and 2022 and is now consolidating, with thermal-management innovation concentrated in luminaire-level component engineering rather than standalone cooling-system design.

Annual filing trend

Filings rose from 2 in 2018 to a peak of 8 in 2020, held near that level in 2022, then contracted. Counts for 2023 onward reflect publication lag and should be treated as minimums rather than final totals.

Annual filing trendAnnual values from 2017 to 2026, peaking at 8 in 2020.02017220187201982020520218202232023120240202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

F21V (lighting device components) is visible in, reflecting heat-sink and optic-integration patents filed at the fixture level. H01S (lasers and stimulated emission) and F25B/F25D (refrigeration and active cooling) together represent a smaller but technically distinct cluster, suggesting that active thermal-management approaches remain a minority route.

Technology compositionF21V · Lighting device components leads with 35; F21Y · Light-source form (index) 15.F21V · Lighting device c…35F21Y · Light-source form…15F21S · Non-portable ligh…13F21K · Light sources (no…12H01S · Lasers & stimulat…9F21W · Lighting use (ind…5F25B · Refrigeration & h…3F25D · Refrigerators & c…2↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20050254537A1Published 2005-11-17

High power semiconductor laser lighting device

Eins OE-TECH CO., LTD.

A high power semiconductor laser lighting device has a housing, a fan module arranged in an exhaust hole in the housing, a base connected to the bottom wall of the housing and disposed on a side of the fan module, and a semiconductor laser constant-temperature module. The base has a driving unit with at least one high power electronic component connected to… (excerpt from the patent abstract)

High power semiconductor laser lighting device — patent drawingHigh power semiconductor laser lighting device — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1Integrated laser lighting and lidar system44
2High power semiconductor laser lighting device26
3Integrated laser lighting and LIDAR system22
4Vacuum laser constant temperature device16
5一种透射式激光照明系统4
6一种荧光模组及激光照明系统4
7激光照明设备4
8一种高亮度激光照明装置2

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Supervision Laser Tech Suzhou Co Ltd

Supervision Laser Tech Suzhou Co Ltd

Holding 5 patent records — the highest count in the ranking — Supervision Laser Tech’s portfolio is concentrated in F21V 29 (lighting device thermal components), F21V 9 (optical components), and F21V 7 (reflectors), indicating a system-integration approach to thermal management within the luminaire enclosure. No momentum data for this applicant is available in the current evidence set, suggesting an established rather than accelerating filing pace.

patent records: 5
Challenger · EINS TECH

EINS TECH

With 3 patent records, EINS TECH is technically differentiated from all other ranked applicants by virtue of its focus on H01S 5 (semiconductor laser emission), F25B 21 (thermoelectric refrigeration), and F25D 23 (cooling enclosures) — the only filer combining laser-source and active-cooling IPC classes. This positions EINS TECH as the primary incumbent in the active thermal-regulation sub-space. No prior-period filings are recorded in the momentum data, consistent with a focused recent entry.

patent records: 3
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Xinyi Xiyi Advanced Materials Research Institute of Industrial TechnologyKyocera SLD Laser Inc.+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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