Laser Powder Bed Fusion & Binder Jetting Patent Landscape
Laser Powder Bed Fusion & Binder Jetting Patent Landscape in 2026
The laser powder bed fusion and binder jetting IP field is in an active growth phase, with filings more than doubling over the recent window and the United States anchoring the dominant filing jurisdiction. RTX Corp and Lawrence Livermore National Security lead a moderately concentrated field where aerospace primes, national labs, and Chinese universities are all active.
RTX Corp and Lawrence Livermore lead a moderately concentrated field
RTX Corp holds the top position with 21 patent families, followed closely by Lawrence Livermore National Security LLC with 20 patent families — a near-tie at the very top of the ranking. The French Commissariat à l’Énergie Atomique (CEA) ranks third with 9 patent families, and General Electric Co fourth with 8, establishing a clear two-tier structure.
The top five filers account for 30% of the combined output of the hundred largest filers, indicating moderate concentration rather than a winner-take-all dynamic. There is a meaningful gap between the top two applicants and the rest of the field, but the mid-tier — including Hamilton Sundstrand, South. China University of Technology, The Boeing Co, and Nanjing University of Science and Technology — remains competitive and diverse.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | RTX Corp | 21 | |
| 2 | Lawrence Livermore National Security LLC | 20 | |
| 3 | Commissariat à l’Énergie Atomique et aux Énergies Alternatives (CEA) | 9 | |
| 4 | General Electric Company | 8 | |
| 5 | Hamilton Sundstrand Corporation | 7 | |
| 6 | South China University of Technology | 6 | |
| 7 | The Boeing Company | 6 | |
| 8 | NANJING UNIV OF SCI & TECH | 6 | |
| 9 | VTT Technical Research Centre of Finland Ltd | 5 | |
| 10 | Northrop Grumman Systems Corporation | 5 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | Edison Welding Institute Inc | 4 | |
| 12 | Safran Helicopter Engines | 3 | |
| 13 | Xi’an Jiaotong University | 3 | |
| 14 | Shanghai Jiao Tong University | 3 | |
| 15 | NANJING UNIV OF AERONAUTICS & ASTRONAUTICS | 3 | |
| 16 | Guangdong Huayi Sanitary Ware Industrial Co Ltd | 3 | |
| 17 | Université Catholique de Louvain | 3 | |
| 18 | HUAZHONG UNIV OF SCI & TECH | 3 | |
| 19 | Board of Regents, The University of Texas System | 3 | |
| 20 | Nanyang Technological University | 2 |
RTX Corp’s and Lawrence Livermore’s parallel leadership positions suggest that both defense-contractor product development and government-funded research are co-driving the field’s frontier. New entrants in the recent period — including Northrop Grumman Systems Corp and the CEA — indicate that the competitive landscape is still being shaped.
The most recent 18–24 months of filing data are subject to publication lag and will be revised upward as applications are published; the 2025–2026 data points should be treated as provisional minimums. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Filings have more than doubled over the recent window; process and materials classes dominate
The annual filing trend reveals a field transitioning from early-stage to sustained growth, while the technology composition shows heavy concentration in core additive manufacturing and powder metallurgy classes, with several adjacent branches receiving relatively sparse coverage.
Annual filing trend
Annual filings grew from 5 in 2017 to a recorded high of 52 in 2024, representing 116% growth over the recent window. The lifecycle evidence confirms filings are still rising; the apparent drop in 2025 and near-zero 2026 figures reflect publication lag rather than a real decline and should not be read as a reversal.
↗ Hover for values · click a bar to ask EurekaTechnology composition
B33Y (Additive manufacturing / 3D printing) and B22F (Powder metallurgy) are by far the most populated classes, consistent with the core process and feedstock focus of the field. Alloy composition (C22C), plastics shaping (B29C), and welding/brazing (B23K) form a secondary tier, while digital processing, AI, and materials-analysis branches each have only a handful of records — signaling that software-integrated and data-driven aspects of the process remain relatively open.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Off-axis laser beam measurement for laser powder b…
Disclosed herein is a laser beam measurement system that includes a beam measurement device, a positioning apparatus, and a control system. The beam measurement device can include an imager and a plurality of optical elements configured to form an optical path to the imager within the beam measurement device. The positioning apparatus is configured to… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Method and system for powder bed fusion additive m… | 43 |
| 2 | 一种复合材料和结构功能的金属骨植入物的制造方法 | 20 |
| 3 | 一种激光粉末床熔融成形件缺陷在线监测方法 | 14 |
| 4 | Control of solidification in laser powder bed fusi… | 14 |
| 5 | Laser powder bed fusion additive manufacturing in-… | 13 |
| 6 | Two-color high speed thermal imaging system for la… | 13 |
| 7 | Aluminium alloy and process for additive manufactu… | 9 |
| 8 | Method for control of solidification in laser powd… | 9 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the field’s structure means for R&D investment decisions
The combination of a growth-stage lifecycle, moderate concentration, active cross-sector collaboration, and a US-led but globally distributed jurisdiction profile shapes both the opportunity and the risk for new entrants and incumbents alike.
Active growth stage — not yet mature
The field carries a Growth lifecycle designation, with annual filings still rising and the recent-window growth rate at 116%. This means foundational process and materials patents are still being filed, not just incremental improvements, and freedom-to-operate risk is increasing. R&D teams should monitor new filings closely and consider building defensive positions early, before the field enters a consolidation phase.
Growth stageModerate concentration with an open mid-tier
The top five filers account for 30% of the hundred largest filers’ combined output — concentrated enough that the top players set norms, but open enough that mid-tier actors can still establish differentiated positions. The near-tie between RTX Corp and Lawrence Livermore at the top, combined with multiple new entrants in the recent period, suggests that leadership has not been definitively locked in and that well-targeted filings can be strategically meaningful.
Open mid-tierIndustry-university co-filing is emerging
The most active co-filing pair identified is South China University of Technology with Guangdong Huayi Sanitary Ware Industrial Co Ltd (3 joint patent families), indicating technology transfer from academic research to industrial application in the ceramics/sanitary-ware space. Lawrence Livermore National Security LLC and Seurat Technologies Inc have co-filed 2 patent families, linking a national lab to a dedicated metal AM startup. These collaborations signal that the ecosystem is beginning to bridge lab-scale innovation and commercial deployment.
Co-filing activeUS leads; China and EPO are significant secondary theatres
The United States is the primary filing jurisdiction, followed by China and Europe (EPO). WIPO PCT filings indicate a meaningful share of applicants are seeking international protection beyond their home market. India ranks fifth by patent records, suggesting emerging manufacturing interest there. Japan and South Korea — historically strong in manufacturing IP — remain underrepresented relative to their industrial scale, which may reflect delayed entry or alternative protection strategies.
US-led, globally distributedGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| South China University of Technology | Guangdong Huayi Sanitary Ware Industrial Co Ltd | 3 |
| Lawrence Livermore National Security LLC | Seurat Technologies Inc | 2 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
RTX Corp and Lawrence Livermore lead, with diverging recent momentum
The two top filers share near-equal portfolio sizes but have opposite recent-period trajectories — RTX Corp has surged in as a new entrant in the recent window while Lawrence Livermore’s recent filing activity has declined sharply, suggesting a shift from lab-driven to industrial-driven leadership.
RTX Corp
RTX Corp holds the largest portfolio at 21 patent families and is a new entrant in the recent filing window, with 15 recent patent families — signaling rapid, deliberate portfolio building rather than legacy accumulation. Its technology focus spans powder metallurgy process (B22F 10), additive manufacturing methods (B33Y 10), and monitoring/control (B33Y 50), consistent with aerospace component production and qualification goals.
patent families: 21Lawrence Livermore National Security LLC
Lawrence Livermore National Security LLC is the second-largest holder with 20 patent families, but its recent filing trend shows a steep decline (down 87% versus the prior period), suggesting that its foundational research wave has crested. Its portfolio is concentrated entirely in additive manufacturing methods and apparatus (B33Y 10, B33Y 30, B33Y 50), reflecting a process-science rather than application-engineering orientation. Its co-filing relationship with Seurat Technologies Inc points to ongoing commercialization pathways.
patent families: 20| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| RTX Corp | 15 | ▲ new entrant |
| Lawrence Livermore National Security LLC | 2 | ▼ -87% |
| Commissariat à l’Énergie Atomique et aux Énergies Alternatives (CEA) | 9 | ▲ new entrant |
| The Boeing Company | 2 | ▲ new entrant |
| Hamilton Sundstrand Corporation | 2 | ▲ new entrant |
| Nanjing University of Science and Technology | 1 | ▲ new entrant |
| South China University of Technology | 3 | ▲ new entrant |
| Northrop Grumman Systems Corporation | 5 | ▲ new entrant |
Under-served adjacent branches worth monitoring
Several IPC classes adjacent to the dominant B33Y and B22F core have sparse coverage relative to their technical relevance to laser powder bed fusion and binder jetting, representing areas where targeted filings could establish early positions.
G06F · Electric digital data processing
With only 7 patent records in this branch, digital process control, simulation, and data pipeline software for laser powder bed fusion remains sparsely covered relative to the process-physics core. As machine learning-based defect detection and closed-loop control become commercially critical — evidenced by top-cited patents on in-process monitoring and solidification control — the software infrastructure layer is a plausible area where targeted IP development could establish durable positions. Entry paths include process simulation tools, digital twin frameworks, and data acquisition architectures.
Search this in Eureka →C22F · Non-ferrous metal treatment
C22F (non-ferrous metal treatment, including post-build heat treatment and property modification) carries only 13 patent records against 175 in the core B22F powder metallurgy branch — a relative gap given that post-processing heat treatment is a standard step in qualifying L-PBF parts for aerospace and medical use. This branch is sparsely covered and has clear technical value for alloy performance optimization. Entry is feasible for organizations already active in alloy development (C22C) or with materials characterization capability (G01N).
Search this in Eureka →How leaders differ by technology route emphasis
Strength of each leader across the main technology routes.
| Player | B33Y 10 · Additive manufacturing (3D printing) | B22F 10 · Powder metallurgy | B33Y 50 · Additive manufacturing (3D printing) | B33Y 30 · Additive manufacturing (3D printing) | B22F 12 · Powder metallurgy |
|---|---|---|---|---|---|
| Lawrence Livermore National Security LLC | Strong · 20 | Moderate · 9 | Strong · 15 | Strong · 18 | Moderate · 9 |
| RTX Corp | Strong · 15 | Strong · 15 | Strong · 14 | Strong · 8 | Strong · 8 |
| The Boeing Company | Strong · 6 | Strong · 6 | Moderate · 3 | Strong · 6 | Strong · 6 |
| Commissariat à l’Énergie Atomique et aux Énergies Alternatives (CEA) | Strong · 9 | Strong · 9 | Strong · 5 | Absent | Absent |
| Nanjing University of Science and Technology | Strong · 6 | Strong · 5 | Strong · 5 | Absent | Absent |
| Northrop Grumman Systems Corporation | Strong · 5 | Strong · 5 | Absent | Absent | Strong · 5 |
| Hamilton Sundstrand Corporation | Strong · 6 | Absent | Absent | Strong · 6 | Moderate · 2 |
Frequently asked questions
The analysis covers 201 patent families in laser powder bed fusion and binder jetting globally.
RTX Corp leads with 21 patent families, closely followed by Lawrence Livermore National Security LLC with 20 patent families. The top five filers together account for 30% of the combined output of the hundred largest filers.
The field is classified as Growth stage. Annual filings have risen substantially, with 116% growth over the recent window, and the lifecycle evidence indicates filings are still rising. Recent data points (2025–2026) are understated due to publication lag.
The United States is the leading jurisdiction, followed by China and Europe (EPO). WIPO PCT filings indicate significant international protection activity. India is a notable secondary market, while Japan and South Korea remain comparatively underrepresented.
Yes. South China University of Technology and Guangdong Huayi Sanitary Ware Industrial Co Ltd have co-filed 3 patent families, and Lawrence Livermore National Security LLC and Seurat Technologies Inc have co-filed 2 patent families — the most active co-filing relationships identified in the corpus.
The most notable sparse adjacent branches are G06F (electric digital data processing, 7 patent records) and C22F (non-ferrous metal treatment, 13 patent records), both of which have clear technical relevance to process control and post-build qualification respectively. B23P (metal working) and B23K (welding, soldering and brazing) are also relatively sparse.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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